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Toshiba Personal Computer TECRA M1 Maintenance Manual TOSHIBA CORPORATION File Number 960-436.
ii TECRA M1 Maintenance Manual (960-436) Copyright © 2003 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the inform ation contained herein.
TECRA M1 Maintenance Manual (960-436) iii Preface This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M1. The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
iv TECRA M1 Maintenance Manual (960-436) The manual is divided into the following parts: Chapter 1 Hardware Overview describes the TECRA M1 system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems.
TECRA M1 Maintenance Manual (960-436) v Conventions This manual uses the following formats to describe, identify, and highlight term s and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition.
vi TECRA M1 Maintenance Manual (960-436).
TECRA M1 Maintenance Manual (960-436) vii Table of Contents Chapter 1 Hardware Overview 1.1 Features ................................................................................................................... ... 1-1 1.2 System Unit Block Diagram .
viii TECRA M1 Maintenance Manual (960-436) 2.14 Wireless LAN Troubleshooting ............................................................................... 2-54 2.15 Sound Troubleshooting ..............................................................
TECRA M1 Maintenance Manual (960-436) ix Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ................
x TECRA M1 Maintenance Manual (960-436) Chapter 4 Replacement Procedures 4.1 General .................................................................................................................... ... 4-1 4.2 Battery Pack ........................
TECRA M1 Maintenance Manual (960-436) xi Appendices Appendix A Handling the LCD Module ........................................................................... A-1 Appendix B Board Layout ............................................................
xii TECRA M1 Maintenance Manual (960-436).
Chapter 1 Hardware Overview.
1 Hardware Overview 1-ii TECRA M1 Maintenance Manual (960-436).
1 Hardware Overview Chapter 1 Contents 1.1 Features................................................................................................................... ....1-1 1.2 System Unit Block Diagram ..............................................
1 Hardware Overview 1-iv TECRA M1 Maintenance Manual (960-436) Figures Figure 1-1 Front of the computer .....................................................................................1-7 Figure 1-2 System un it configuration.....................
1.1 Features 1 Hardware Overview 1 Features 1.1 Features The Toshiba TECRA M1 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Sem iconductor (CMOS) technology extensively to provide compact size, minim um weight, low power usage and high reliability.
1 Hardware Overview 1.1 Features Built-in HDD The computer has a 2.5-inch HDD. The following capacities are available. 30/40/50/60GB • USB FDD A 3.5-inch FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks. The FDD is connected to an external USB port.
1.1 Features 1 Hardware Overview Display The display comes in the following three types: 14.1” XGA-TFT color display, resolution 1,024 × 768, 16M colors • • 14.
1 Hardware Overview 1.1 Features External monitor port The port enables connection of an external monitor, which is recognized automatically by Video Electronics Standards Association (VESA) Display Data Channel (DDC) 2B compatible functions.
1.1 Features 1 Hardware Overview Infrared port The infrared port is compatible with Fast InfraRed (FIR) standards enabling cableless 4 Mbps, 1.152 Mbps, 115.2 kbps, 57.6 kbps, 38.4 kbps, 19.2 kbps or 9.6 kbps data transfer with Infrared Data Association (IrDA) 1.
1 Hardware Overview 1.1 Features Bluetooth (BTO) The computer is equipped with Bluetooth (V1.1) comm unications standards enable wireless connection between electronic devices such as computers and printers. Mini PCI Card slot (1 slot, BTO) In some models built to order (BTO), a Mini PCI Card with wireless LAN functions is available.
1.1 Features 1 Hardware Overview The front of the computer is shown in figure 1-1. Figure 1-1 Front of the computer TECRA M1 Maintenance Manual (960-436) 1-7.
1 Hardware Overview 1.1 Features The system unit configuration is shown in figure 1-2. MDC Figure 1-2 System unit configuration 1-8 TECRA M1 Maintenance Manual (960-436).
1.2 System Unit Block Diagram 1 Hardware Overview 1.2 System Unit Block Diagram Figure 1-3 is a block diagram of the system unit. 1.3/1.4/1. 5 /1.6GHz HDD 9.
1 Hardware Overview 1.2 System Unit Block Diagram The system unit is composed of the following m ajor components: Processor • Intel Banias Processor 1.30GHz – Processor core speed: 1.30GHz (Performance Mode at 1.35V) and 1.20GHz (Battery Optimized Mode at 0.
1.2 System Unit Block Diagram 1 Hardware Overview Memory Two BTO-compatible expansion mem ory slots are provided. Expansion up to 2GB (2,048MB) is available.
1 Hardware Overview 1.2 System Unit Block Diagram – Internal LAN Controller (WfM2.0) – 421-ball 31 × 31mm BGA Package PC Card Controller Gate Array • One YEBISU3S gate array is used. • This gate array has the following functions and components.
1.2 System Unit Block Diagram 1 Hardware Overview VGA Controller One Trident XP4-MCM chip is used. The video controller incorporates graphics accelerator, video accelerator. • Internal VRAM, 32MB DDR 250MHz (64MB is also supported.) • Connected to AGP bus R2.
1 Hardware Overview 1.2 System Unit Block Diagram PSC (Power Supply Controller) • One TMP87PM48U chip is used. • This controller controls the power sources. RS232 Driver • One MAXIM3243 chip is used. • This driver converts signals for interface with external equipment.
1.2 System Unit Block Diagram 1 Hardware Overview Internal LAN Controller • One MAC incorporated with ICH4-M and PHY (Kinnereth-R 182562EP or Kenai32N) are used for the internal chip, and are connected with RJ11/RJ45 combo connector.
1 Hardware Overview 1.3 3.5-inch Floppy Disk Drive (USB External) 1.3 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD, 1.2MB (formatted) and 1.44MB (formatted) 2HD disks.
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview 1.4 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-rem ovable 2.5-inch magnetic disk and mini-W inchester type magnetic heads. The computer supports a 30GB, 40GB, 50GB and 60GB HDD.
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD specifications (2/3) Specifications Items HITACHI G8BC0000F310 HITACHI G8BC00009110 Storage size (formatted) 30GB 40GB Speed (RPM) 4,200 5,400 Data transfer speed (Mbits/s) 22.1 – 42.
1.5 CD-ROM Drive 1 Hardware Overview 1.5 CD-ROM Drive The CD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs. They provide high-performance, twenty-four-speed plays on a maxim um (reads 3,600 KB per second). The CD-ROM drive is shown in figure 1-6.
1 Hardware Overview 1.6 DVD-ROM Drive 1.6 DVD-ROM Drive The DVD-ROM drive accommodates either 12cm (4.72-inch) or 8cm (3.15-inch) DVDs. This drive plays DVDs at maximum 8-speed and reads CDs at maximum 24-speed. The DVD-ROM drive is shown in figure 1-7.
1.6 DVD-ROM Drive 1 Hardware Overview Table 1-4 DVD-ROM drive specifications (2/2) HITACHI G8CC00015410 Item DVD-ROM mode CD-ROM mode ATAPI Burst (Mbytes/s) 33.
1 Hardware Overview 1.7 CD-RW/DVD-ROM Drive 1.7 CD-RW/DVD-ROM Drive The CD-RW/DVD-ROM drive accomm odates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs, CD-R/RW and DVDs. It is a high-perfor mance drive that reads CD-R at m aximum 24- speed and reads DVD-ROM at maximum 8-speed.
1.7 CD-RW/DVD-ROM Drive 1 Hardware Overview Table 1-5 CD-RW/DVD-ROM drive specifications (2/3) Specifications Item Panasonic G8CC00010410 ATAPI Burst (Mbytes/s) 16.6 (PIO Mode 4, DMA Mode 2) 33.3 (Ultra DMA Mode2) CD-ROM 130 Average access time (msec.
1 Hardware Overview 1.8 DVD Multi Drive 1.8 DVD Multi Drive The DVD Multi drive is capable of driving either 12cm (4.72-inch) or 8cm (3.15-inch) DVD and CD without using an adaptor. This drive plays DVDs at maximum 8-speed, reads CDs at maximum 24-speed, writes CD-R at maximum 8-speed, and writes CD-RW at maximum 4- speed.
1.8 DVD Multi Drive 1 Hardware Overview Table 1-6 DVD Multi drive specifications (2/2) TEAC Item DVD-ROM mode CD-ROM mode CD-R/CD-RW (Write) ATAPI Burst (Mbytes/s) 33.
1 Hardware Overview 1.9 Keyboard 1.9 Keyboard The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to mem brane connector on the system board and controlled by the keyboard controller.
1.10 TFT Color Display 1 Hardware Overview 1.10 TFT Color Display The TFT color display consists of 14.1-in ch XGA/SXGA+ LCD module and FL inverter board. 1.10.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution.
1 Hardware Overview 1.10 TFT Color Display Table 1-7 LCD module specifications (2/2) Specifications Item 14.1-inch SXGA+ TFT (VF2074P01) Number of Dots 1,400 (W) x 1,050 (H) Dot spacing (mm) 0.204 (H) x 0.204 (V) Display range (mm) 285.6 (H) x 214.2 (V) 1.
1.11 Power Supply 1 Hardware Overview 1.11 Power Supply The power supply supplies many different voltages to the system board and perform s the following functions: 1. Checks power input to determine: • Whether the AC adaptor is connected to the com puter • Whether the battery pack is installed and supplying power 2.
1 Hardware Overview 1.11 Power Supply Table 1-9 Power supply output rating Power supplied Yes/No Device Name DC Volta ge (V) Pow er off Suspen d Pow er off Boot mode No battery *1) CPU PPV 0.748-1.468 No No No MCH-M 1R2-P1V 1.2 No No No CPU, MCH-M, ICH4-M PTV 1.
1.11 Power Supply 1 Hardware Overview *1) Both Main battery and Sub Battery are empty, and only RTC Battery is charged. *2) CD-ROM or DVD-ROM drive Unit is attached.
1 Hardware Overview 1.12 Batteries 1.12 Batteries The computer has three types of batteries as follows: Main battery pack RTC battery Secondary battery pack (Optional Slim Select Bay Module) The battery specifications are listed in Table 1-10.
1.12 Batteries 1 Hardware Overview 1.12.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer.
1 Hardware Overview 1.12 Batteries 1-34 TECRA M1 Maintenance Manual (960-436) 1.12.3 RTC battery The RTC battery provides power to keep the current date, time and other setup information in memory while the com puter is turned off. Table 1-12 lists the charging time and data preservation period of the RTC battery.
Chapter 2 Troubleshooting Procedures.
2 Troubleshooting Procedures 2-ii TECRA M1 Maintenance Manual (960-436).
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart ...........................................
2 Troubleshooting Procedures 2.9 CD-ROM Drive Troubleshooting............................................................................ 2-43 Procedure 1 Diagnostic Test Program Execution Check .............................. 2-43 Procedure 2 Connector Check and Replacement Check .
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart................................................................................. 2-3 Figure 2-2 Printer port LED ................................................................
2 Troubleshooting Procedures 2-vi TECRA M1 Maintenance Manual (960-436).
2.1 Troubleshooting 2 Troubleshooting Procedures 2 2.1 Troubleshooting Chapter 2 describes how to dete rmine if a Field R eplaceable Un it (FRU) in the computer is causing the computer to malfunc tion. The FRUs covered are: 1. System Board 6. CD-ROM Drive 9.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart 2.2 Troubleshooting Flowchart Use the flowchart in figure 2-1 as a guide fo r determ ining which troubleshooting procedures to execute.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (1/2) TECRA M1 Maintenance Man ual (960-436) 2-3.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Keyboard/T ouch pad Figure 2-1 Troubleshooting flowchart (2/2) 2-4 TECRA M1 Main tenance Manual (960-4 36).
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an error, the prob lem may be intermittent. The Running Test program should be executed severa l times to isolate the problem .
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 2.3 Power Supply Troubleshooting The power supply controls many functions and components. To determine if the power supply is functioning properly, star t with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 2 Error Code Check If the power supply microprocessor detects a malfunction, it indicates the error code as shown below. The error code begins with the least significan t digit. Error code Error code Where Error occurs 1*h Adaptor (AC Adaptor, DS) AC Adaptor is not connected.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Check 1 Compare the patterns in the hexadeci mal error code to the tables below. DC IN Error code Meaning 10h AC Adaptor output voltage is over 16.5V. 11h Common Dock voltage is over 16.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures S3V output Error code Meaning 40h S3V voltage is 3.14V or less wh en the computer is powered on/off. 45h S3V voltage is 3.14V or less when the computer is booting up. (CV support) 1R5-C1V output Error code Meaning 50h 1R5-C1V voltage is over 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting PGV output Error code Meaning 80h PGV voltage is over 1.92V when the computer is powered on/off. 81h PGV voltage is 0.68V or less when the computer is powered on. 82h PGV voltage is 0.68V or less when the computer is booting up.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures PTV output Error code Meaning C0h PTV voltage is over 1.26V when the computer is powered on/off. C1h PTV voltage is 0.89V or less when the computer is powered on. C2h PTV voltage is 0.89V or less when the computer is booting up.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Check 3 In the case of error code 2Xh: Make sure the battery pack is correctly insta lled in the computer. If the battery pack is correctly insta lled, go to the following step: Replace the battery pack with a new one .
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connectio n Check The power supply wiring diagram is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Disconnect the AC power cord from the wall outlet.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 4 Charge Check The power supply may not charge the batter y pack. Perform the following procedures: 1. Reinstall the battery pack. 2. Attach the AC adaptor and turn on the pow er.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 5 Replacement Check The system board processor module m ay be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures .
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting 2.4 System Board Troubleshooting This section describes how to determ ine if th e system board and CPU are defective o r not functioning properly. Start with Procedure 1 an d continue with the other procedures as instructed.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 1 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it.
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting Check 2 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) th rough (17), (24) or (25) appears, go to Procedure 5.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 2 Printer Port LED Check on Boot Mode The printer port LED displays the IRT (Initial Reliability Test) status and test status by turning lights on and off as an eight-digit bi nary value for boot mode.
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting Table 2-3 Printer port LE D boot mode status (1/8) LED Status Test item Message Register initialization for boot block .
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LE D boot mode status (2/8) LED Status Test item Message Storing key scan code Setting of TASK_1ms_TSC B5H Display .
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting Table 2-3 Printer port LE D boot mode status (3/8) LED Status Test item Message Initialization of CMOS data (1) (Boot status and IRT busy flag, the remaining bit is 0.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LE D boot mode status (4/8) LED Status Test item Message (Initialization of a device which needs initializat ion before initialization of PCI bus) Test of PIT CH2 (Check whether the spe aker gate is working properly.
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting Table 2-3 Printer port LE D boot mode status (5/8) LED Status Test item Message Check whether self test is necessary or.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LE D boot mode status (6/8) LED Status Test item Message Storing CMOS error status in IRT error status buffer Start.
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting Table 2-3 Printer port LE D boot mode status (7/8) LED Status Test item Message Getting keys pressed during the IRT Sto.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-3 Printer port LE D boot mode status (8/8) LED Status Test item Message Setting the clock speed of CPU to the appointed valu e by .
2 Troubleshooting Procedures 2.5 FDD TroubleshootingSystem Board Troubleshooting Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Di agnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more inform ation on how to perform these tests.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 4 Replacement Check The system board connectors may be disconnect ed. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform Check 1.
2 Troubleshooting Procedures 2.5 FDD TroubleshootingFDD Troubleshooting 2.5 FDD Troubleshooting This section describes how to determ ine if the FDD is functioning properly. Perform the steps below starting with Procedure 1 and con tinuing with the other pr ocedures as required.
2.5 FDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more inform ation about th e diagnostics test procedures.
2 Troubleshooting Procedures 2.5 FDD Troubleshooting Procedure 3 Connector Check and Replacement Check The USB 3.5-inch FDD is connected to the System Board. Check 1 When using the USB port 0 or 1, make sure the USB FDD cable is firmly connected to PJ2033 or PJ2034 on the syst em board.
2.6 HDD Troubleshooting 2 Troubleshooting Procedures 2 2.6 HDD Troubleshooting This section describes how to determine if the HDD is functioning properly. Perform the steps below starting with Procedure 1 and con tinuing with the other pr ocedures as required.
2 Troubleshooting Proce dures 2.6 HDD Troubleshooting Procedure 2 Partition Check Insert the Toshiba MS-DOS system disk and restart the computer with U key holding down. Perform the following checks: Check 1 Type C : and press Enter . If you cannot change to dr ive C, go to Check 2.
2.6 HDD Troubleshooting 2 Troubleshooting Procedures Procedure 3 Format Check The computer’s HDD is formatted using the low level format program and the MS-DOS FORMAT program. To format the HDD, start with Check 1 below and perform the other steps as required.
2 Troubleshooting Proce dures 2.6 HDD Troubleshooting Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnos tics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more inform ation about the HDD test program.
2.6 HDD Troubleshooting 2 Troubleshooting Procedures Procedure 5 Connector Check and Replacement Check The HDD may be disconnected, or the HDD or the system board may be dam aged.
2 Troubleshooting Procedures 2.7 Keyboard and Touch pad Troubleshooting 2.7 Keyboard and Touc h pad Troubleshooting To determine if the computer’s keyboard or touch pad is functioning properly, perform the following procedures. Start with Procedure 1 an d continue with the other procedures as instructed.
2.7 Keyboard and Touch pad Troubleshooting 2 Troubleshooting Procedures Procedure 2 Connector and Replacement Check The keyboard, touch pad or sensor/switch board may be disconnected or damaged. Disassemble the computer following the steps described in C hapter 4, Replacement Procedures , and perform the following checks: 1.
2 Troubleshooting Procedures 2.7 Keyboard and Touch pad Troubleshooting Check 4 The touch pad or the touch pad cable may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures . If the problem still exists, perform Check 7.
2.8 Display Troubleshooting 2 Troubleshooting Procedures 2.8 Display Troubleshooting This section describes how to determ ine if th e computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures 2.8 Display Troubleshooting Procedure 3 Replacement Check The FL, FL inverter board, LCD module, and system board are connected to display circuits.
2.9 CD-ROM Drive Troubleshooting 2 Troubleshooting Procedures 2.9 CD-ROM Drive Troubleshooting This section describes how to determ ine if the computer’s internal CD-ROM drive is functioning properly. Perform the steps below st arting with Procedure 1 and continue with the other procedures as required.
2 Troubleshooting Procedures 2.9 CD-ROM Drive Troubleshooting Procedure 2 Connector Check and Replacement Check The CD-ROM drive is connected to the system board.
2.10 DVD-ROM, CD-RW/DVD-ROM and DVD Multi Drive Troubleshooting 2 Troubleshooting Procedures 2.10 DVD-ROM, CD-RW/DVD-ROM and DVD Multi Drive Troubleshooting This section describes how to determin e if the DVD-ROM, CD-RW/DVD-ROM or DVD Multi drive in the Slim Selec t Bay is functi oning properly.
2 Troubleshooting Procedures 2.10 DVD-ROM, CD-RW/DVD-ROM and DVD Multi Drive Troubleshooting Procedure 2 Connector Check and Replacement Check The DVD-ROM, CD-RW/DVD-ROM or DVD Multi driv e is connected to the system board. The connectors may be disconnected from the system board or may be damaged.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures 2.11 Modem Troubleshooting This section describes how to determ ine if the computer's modem is functioning properly. Perform the steps below starting with Procedure 1 and continui ng with the othe r procedures as required.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting Procedure 2 Connector Check and Replacement Check The Modem is installed as a modem daughter card (MDC). If the modem m alfunctions, there may be a bad connection between the MDC a nd the system board.
2.12 LAN Troubleshooting 2 Troubleshooting Procedures 2.12 LAN Troubleshooting This section describes how to determ ine if the computer's LAN is functioning properly.
2 Troubleshooting Procedures 2.13 Bluetooth Troubleshooting 2.13 Bluetooth Troubleshooting This section describes how to determ ine if the computer's Bluetooth is functioning properly. Perform the steps below starting with Procedure 1 and continui ng with the other procedures as required.
2.13 Bluetooth Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antennas' Connection Check The Bluetooth function wiring diagram is shown below: Any of the connections may be disconnected.
2 Troubleshooting Procedures 2.13 Bluetooth Troubleshooting Procedure 3 Antenna Check Check 1 Use an antenna test cable to check the antennas' connection. Follow the steps below: 1. Remove the Bluetooth slot cover an d lift it off . Refer to Chapter 4, Replacement Procedures , for detailed steps of disassembling.
2.13 Bluetooth Troubleshooting 2 Troubleshooting Procedures Procedure 4 Replacem ent Check Check 1 The Bluetooth module may be def ective or dam aged. Replace the Bluetooth module with a new one following the steps in Chapter 4, Replacement Procedures .
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting 2.14 Wireless LAN Troubleshooting This section describes how to determ ine if the computer's Wireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.14 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antennas' Connection Check The wireless LAN wiring diagram is shown below: Any of the connections may be disconnected.
2 Troubleshooting Procedures 2.14 Wireless LAN Troubleshooting Procedure 3 Antenna Check Check 1 Use an antenna test cable to check the antennas' connection. Follow the steps below: 1. Remove the wireless LAN slot cover and lift it off. Refer to Chapter 4, Replacement Procedures , for detailed steps of disassembling.
2.14 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 4 Replacem ent Check The wireless LAN board, and the system board are connected to the circuits.
2 Troubleshooting Procedures 2.15 Sound Troubleshooting 2.15 Sound Troubleshooting This section describes how to determine if the computer's sound functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.15 Sound Troubleshooting 2 Troubleshooting Procedures Procedure 2 Connector Check The sound function wiring diagram is shown below: Any of the connections may be disconnected.
2 Troubleshooting Procedures 2.15 Sound Troubleshooting Procedure 3 Replacement Check Check 1 If the stereo speakers do not sound pr operly, the right or left speaker may be defective or damaged. Replace it with a new one. If the stereo speakers still do not work properly, go to Check 5.
2.16 SD Card Slot Troubleshooting 2 Troubleshooting Procedures 2.16 SD Card Slot Troubleshooting To check if the SD card/Smart Media slot is good or no good, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows Procedure 2: Connector/Replacement Check Procedure 1 Check on Windows Insert an SD card into the sl ot.
2 Troubleshooting Procedures 2.16 SD Card Slot Troubleshooting 2-62 TECRA M1 Maintenance Man ual (960-436 ).
Chapter 3 Tests and Diagnostics.
3 Tests and Diagnostics 3-ii TECRA M1 Maintenance Manual (960-436).
3 Tests and Diagnostics Chapter 3 Contents 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test ..............................................
3 Tests and Diagnostics 3-iv TECRA M1 Maintenance Manual (960-436) 3.26.1 Function Description .......................................................................... 3-69 3.26.2 Operations ..........................................................
3.1 The Diagnostic Test 3 Tests and Diagnostics 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test program to test the functions of the computer’s hardware modules. The Diagnostic Test Program is stored on the Diagnostic Disk.
3 Tests and Diagnostics 3.1 The Diagnostic Test BLUETOOTH TEST You will need the following equipment to perform som e of the Diagnostic test programs.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Toshiba MS-DOS is required to run the DIAGNOSTICS TEST PROGRAM. To start the DIAGNOSTIC TEST PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive and turn on the computer while pressing U .
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test 2. To execute the DIAGNOSTIC TEST MENU from the DIAGNOSTICS MENU, set the highlight bar to 1 , and press Enter . The following DIAGNOSTIC TEST MENU will appear: TOSHIBA Personal Computer XXXX DIAGNOSTICS Version X.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3. Select the option you want to execute and press Enter . When “1-SYSTEM TEST” is selected, the following message will appear: SYSTEM TEST XXXXXXX XXXX DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test 5. The following message will appear: ERROR STOP : YES/NO Then, use the left or right arrow keys to move the cursor to the desired option and press Enter .
3.3 Subtest Names 3 Tests and Diagnostics 3.3 Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/3) No.
3 Tests and Diagnostics 3.3 Subtest Names Table 3-1 Subtest names (2/3) No. Test Name Subtest No. Subtest Name 7 ASYNC 01 02 03 04 06 07 Wrap around (board) Point to point (send) Point to point (recei.
3.3 Subtest Names 3 Tests and Diagnostics Table 3-1 Subtest names (3/3) No. Test Name Subtest No. Subtest Name - Bluetooth 1 2 BD_ADDR check Communication test TECRA M1 Maintenance Manual (960-436) 3-.
3 Tests and Diagnostics 3.4 System Test 3.4 System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM Checksum This subtest executes a checksum test of the BIOS ROM on the System Board.
3.4 System Test 3 Tests and Diagnostics To exit this subtest and return to the SYSTEM TEST menu, press Enter . TECRA M1 Maintenance Manual (960-436) 3-11.
3 Tests and Diagnostics 3.4 System Test Subtest 08 DMI write The following messages appear in order. When this subtest is executed. Input each information. (If you do not replace the PCB, the DMI information should not be changed.) 1. “ Enter Model Name ? ” is displayed.
3.4 System Test 3 Tests and Diagnostics Subtest 09 CPU Temperature This subtest measures the CPU temperature to see if the cooling functions of the computer are effectively working.
3 Tests and Diagnostics 3.5 Memory Test 3.5 Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter.
3.5 Memory Test 3 Tests and Diagnostics Subtest 04 Cache Memory To test the cache memory, a pass-through write-read com parison of ‘5A’ data is run repeatedly to the test area (‘7000’:‘Program’ size to ‘7000’:‘7FFF’ (32 KB)) to check the hit-miss ratio (on/off status) for CPU cache mem ory.
3 Tests and Diagnostics 3.6 Keyboard Test 3.6 Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.6 Keyboard Test 3 Tests and Diagnostics Subtest 03 PS/2 Mouse Connect Check NOTE : To execute the PS/2 mouse connect check, a PS/2 mouse must be connected to the computer before the power is turned on. This subtest checks whether a PS/2 mouse is connected or not.
3 Tests and Diagnostics 3.6 Keyboard Test < BUTTONS > < BUTTONS > 3-18 TECRA M1 Maintenance Manual (960-436).
3.6 Keyboard Test 3 Tests and Diagnostics To check only the USB mouse, follow the procedures below: Connect the USB mouse to the computer’s USB connector.
3 Tests and Diagnostics 3.7 Display Test 3.7 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Display test contains seven subtests that test the display in various modes.
3.7 Display Test 3 Tests and Diagnostics Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for each mode. Execute the test, then press Enter to change the mode. The display below appears on the screen when this subtest is executed.
3 Tests and Diagnostics 3.7 Display Test Pressing Enter changes the size of the displayed image. Pressing Enter changes the size of the displayed image in the following order: Mode 111 640*480 64K Mod.
3.7 Display Test 3 Tests and Diagnostics Subtest 05 All Dot On /Off for LCD This subtest displays an all-white screen (all dots on) for three seconds then an all-black screen (all dots off) for three seconds. Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns.
3 Tests and Diagnostics 3.8 Floppy Disk Test 3.8 Floppy Disk Test NOTE : Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. Otherwise, the contents of the floppy disk will be erased.
3.8 Floppy Disk Test 3 Tests and Diagnostics Subtest 01 Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. The start track is specified at the start of the FDD test.
3 Tests and Diagnostics 3.9 Printer Test 3.9 Printer Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The Printer Test contains three subtests that test the output of the printer connected to the computer.
3.9 Printer Test 3 Tests and Diagnostics Subtest 02 Function This subtest is for IBM compatible printers, and tests the following f unctions: Normal print Double-width print Compressed print Emphasize.
3 Tests and Diagnostics 3.10 Async Test 3.10 Async Test To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. The Async test contains two subtests that test the asynchronous communication functions.
3.10 Async Test 3 Tests and Diagnostics Subtest 03 Point to Point (receive) This subtest is used with subtest 02 described above. This subtest receives the data from the send side, then sends the received data. Subtest 04 Interrupt Test This subtest checks the Interrupt Request Level of IRQ 4, 3 and 5 from the send side.
3 Tests and Diagnostics 3.11 Hard Disk Test 3.11 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter , and follow the directions on the screen. The hard disk test contains ten subtests that test the hard disk drive functions.
3.11 Hard Disk Test 3 Tests and Diagnostics HARD DISK TEST XXXXXXX SUB-TEST : XX PASS COUNT : XXXXX ERROR COUNT :XXXXX WRITE DATA : XX READ DATA :XX ADDRESS : XXXXXX STATUS :XXX The first three digits of the ADDRESS indicate which cylinder is being tested, the fourth digit indicates the head and the last two digits indicate the sector.
3 Tests and Diagnostics 3.11 Hard Disk Test Subtest 04 Cross Talk & Peak Shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3.12 Real Timer Test 3 Tests and Diagnostics 3.12 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The real timer test contains three Subtests that test the computer’s real timer functions.
3 Tests and Diagnostics 3.12 Real Timer Test Subtest 03 Real Time Carry CAUTION : When you execute this Subtest, the current date and time are erased. This Subtest checks the real time clock increment.
3.13 NDP Test 3 Tests and Diagnostics 3.13 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3.14 Expansion Test 3 Tests and Diagnostics 3 3.14 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. The expansion test contains two subtests. NOTE: To execute this subtest, the PC card wraparound connector is required.
3 Tests and Diagnostics 3.15 CD-ROM/DVD-ROM Test 3.15 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the scree n. The CD-ROM/DVD-ROM test contains six Subtests that test the computer’s CD-ROM/DVD-ROM functions.
3.16 Wireless LAN Test (Agere) 3 Tests and Diagnostics 3.16 Wireless LAN Test (Agere) This section describes how to perform the wireless LAN transm itting-receiving test with the test program. NOTE: Use another computer (with Agere wireless LAN card) that can communicate by the wireless LAN as a reference machine to perform this test.
3 Tests and Diagnostics 3.16 Wireless LAN Test (Agere) Subtest 01 Transmit & Receive test This sub test checks transmit and receive functions. Transmit test Press 1 to select the test and press Enter in the target machine as a responder.
3.16 Wireless LAN Test (Agere) 3 Tests and Diagnostics When the machine has passed the test, “OK” m essage will appear in the test machine. Then press Enter in the target machine; the “OK” me ssage will appear also in the target machine. Press Enter to return to the main menu.
3 Tests and Diagnostics 3.16 Wireless LAN Test (Agere) Press 0 to select the test and press Enter in the target machine. The following message will appear: ############################################################## #### Wireless LAN sub system repair test VX.
3.16 Wireless LAN Test (Agere) 3 Tests and Diagnostics Subtest 02 Mac Address test This subtest reads MAC Address. If there is no problem, the “OK” message will appear. Subtest 03 Wireless LAN (WEP64/128) test This subtest reads the WEP of the wireless LAN card installed in the target machine.
3 Tests and Diagnostics 3.17 Wireless LAN Test (Atheros) 3.17 Wireless LAN Test (Atheros) This section describes how to perform the wireless LAN transm itting-receiving test with the test program. NOTE: Use another computer (with Atheros wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform this test.
3.17 Wireless LAN Test (Atheros) 3 Tests and Diagnostics Setting the responder machine NOTE: Release the write-protection of the floppy disk for the test. Insert a floppy disk containing the test program into the FDD for the responder machine and turn on the responder machine.
3 Tests and Diagnostics 3.17 Wireless LAN Test (Atheros) When the tester machine has passed the test, "OK" m essage will appear in the tester machine. Press Enter to return to the main menu. When the tester machine has not passed the test, "NG" m essage will appear in the tester machine.
3.18 Wireless LAN Test (Calexico) 3 Tests and Diagnostics 3.18 Wireless LAN Test (Calexico) This section describes how to perform the wireless LAN transm itting-receiving test with the test program. NOTE : Use another computer (with Calexico wire less LAN card) that can communicate by the wireless LAN as a reference machine to perform this test.
3 Tests and Diagnostics 3.19 Sound/Modem Test 3.19 Sound/Modem Test This section describes how to perform the Sound/Modem test with the test program . CAUTION : The system is capable of producing high volume sound. When you use a headphone, be careful to set the volume low and adjust it as necessary.
3.19 Sound/Modem Test 3 Tests and Diagnostics Subtest 01 Microphoned recording & play This subtest checks the function of the CODEC A/D D/A converter. Both the microphone and headphone terminal can be checked at the sam e time. Before executing this subtest, connect an external microphone to the computer.
3 Tests and Diagnostics 3.19 Sound/Modem Test To execute a subtest continuously, select the test number and press Enter. To exit the Sound/LAN/Modem test, remove the test program disk from the USB FDD and turn the computer off. Subtest 02 Sin Wave This subtest is executed by the load format of COM file (ADSIN.
3.19 Sound/Modem Test 3 Tests and Diagnostics Subtest 04 Modem Test (a) Select 4 to execute and press Enter . The following message will appear: ICHX MDC Test Program with Modem Sound ( PCB Interface ) Version X.
3 Tests and Diagnostics 3.20 IEEE1394 Test Program 3.20 IEEE1394 Test Program This section describes how to perform the IEEE1394 test with the test program.
3.20 IEEE1394 Test Program 3 Tests and Diagnostics Subtest 01 IEEE1394 test This program checks the data transporting between responder machine and target machine. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test.
3 Tests and Diagnostics 3.21 Bluetooth Test 3.21 Bluetooth Test This section describes how to perform the Bluetooth test program to check if the Bluetooth functions of computer are working properly.
3.21 Bluetooth Test 3 Tests and Diagnostics Subtest 01 BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter .
3 Tests and Diagnostics 3.21 Bluetooth Test If the target machine has any problem, it displays Error CODE . The following message is desplayed. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.
3.21 Bluetooth Test 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-2 Error code for Bluetooth test (BD_ADDR) (1/2) Error code Meaning 0x01 Unknown HCI Comm and.
3 Tests and Diagnostics 3.21 Bluetooth Test Table 3-2 Error code for Bluetooth test (BD_ADDR) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Val ue. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout . 0x23 LMP Error Transaction Collosion.
3.21 Bluetooth Test 3 Tests and Diagnostics When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following m essage will appear: ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.
3 Tests and Diagnostics 3.21 Bluetooth Test If the target machine has any problem, the following m essage “ INCOMPLETE ” is displayed with the Error CODE . ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.
3.21 Bluetooth Test 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-3 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code Meaning 0x01 Unknown HCI Command.
3 Tests and Diagnostics 3.21 Bluetooth Test Table 3-3 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collosion.
3.22 Error Code and Error Status Names 3 Tests and Diagnostics 3.22 Error Code and Error Status Names Table 3-4 lists the error codes and error status names for the Diagnostic Test.
3 Tests and Diagnostics 3.22 Error Code and Error Status Names Table 3-4 Error codes and error status names (2/3) Device name Error code Error status name ASYNC 01 02 04 08 10 20 40 50 60 70 80 88 DSR.
3.22 Error Code and Error Status Names 3 Tests and Diagnostics Table 3-4 Error codes and error status names (3/3) Device name Error code Error status name Expansion C1 C2 C3 C4 C5 C6 C7 C8 CD CE Addre.
3 Tests and Diagnostics 3.23 Hard Disk Test Detail Status 3.23 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight-digit number.
3.23 Hard Disk Test Detail Status 3 Tests and Diagnostics Table 3-6 Error register contents Bit Name Description 7 BBK1 (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error.
3 Tests and Diagnostics 3.24 Head Cleaning 3.24 Head Cleaning 3.24.1 Function Description This function cleans the heads in the USB FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.
3.25 Log Utilities 3 Tests and Diagnostics 3.25 Log Utilities 3.25.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer.
3 Tests and Diagnostics 3.25 Log Utilities 2. The error information displayed on the screen can be manipulated by the following number keys: 1 scrolls the display to the next page. 2 scrolls the display to the previous page. 3 returns to the Diagnostic Menu.
3.26 Running Test 3 Tests and Diagnostics 3.26 Running Test 3.26.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 04, and 06) 3. Real timer test (subtest 02) 4.
3 Tests and Diagnostics 3.26 Running Test 4. Select No and press Enter . The following message will appear: Mount the work disk(s) on the drive(s), then press [Enter] key. [Warning : The contents of the disk(s), will be destroyed.] 5. This program is executed continuously.
3.27 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities 3.27.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE : This program is only for testing a floppy disk drive.
3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities 3.27.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 - HDD ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
3.27 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a m essage similar to the one below: Insert source disk into drive A: Press any key when ready.
3 Tests and Diagnostics 3.27 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) When FDD is selected, the following message appears.
3.27 Floppy Disk Drive Utilities 3 Tests and Diagnostics TECRA M1 Maintenance Manual (960-436) 3-75 (k) The following message appears. Select 2 to return to the FDD UTILITIES m enu. Another dump (1:Yes, 2:No) ? 5. HDD-ID READ Selecting HDD ID READ displays th e following HDD ID configuration: [HDD ID Read (VX.
3 Tests and Diagnostics 3.28 System Configuration 3 3.28 System Configuration 3.28.1 Function Description The System Configuration program contains th e following configuration information for the computer: 1. Processor Type 2. VGA Controller 3. MS-DOS Version 4.
3.28 System Configuration 3 Tests and Diagnostics 3.28.2 Operations Selecting 8 from the DIAGNOSTIC MENU and pressing Enter displays the following system configuration: System Configuration Display : Ver X.XX [Machine Name XXXXXX] * - Processor Type = XXXX **- VGA Controller = XXXX * - MS-DOS Version = VX.
3 Tests and Diagnostics 3.29 SETUP 3.29 SETUP 3.29.1 Function Description This program displays the current system setup inform ation as listed below: 1. Memory (a) Total 2. System Date/Time (a) Date (MM-DD-YYYY) (b) Time (HH:MM:SS) 3. Battery (a) Battery Save Mode 4.
3.29 SETUP 3 Tests and Diagnostics 10. Drives I/O (a) Built-in HDD (b) Select Bay 11. PCI Bus (a) PCI Bus 12. PC Card (a) Controller Mode 13. Peripheral (a) Internal Pointing Device (b) Ext keyboard “Fn” (c) Paralla Port Mode (d) Hard Disk Mode 14.
3 Tests and Diagnostics 3.29 SETUP 3.29.2 Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the TSETUP screen.
3.29 SETUP 3 Tests and Diagnostics NOTE: 1) Panel Power On/Off under OTHERS appears only when the Power-up Mode is in Resume mode. 2) USB FDD Legacy Emulation under LEGACY EMULATION appears only when Floppy Disk I/O is set to Disabled.
3 Tests and Diagnostics 3.29 SETUP Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press PgDn and PgUp to move between the two pages. Press ↑ and ↓ to move between items in a colum n. 2. Press either the space bar to change the value.
3.29 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s mem ory. (a) Total This field displays the total amount of mem ory installed and is automatically calculated by the computer.
3 Tests and Diagnostics 3.29 SETUP Enabled Enables sleep mode. (Default) Disabled Disables sleep mode. Display Auto Off Use this option to disable or set the duration of the display automatic power off function. This function causes the computer to turn the LCD panel’s illumination off if you make no entry for the set period of tim e.
3.29 SETUP 3 Tests and Diagnostics 4. Password This option allows you to set or reset the user password for power on. Not Registered Change or remove the password.
3 Tests and Diagnostics 3.29 SETUP Built-in HDD → PC Card → Second HDD Second HDD → PC Card → Built-in HDD PC Card → Built-in HDD → Second HDD PC Card → Second HDD → Built-in HDD 6. Display This group of options configures the computer’s display.
3.29 SETUP 3 Tests and Diagnostics Disabled Disables the CPU cache. When enabled is selected, a subwindow similar to the one below is displayed to select the cache write policy. The options for this setting are Write-back (default) and Write-through for CPU cache.
3 Tests and Diagnostics 3.29 SETUP * only for Modem Model ** only for LAN Model Alarm Time is set in the sequence of hours and minutes. Seconds cannot be changed. Alarm Date Option is set in the sequence of month and day. If Alarm Date is set to Disabled, the computer will be powered on at the sam e time every day.
3.29 SETUP 3 Tests and Diagnostics 9. I/O ports This option controls settings for the parallel port. NOTE: Do not assign the same interrupt request level and I/O address to the serial port and PC card. (a) Serial Use this option to set the COM level for the serial port.
3 Tests and Diagnostics 3.29 SETUP When the Printer Port Mode (see settings below) is set to ECP , the DMA channel can also be set to 1 , 2 or 3 . The default is 3.
3.29 SETUP 3 Tests and Diagnostics This item displays the interrupt level for the Card Bus. It is for information only and cannot be changed. PCI BUS = IRQ11 12. PC Card This option sets the PC Card Controller mode. This option can be changed when “Device Config.
3 Tests and Diagnostics 3.29 SETUP Left Alt + Left Shift Right Alt + Right Shift Left Alt + Caps Lock * If these selections are made, you cannot warm boot the system by pressing Ctrl + Alt + Del . Disabled Disables the feature. (Default) (c) Parallel Port Mode The options in this tab are ECP and Standard Bi-directional.
3.29 SETUP 3 Tests and Diagnostics Enabled USB Legacy Support can be used. (Default) Disabled USB Legacy Support cannot be used. 15. PCI LAN (Not used) This option enables/disables the Built-in LAN functions. (a) Built-in LAN Enabled Enables Built-in LAN functions.
3 Tests and Diagnostics 3.29 SETUP 3-94 TECRA M1 Maintenance Manual (960-436).
Chapter 4 Replacement Procedures.
4 Replacement Procedures 4-ii TECRA M1 Maintenance Manual (960-436).
4 Replacement Procedures Chapter 4 Contents 4.1 General .................................................................................................................... ... 4-1 4.2 Battery Pack .....................................................
4 Replacement Procedures Figures Figure 4-1 Releasing th e Battery pack .......................................................................... 4-10 Figure 4-2 Removing a PC card .....................................................................
4 Replacement Procedures Figure 4-30 Removing the Sound board .......................................................................... 4-55 Figure 4-31 Removing the System board/RTC battery/DC-IN jack (1) ......................... 4-58 Figure 4-32 Removing the System board/RTC battery/DC-IN jack (2) .
4 Replacement Procedures 4-vi TECRA M1 Maintenance Manual (960-436) Figure 4-62 Replacing Sharp fluorescent lamp (SXGA+) (1) ......................................... 4-98 Figure 4-63 Replacing Sharp fluorescent lamp (SXGA+) (2) ......................
4.1 General 4 Replacement Procedures 4 Replacement Procedures 4.1 General This section explains how to disassemble the computer and replace Field Replaceable Units (FRUs). It may not be necessary to remove all the FRUs in order to replace one. The chart below is a guide to which FRUs need to be removed in order to remove others.
4 Replacement Procedures 4.1 General Safety Precautions Before you begin disassembly, read the following safety precautions and observe them carefully as you work. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit.
4.1 General 4 Replacement Procedures Before You Begin Look over the procedures in this section before you begin disassembling the computer. Familiarize yourself with the disassembly and reassem bly steps. Begin each procedure by removing the AC adapter and the battery pack as instructed in this section: 1.
4 Replacement Procedures 4.1 General Disassembly Procedures The computer has two basic types of cable connectors: • Pressure Plate Connectors • Coaxial Cable Connectors • Normal Pin Connectors T.
4.1 General 4 Replacement Procedures Tools and Equipment The use of Electrostatic Discharge (ESD) equipment is very important for your safety and the safety of those around you. Proper use of these devices will increase the success rate of your repairs and lower the cost for damaged or destroyed parts.
4 Replacement Procedures 4.1 General Screw Tightening Torque When you fasten screws, be sure to follow the torque list below. CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose.
4.1 General 4 Replacement Procedures Color of Screw Shaft To avoid mistakes on the screw length, screw shafts are colored as follows: Even number length screw: brown Odd number length screw: white Special length screw: blue Screws whose lengths are indicated to one or more decimal places such as 2.
4 Replacement Procedures 4.2 Battery Pack 4.2 Battery Pack Removing the Battery Pack To remove the battery pack, follow the steps below and refer to figure 4-1. CAUTION: When handling battery packs, be careful not to short circuit the terminals. Also do not drop, hit or apply impact; do not scratch, break, twist or bend the battery pack.
4.2 Battery Pack 4 Replacement Procedures 4. While sliding the battery latch, insert your finger into the slot, then pull the battery pack to the arrow direction in the figure below and lift it out. NOTE: For environmental reasons, do not throw away a spent battery pack.
4 Replacement Procedures 4.2 Battery Pack Installing the Battery Pack To install the battery pack, follow the steps below and refer to figure 4-1. CAUTION: The battery pack is a lithium ion battery, which can explode if not properly replaced, used, handled or disposed of.
4.3 Optional PC Card 4 Replacement Procedures 4.3 Optional PC Card Removing an Optional PC Card To remove a PC card (option), follow the steps below and refer to figure 4-2. CAUTION: Before you remove a PC card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions.
4 Replacement Procedures 4.3 Optional PC Card Installing an Optional PC Card To install a PC card, follow the steps below and refer to figure 4-2. 1. Insert a PC card.
4.4 Optional SD Card 4 Replacement Procedures 4.4 Optional SD Card Removing an Optional SD Card To remove an SD card (option), follow the steps below and refer to figure 4-3. CAUTION: Before you remove an SD card, refer to the card's documentation and to your operating system documentation for proper procedures and precautions.
4 Replacement Procedures 4.5 HDD 4.5 HDD CAUTION : When handling the HDD, do not press the top surface as shown by the arrow. Hold it by the sides. HDD Removing the HDD To remove the HDD, follow the steps below and refer to figures 4-4 to 4-6. 1. Turn the computer upside down.
4.5 HDD 4 Replacement Procedures 3. Pull the guide of the HDD pack and remove HDD pack. Be careful not to damage the connector. Figure 4-5 Removing the HDD pack TECRA M1 Maintenance Manual (960-436) 4.
4 Replacement Procedures 4.5 HDD NOTE: The following steps describe how to disassemble the HDD pack; however, do not disassemble if the HDD is working properly. 5. Place the HDD pack on a flat surface, and remove the following screws. • M3 × 4 FLAT screw × 4 6.
4.5 HDD 4 Replacement Procedures Installing the HDD To install the HDD, follow the steps below and refer to figures 4-4 to 4-6. CAUTION: Do not hold the HDD by its top and bottom flat surfaces. It may damage the HDD. 1. Seat the HDD in the bracket. 2.
4 Replacement Procedures 4.6 Slim Select Bay Module 4.6 Slim Select Bay Module Removing the Slim Select Bay Module To remove the slim select bay m odule, follow the steps below and refer to figures 4-7 and 4- 8. CAUTION: The slim select bay module can become hot with use.
4.6 Slim Select Bay Module 4 Replacement Procedures 3. Remove the following screws securing the connector and plastic brace. • M2 × 8 BIND screw × 2 4. Remove the connector and plastic brace from the slim select bay m odule. 5. Remove the following screws securing the plastic frame.
4 Replacement Procedures 4.6 Slim Select Bay Module Installing the Slim Select Bay Module To install the slim select bay module, follow the steps below and refer to figures 4-7 and 4-8. 1. Seat the plastic frame on the side of the slim select bay m odule, and secure it with the following screws.
4.7 Modem Daughter Card 4 Replacement Procedures 4.7 Modem Daughter Card Removing the Modem Daughter Card To remove the modem daughter card, follow the steps below and refer to figure 4-9 and 4-10. 1. Remove the following screw securing the modem daughter card cover.
4 Replacement Procedures 4.7 Modem Daughter Card 2. Remove the following screws securing the modem daughter card. • M2 × 4 BIND screw × 2 3. Lift up the modem daughter card to disconnect it from PJ2017 on the sound board by pulling up the insulator.
4.7 Modem Daughter Card 4 Replacement Procedures Installing the Modem Daughter Card To install the modem daughter card, follow the steps below and refer to figures 4-9 and 4-10. NOTE: To install the modem cable to the system board, refer to 4.22 System Board/RTC Battery/DC-IN Jack.
4 Replacement Procedures 4.8 CPU 4.8 CPU Removing the CPU To remove the CPU, follow the steps below and refer to figures 4-11 to 4-13. CAUTION: 1) The CPU can become very hot during operation. Be sure to let it cool before starting repair work. 2) When you remove the CPU, wipe the grease off of the bottom of the fin and top of the CPU.
4.8 CPU 4 Replacement Procedures 3. Remove the fin. CAUTION: Silicon grease is applied between the fin and the CPU. When removing the fin, be careful not to damage the CPU under the fin.
4 Replacement Procedures 4.8 CPU 4. Turn the cam to the unlock position with a flat-blade screwdriver to unlock the CPU. Figure 4-13 Unlocking the CPU 4.
4.8 CPU 4 Replacement Procedures Installing the CPU To install the CPU, follow the steps below and refer to figures 4-11 to 4-14. 1. Make sure the cam is in the open position. 2. Seat the CPU in the CPU socket. Make sure the alignment is exact to avoid damaging pins on the CPU.
4 Replacement Procedures 4.8 CPU 4-28 TECRA M1 Maintenance Manual (960-436) 5. Install the fin. 6. Insert the “1” side of the CPU holder into the empty space, with rotated 90 degrees counterclockwise first. Then rotate it 90 degrees clockwise and fit the two holes of the CPU holder to the bosses on the fin.
4 Replacement Procedures 4.9 Keyboard 4 Replacement Procedures 4.9 Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to figures 4-15 to 4-17.
4.9 Keyboard 4 Replacement Procedures 3. Remove the following screws securing the keyboard. • M2.5 × 2.8 FLAT HEAD screw × 2 4. Remove the following screw securing the keyboard hold plate and remove the keyboard hold plate. • M2.5 × 2.8 FLAT HEAD screw × 1 Figure 4-16 Removing the Keyboard 5.
4 Replacement Procedures 4.9 Keyboard 6. Remove the following screw securing the keyboard support plate and remove the keyboard support plate. • M2.5 × 6 FLAT HEAD screw × 1 Figure 4-17 Removing the Keyboard support plate 7. Disconnect the keyboard cable from PJ123 on the system board, and remove the keyboard.
4.9 Keyboard 4 Replacement Procedures Installing the Keyboard To install the keyboard, follow the steps below and refer to figures 4-15 to 4-17. 1. Place the keyboard face down on the palm rest. 2. Connect the keyboard cable to PJ123 on the system board.
4 Replacement Procedures 4.10 Memory Module 4.10 Memory Module Removing a Memory Module To remove a mem ory module, make sure the computer is in boot m ode and powered off, follow the steps below and refer to figure 4-18. CAUTION: 1) Do not try to remove a memory module with the computer turned on.
4.10 Memory Module 4 Replacement Procedures Installing a Memory Module To install a memory m odule, make sure that the computer is in boot m ode and powered off, follow the steps below and refer to figure 4-18. CAUTION: 1) Do not install a memory module in slot B only.
4 Replacement Procedures 4.11 Sensor/Switch Board 4.11 Sensor/Switch Board Removing the Sensor/Switch Board To remove the sensor/switch board, make sure the com puter is in boot mode and powered off, follow the steps below and refer to figure 4-19. 1.
4.11 Sensor/Switch Board 4 Replacement Procedures To install the sensor/switch board, make sure that the computer is in boot m ode and powered off, follow the steps below and refer to figure 4-19. NOTE: For installing the sensor/switch board SUMI card to the system board, refer to 4.
4 Replacement Procedures 4.12 Touch Pad 4.12 Touch Pad Removing the Touch Pad To remove the touch pad, follow the steps below and refer to figures 4-20 to 4-22. 1. Turn the computer face down and remove the following nine screws securing the palmrest to the display assembly.
4.12 Touch Pad 4 Replacement Procedures Figure 4-21 Removing the Palmrest (2) TECRA M1 Maintenance Manual (960-436) 4-41.
4 Replacement Procedures 4.12 Touch Pad 4. Remove the following screws securing the touch pad and touch pad switch to the palm rest. • M2.5 × 4 FLAT HEAD screw × 2 • M2.5 × 4 TAPPING screw × 2 5. Remove the touch pad and touch pad switch from the front of the palm rest.
4.12 Touch Pad 4 Replacement Procedures Installing the Touch Pad To install the touch pad, follow the steps below and refer to figures 4-20 to 4-22. 1. Connect the touch pad SUMI card to CN1 on the touch pad. 2. Install the touch pad and touch pad switches on the palm rest and pass the touch pad SUMI card into the hole of the palm rest.
4 Replacement Procedures 4.13 Wireless LAN Card 4.13 Wireless LAN Card Removing the Wireless LAN Card To remove the wireless LAN card, make sure the com puter is in boot mode and powered off, follow the steps below and refer to figures 4-23 and 4-24. NOTE: The wireless LAN card is an option in some models.
4.13 Wireless LAN Card 4 Replacement Procedures 2. Disconnect the wireless LAN antenna cables (black and white) from the wireless LAN card using an antenna coaxial cable disconnector. Figure 4-24 Removing the Wireless LAN card 3. Press the latches outward to release the wireless LAN card.
4 Replacement Procedures 4.13 Wireless LAN Card Installing the Wireless LAN Card To install the wireless LAN card, make sure that the computer is in boot m ode and powered off, follow the steps below and refer to figures 4-23 and 4-24. CAUTION: Be sure to switch the computer off before removing the wireless LAN card.
4.14 Bluetooth Module 4 Replacement Procedures 4.14 Bluetooth Module Removing the Bluetooth Module To remove the Bluetooth module, follow the steps below and refer to figure 4-25. CAUTION: Do not try to remove the Bluetooth module with the computer turned on.
4 Replacement Procedures 4.14 Bluetooth Module Installing the Bluetooth Module To install the Bluetooth module, follow the steps below and refer to figure 4-25. 1. Connect the Bluetooth SUMI card to the connector on the Bluetooth module. 2. Connect the Bluetooth SUMI card to PJ4900 on the system board.
4.15 Display Assembly 4 Replacement Procedures 4.15 Display Assembly Removing the Display Assembly To remove the display assembly, follow the steps below and refer to figures 4-26 to 4-28. 1. Turn the computer face down, and remove the following nine screws: • M2.
4 Replacement Procedures 4.15 Display Assembly 2. Turn the computer face up and open the display panel. 3. Remove the following screws securing the display assembly. • M2.5 × 6 FLAT HEAD screw × 2 • M2.5 × 4 FLAT HEAD screw × 1 4. Turn up the insulator covering the LCD cable and disconnect the LCD cable from PJ5500 on the system board.
4.15 Display Assembly 4 Replacement Procedures 7. Remove the display assembly from the base assembly. Figure 4-28 Removing the Display assembly (2) NOTE: When removing the display assembly, be careful not to damage any cables.
4 Replacement Procedures 4.15 Display Assembly Installing the Display Assembly To install the display assembly, follow the steps below and refer to f igures 4-26 and 4-28. 1. Install the display assembly on the base assembly. NOTE : When installing the display assembly, be careful not to pinch or damage any cables.
4.16 LED Board 4 Replacement Procedures 4.16 LED Board Removing the LED Board To remove the LED board, follow the steps below and refer to figure 4-29. 1. Remove the glass tape securing the LED board SUMI card and USB cable. 2. Disconnect the LED board SUMI card from PJ1101 on the system board.
4 Replacement Procedures 4.16 LED Board Installing the LED Board To install the LED board, follow the steps below and refer to figure 4-29. 1. Connect the LED board SUMI card to PJ3100 on the LED board. 2. Place the LED board and secure it with the following screws.
4.17 Sound Board 4 Replacement Procedures 4.17 Sound Board Removing the Sound Board To remove the sound board, follow the steps below and refer to figure 4-30. CAUTION: When the sound board is installed on the system board outside of the chassis, do not connect or disconnect a cable to the headphone or microphone jack repeatedly for check.
4 Replacement Procedures 4.17 Sound Board Installing the Sound Board To install the sound board, follow the steps below and refer to figure 4-30. 1. Install the sound board and press it to connect PJ3000 on the back of the sound board to PJ1100 on the system board.
4.18 System Board/RTC Battery/DC-IN Jack 4 Replacement Procedures 4.18 System Board/RTC Battery /DC-IN Jack WARNING: When replacing the RTC battery, be sure to use genuine batteries or replacement batteries authorized by Toshiba. Installing the wrong battery could cause a battery explosion or other damage.
4 Replacement Procedures 4.18 System Board/RTC Battery/DC-IN Jack Removing the System Board/RTC Battery /DC-IN Jack To remove the system board/RTC battery/DC-IN jack, follow the steps below and refer to figures 4-31 to 4-33. 1. Disconnect the sensor/switch board SUMI card from PJ1000 on the system board.
4.18 System Board/RTC Battery/DC-IN Jack 4 Replacement Procedures 6. Remove the following screws securing the system board. • M2.5 × 4 FLAT HEAD screw × 4 • M2.5 × 10 FLAT HEAD screw × 1 Figure 4-32 Removing the System board/RTC Battery/DC-IN Jack (2) 7.
4 Replacement Procedures 4.18 System Board/RTC Battery/DC-IN Jack 9. Remove the DC-IN jack from the chassis. Figure 4-33 Removing the DC-IN jack 4-60 TECRA M1 Maintenance Manual (960-436).
4.18 System Board/RTC Battery/DC-IN Jack 4 Replacement Procedures TECRA M1 Maintenance Manual (960-436) 4-61 Installing the System Board/RTC Battery /DC-IN Jack To install the system board/RTC battery/DC-IN jack, follow the steps below and ref er to figures 4-31 to 4-33.
4 Replacement Procedures 4.19 USB Board 4 Replacement Procedures 4.19 USB Board Removing the USB Board To remove the USB board, follow the steps below and refer to figure 4-34. 1. Remove the following screw securing the USB board. • M2.5 × 4 FLAT HEAD screw × 1 2.
4.19 USB Board 4 Replacement Procedures Installing the USB Board To install the USB board, follow the steps below and refer to the figure 4-34. 1. Fit the USB cable to the two guides and install the USB board with its hole attached to the boss of the chassis.
4 Replacement Procedures 4.20 Fan 4.20 Fan Removing the Fan To remove the fan, follow the steps below and refer to figure 4-35. 1. Remove the following screws securing the fan.
4.20 Fan 4 Replacement Procedures Installing the Fan To install the fan, follow the steps below and refer to figure 4-35. 1. Place the fan. 2. Secure the fan with the following screws.
4 Replacement Procedures 4.21 Display Mask 4.21 Display Mask Removing the Display Mask To remove the display mask, follow the steps below and refer to figures 4-36 and 4-37. 1. Remove the two mask seals at the lower part of the display m ask. 2. Remove the following screws securing the display mask.
4.21 Display Mask 4 Replacement Procedures 3. Release the latches on the display mask and remove the display m ask. Figure 4-37 Removing the Display mask (2) Installing the Display Mask To install the display mask, follow the steps below and refer to figures 4-36 and 4-37.
4 Replacement Procedures 4.22 FL Inverter 4.22 FL Inverter Removing the FL Inverter To remove the FL inverter, follow the steps below and refer to figure 4-38. 1. Remove the following screw securing the FL inverter. • M2 × 3 SUPER FLAT screw × 1 2.
4.22 FL Inverter 4 Replacement Procedures Installing the FL Inverter To install the FL inverter, follow the steps below and refer to figure 4-38. 1. Connect the FL cable and the HV cable to the FL inverter. 2. Seat the FL inverter and stick the insulator on the FL inverter of the FL cable side.
4 Replacement Procedures 4.23 LCD Module 4.23 LCD Module NOTE: 1) Be careful not to apply pressure to the ICs along the edge of LCD module. The ICs are easily damaged. 2) For environmental reasons, do not throw away a malfunctioning LCD module (or FL).
4.23 LCD Module 4 Replacement Procedures 5. Disconnect the LCD cable and remove the LCD module. CAUTION : When removing the LCD cable, be careful not to damage the connector.
4 Replacement Procedures 4.23 LCD Module 6. Remove the following screws securing the two metal braces to the LCD module. • M2 × 3 SUPER FLAT screw × 4 Figure 4-40 Removing the LCD module (2) 4-72 .
4.23 LCD Module 4 Replacement Procedures Installing the LCD Module To install the LCD module, follow the steps below and refer to figures 4-39 and 4-40. 1. Secure the two metal braces to the LCD module with the following screws. • M2 × 3 SUPER FLAT screw × 4 2.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Ant enna/Display Cover/Speaker 4.24 Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker Removing the Wireless LAN Antenna/Bluetoot.
4.24 Wireless LAN Antenna/Bl uetooth Antenna/Display Cover/Speaker 4 Replacement Procedures 2. Remove the following screws securing the cable holder and remove the cable holder.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Ant enna/Display Cover/Speaker 3. Remove the two acetate tapes securing the wireless LAN antenna cables, Bluetooth antenna cable (for wireless LAN/Bluetooth models only), and internal microphone cable.
4.24 Wireless LAN Antenna/Bl uetooth Antenna/Display Cover/Speaker 4 Replacement Procedures 4. Turn the display assembly face up and open the display cover. Remove the following screws securing the two hinges to the display cover. • M2.5 × 5 FLAT HEAD screw × 2 Figure 4-44 Removing the Hinge (1) 5.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Ant enna/Display Cover/Speaker 7. (for Wireless LAN/Bluetooth models only) Remove four acetate tapes, then remove the wireless LAN antennas and Bluetooth antenna from the display cover.
4.24 Wireless LAN Antenna/Bl uetooth Antenna/Display Cover/Speaker 4 Replacement Procedures 8. Remove the following screw securing the metal plate on the LCD cable and remove the metal plate.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Ant enna/Display Cover/Speaker 9. Lay the display assembly face down. Remove the acetate tape securing the left speaker cable.
4.24 Wireless LAN Antenna/Bl uetooth Antenna/Display Cover/Speaker 4 Replacement Procedures 10. Remove the following screws securing the speakers and side covers.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetooth Ant enna/Display Cover/Speaker 11. Remove the following screws securing the two hinges to the display cover and remove the hinges.
4.24 Wireless LAN Antenna/Bl uetooth Antenna/Display Cover/Speaker 4 Replacement Procedures Installing the Wireless LAN Antenna/Bluetooth Antenna/Display Cover/Speaker To install the wireless LAN antenna/Bluetooth antenna/display cover/speaker, follow the steps below and refer to figures 4-41 to 4-50.
4 Replacement Procedures 4.24 Wireless LAN Antenna/Bluetoot h Antenna/Display Cover/Speaker 4-84 TECRA M1 Maintenance Manual (960-436) 7. Install the display cover to the display assembly. Pass the LCD cable through the hole from the front of the display assembly toward the bottom .
4.25 Fluorescent Lamp 4 Replacement Procedures 4 4.25 Fluorescent Lamp This system uses LCD modules from the following suppliers. The procedure for replacing the fluorescent lamp is different for each LCD module. Refer to the appropriate procedure. Type Part No.
4 Replacement Procedures 4.25 Fluorescent Lamp 4.25.1 Replacing the 14.1-inch XGA TOSHIBA Fluorescent Lamp CAUTION : When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
4.25 Fluorescent Lamp 4 Replacement Procedures Figure 4-51 Replacing TOSHIBA fluorescent lamp (XGA) (1) TECRA M1 Maintenance Manual (960-436) 4-87.
4 Replacement Procedures 4.25 Fluorescent Lamp 2. Removing screws 1) Spread out the insulation sheet without detaching from the side of bezel. 2) Remove the screws (left side, right side) in order as shown in the figure below. NOTE: Use a Philips screwdriver with type 0 bit to remove the screws.
4.25 Fluorescent Lamp 4 Replacement Procedures 3. Removing bezel 1) Turn the LCD module face up with the insulation sheets on it. 2) Release the latches of the bezel and frame. (five points on upper side, two points lower side) 3) Remove the double-sided adhesive tape on the bottom of the side of bezel, and remove the bezel.
4 Replacement Procedures 4.25 Fluorescent Lamp 4. Spreading out PCB 1) Spread out the X-PCB and Y-PCB horizontally in order. NOTE: Be careful not to damage the TAB.
4.25 Fluorescent Lamp 4 Replacement Procedures 5. Removing PCB-ASSY cell 1) Remove the PCB-ASSY cell from the backlight unit. 2) Remove the double-sided adhesive tape from the back of the cell. NOTE: 1) Remove the tape slowly not to break the cell. The cell and frame are glued by double-sided adhesive tape.
4 Replacement Procedures 4.25 Fluorescent Lamp Assembling the 14.1-inch XGA TOSHIBA Fluorescent Lamp To assemble the 15.0-inch XGA TOSHIBA fluorescent lamp, follow the steps below and refer to figures 4-56 to 4-61. 1. Checking backlight 1) Check the following items shown in the figure below.
4.25 Fluorescent Lamp 4 Replacement Procedures 2. Assembling PCB-ASSY cell 1) Remove the release paper of the double-sided tape at the upper of the backlight unit. 2) Light up the backlight. 3) Make sure there is no dust, alien substance or scratch on the backlight.
4 Replacement Procedures 4.25 Fluorescent Lamp 3. Folding and temporary fixing of TAB/PCB 1) Fold the X-TAB (X-PCB) and Y-TAB (Y-PCB) to the back of backlight unit. 2) Hook the X-PCB on the three latches on the back of frame. NOTE: Be careful not to damage the TAB.
4.25 Fluorescent Lamp 4 Replacement Procedures 4. Setting bezel 1) Hook the bezel on the five latches of the frame from the upper side. NOTE: 1) Make sure the GND-CU on the left side and lamp reflector shall be inside the bezel. 2) Be careful not to damage the TAB.
4 Replacement Procedures 4.25 Fluorescent Lamp 5. Fixing PCBs and bezel with screws 1) Tighten the left side with the screws in order shown in the figure below. 2) Tighten the right side with the screws in order shown in the figure below. NOTE: 1) Tighten the screws in order.
4.25 Fluorescent Lamp 4 Replacement Procedures 6. Sticking tapes and insulation sheets 1) Stick the Y-PCB insulation sheet and X-PCB insulation sheet in order. 2) Stick the two bezel tapes on the lower side (lamp side). 3) Stick the fixing tape for FL cable.
4 Replacement Procedures 4.25 Fluorescent Lamp 4.25.2 Replacing the 14.1-inch SXGA+ Sharp Fluorescent Lamp CAUTION : When replacing the fluorescent lamp, wear finger covers or gloves to avoid contaminating or damaging the LCD panel. Be careful not to let dust or other foreign substance into the module.
4.25 Fluorescent Lamp 4 Replacement Procedures 2. Remove the four screws (E) on the sides. Figure 4-63 Replacing Sharp fluorescent lamp (SXGA+) (2) TECRA M1 Maintenance Manual (960-436) 4-99.
4 Replacement Procedures 4.25 Fluorescent Lamp 3. Turn the LCD module face up and release the two latches on the side of lamp. Figure 4-64 Replacing Sharp fluorescent lamp (SXGA+) (3) 4-100 TECRA M1 M.
4.25 Fluorescent Lamp 4 Replacement Procedures 4. Remove the bezel with having the U-shape side of bezel a supporting point, by lifting up the bezel from the side of lamp.
4 Replacement Procedures 4.25 Fluorescent Lamp 5. Turn the bezel face down, and remove the two screws (E) fixing the lamp cover (F) and remove the lamp cover.
4.25 Fluorescent Lamp 4 Replacement Procedures 6. Install the lamp cover (F) and secure it with the two screws (E). NOTE: Be careful not to make the lamp cover over the fitting pin. Around the pulling-out part of the lead wire, attach so that the P chassis is outside.
4 Replacement Procedures 4.25 Fluorescent Lamp 7. Install the bezel. Make sure the bezel does not cover the guide rib. Hook the U-shape side of bezel first, then engage the two latches at the side of lamp.
4.25 Fluorescent Lamp 4 Replacement Procedures 8. Tighten the four screws (E) on the sides. Make sure the two latches are precisely mated. Figure 4-69 Replacing Sharp fluorescent lamp (SXGA+) (8) 9. Install the protection cover S (A), protection cover G (B), aluminum tape (C) and fixing tape for lead wire (D).
4 Replacement Procedures 4.25 Fluorescent Lamp Figure 4-70 Replacing Sharp fluorescent lamp (SXGA+) (9) 4-106 TECRA M1 Maintenance Manual (960-436).
4.25 Fluorescent Lamp 4 Replacement Procedures 10. Perform appearance inspection after assembling the module. Figure 4-71 Replacing Sharp fluorescent lamp (SXGA+) (10) TECRA M1 Maintenance Manual (960.
4 Replacement Procedures 4.25 Fluorescent Lamp 4-108 TECRA M1 Maintenance Manual (960-436) Assembling the 14.1-inch SXG A+ Sharp Fluorescent Lamp To assemble the 14.1-inch Sharp SXGA+ fluorescent lamp, follow the steps below and refer to figures 4-62 to 4-71.
Appendices.
Appendices App-ii.
Appendices Appendix Contents Appendix A Handling the LCD Module .......................................................................... A-1 Appendix B Board Layout ....................................................................................
Appendices C.21 PJ1004 USB baord interface connector (6-pin) .................................................C-20 C.22 PJ4900 Bluetooth interface connector (20-pin) .................................................C-21 C.23 PJ1100 Sound board interface connector (30-pin) .
Appendices Appendix H EC/KBC Rewrite Procedures...................................................................... H-1 Appendix I Reliability ........................................................................................................ .
Appendices Figures Figure B-1 System board (FGFSY*) layout (front).................................................................1 Figure B-2 System board (FGFSY*) layout (back) .................................................................3 Figure B-3 Sound board (FGFSD*) layout (front/back) .
Appendices Tables Table B-1 System board (FGFSY*) ICs and connectors (front) .............................................2 Table B-2 System board (FGFSY*) ICs and connectors (back) .............................................4 Table B-3 Sound board (FGFSD*) ICs and connectors (front/back) .
Appendices App-viii TableC-23 Sound board interface connector (30-pin) .......................................................C-21 TableC-24 IEEE1394 interface connector (4-pin) .............................................................C-22 TableC-25 LAN interface connector (14-pin) .
Appendix A Handling the LCD Module Appendices Appendix A P Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assem bly or disassembly. Observe the following precautions when handling the LCD module: 1.
Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent.
Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge.
Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module Appendices 9. Do not disassemble the LCD module. Disassem bly can cause malfunctions. 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxime).
Appendices Appendix A Handling the LCD Module A-6 TECRA M1 Maintenance Manual (960-436).
Appendix B Board Layout Appendices Appendix B Board Layout B.1 System Board (FGFSY*) Front View ( ZA ) ( Z ) ( Y ) ( X ) ( W ) ( V ) ( U ) ( T ) ( S ) ( R ) ( Q ) ( P ) ( O ) ( N ) ( A ) ( B ) ( C ) (.
Appendices Appendix B Board Layout Table B-1 System board (FGFSY*) ICs and connectors (front) Mark Number Name (A) PJ4900 Bluetooth interface connector (B) PJ1005 RTC Battery connector (C) PJ1101 LED .
Appendix B Board Layout Appendices B.2 System Board (FGFSY*) Back View ( T ) ( S ) ( R ) ( Q ) ( P ) ( O ) (N) ( M ) ( L ) ( J ) ( K ) (A) (B) ( C ) ( D ) (E) (F) ( G ) ( H ) (I) Figure B-2 System boa.
Appendices Appendix B Board Layout Table B-2 System board (FGFSY*) ICs and connectors (back) Mark Number Name (A) PJ5501 TV controller connector (B) PJ5523 CRT interface connector (C) PJ2019 Serial in.
Appendix B Board Layout Appendices B.3 Sound Board (FGFSD*) Front and Back View (A) (front) (E) (B) (C) (F) (D) (back) Figure B-3 Sound board (FGFSD*) layout (front/back) Table B-3 Sound board (FGFSD*.
Appendices Appendix B Board Layout B.4 LED Board (FGFLE*) Front and Back View (B) (C) (D) (E) (F) (G) (A ) (front) (back) Figure B-4 LED board (FGFLE*) layout (front/back) Table B-4 LED board (FGFLE*).
Appendix B Board Layout Appendices B.5 Sensor/Switch Board (FGFLS*) Front and Back View (A) (C) (D) (E) (B) (front) (back) Figure B-5 Sensor/Switch board (FGFLS*) layout (front/back) Table B-5 Sensor/.
Appendices Appendix B Board Layout B-8 TECRA M1 Maintenance Manual (960-436) B.6 USB Board (FGFUS*) Front and Back View (A) (B) (front) (back) Figure B-6 USB board (FGFUS*) layout (front/back) Table B.
Apx.C Pin Assignments Appendices Appendix C Appendix C Pin Assignments System Board C.1 PJ1001 Memory 1 connector (200-pin) Table C-1 Memory 1 connector (200-pin) (1/3) Pin No.
Appendices Apx.C Pin Assignments Table C-1 Memory 1 connector (200pin) (2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 63 GND - 64 GND - 65 SDQ30R-B2P I/O 66 SDQ29R-B2P I/O 67 SDQ31R-B2P I/O 68 .
Appendix C Pin Assignments Appendices Table C-1 Memory 1 connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 139 SDQ35R-B2P I/O 140 SDQ32R-B2P I/O 141 SDQ45R-B2P I/O 142 SDQ46R-B.
Appendices Apx.C Pin Assignments C.2 PJ1002 Memory 2 connector (200-pin) Table C-2 Memory 2 connector (200-pin) (1/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 MR1R25-P1V - 2 MR1R25-P1V - 3 GN.
Appendix C Pin Assignments Appendices Table C-2 Memory 2 connector (200-pin) (2/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 63 GND - 64 GND - 65 SDQ30R-B2P I/O 66 SDQ29R-B2P I/O 67 SDQ31R-B2P I.
Appendices Apx.C Pin Assignments Table C-2 Memory 2 connector (200-pin) (3/3) Pin No. Signal Name I/O Pin No. Signal Name I/O 139 SDQ35R-B2P I/O 140 SDQ32R-B2P I/O 141 SDQ45R-B2P I/O 142 SDQ46R-B2P I/.
Appendix C Pin Assignments Appendices C.3 PJ1509 HDD interface connector (44-pin) Table C-3 HDD interface connector (44-pin) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments C.4 PJ1511 Select Bay interface connector (72-pin) Table C-4 Select Bay interface connector (72-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.5 PJ1512 PC-Card interface connector (150-pin) Table C-5 PC-Card interface connector (150-pin) (1/2) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments 73 BCCD2-B3N O 74 GND - C-10 TECRA M1 Maintenance Manual (960-436).
Appendix C Pin Assignments Appendices Table C-5 PC-Card interface connector (150-pin) (2/2) Pin No. Signal Name I/O Pin No. Signal Name I/O 75 GND - 76 GND - 77 GND - 78 ACCD1-B3N O 79 ACAD00-BYP I/O .
Appendices Apx.C Pin Assignments C.6 PJ1514 SD Card interface connector (12-pin) Table C-6 SD Card interface connector (12-pin) Pin No. Signal Name Pin No. Signal Name I/O 1 SDAT3-B3P 2 SDCMD-B3P I/O 3 GND 4 SD-P3V - 5 SDCLK-B3P 6 GND - 7 SDAT0-B3P 8 SDAT1-B3P I/O 9 SDAT2-B3P 10 SDCD-B3N O 11 I/O I/O - I I/O I/O SDWP-B3P O 12 GND - C.
Appendix C Pin Assignments Appendices C.8 PJ2003 PAD interface connector (8-pin) Table C-8 PAD interface connector (8-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 P5V - 2 IPDDAT-P5P I/O 3 IPDCLK-P5P I/O 4 GND - 5 SP-GND - 6 SPY-PXP O 7 SPX-PXP O 8 SP-P5V - C.
Appendices Apx.C Pin Assignments C.12 PJ2027 Speaker (Left) connector (2-pin) Table C-12 Speaker (Left) connector (2-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.13 PJ2007 Docking interface connector (240-pin) Table C-13 Docking interface connector (240-pin) (1/4) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments 73 GND - 74 GND - Table C-13 Docking interface connector (240-pin) (2/4) Pin No. Signal Name I/O Pin No. Signal Name I/O 75 GND - 76 DHSYNC-P5P I 77 DVISDA-P5P I/O 78 .
Appendix C Pin Assignments Appendices 149 GND - 150 PDB04-P5P I/O 151 PDB01-P5P I/O 152 PDB02-P5P I/O TECRA M1 Maintenance Manual (960-436) C -17.
Appendices Apx.C Pin Assignments Table C-13 Docking interface connector (240-pin) (3/4) Pin No. Signal Name I/O Pin No. Signal Name I/O 153 PDB00-P5P I/O 154 STROB-P5N I 155 NC - 156 NC - 157 GND - 15.
Appendix C Pin Assignments Appendices 229 GND - 230 NC - TECRA M1 Maintenance Manual (960-436) C -19.
Appendices Apx.C Pin Assignments Table C-13 Docking interface connector (240-pin) (4/4) Pin No. Signal Name I/O Pin No. Signal Name I/O 231 NC - 232 NC - 233 GND - 234 ACT-E3N O 235 LINK-E3N O 236 DOCDT2-S3N O 237 Not Mount - 238 Not Mount - 239 BIDBP-EXP O 240 BIDBN-EXN O C.
Appendix C Pin Assignments Appendices 55 GND - 56 PAR-P3P I/O Table C-14 Mini PCI interface connector (124-pin) (2/2) Pin No. Signal Name I/O Pin No. Signal Name I/O 57 AD17-P3P I/O 58 AD18-P3P I/O 59.
Appendices Apx.C Pin Assignments C.15 PJ2017 MDC1 interface connector (30-pin) Table C-15 MDC1 interface connector (30-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.18 PJ2020 Parallel interface connector (25-pin) Table C-18 Parallel interface connector (25-pin) Pin No. Signal Name I/O Pin No.
Appendices Apx.C Pin Assignments C.22 PJ4900 Bluetooth interface connector (20-pin) Table C-22 Bluetooth interface connector (20-pin) Pin No. Signal Name I/O Pin No.
Appendix C Pin Assignments Appendices C.24 PJ651 IEEE 1394 interface connector Table C-24 IEEE 1394 interface connector Pin No. Signal Name I/O Pin No. Signal Name I/O 1 TPB0-P3N I/O 2 TPB0-P3P I/O 3 TPA0-P3N I/O 4 TPA0-P3P I/O C.25 PJ4500 LAN interface connector (14-pin) Table C-25 LAN interface connector (14-pin) Pin No.
Appendices Apx.C Pin Assignments C.28 PJ1005 RTC Battery connector (2-pin) Table C-28 RTC Battery connector (2-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 ZS-PWCHKF - 2 GND - C.29 PJ8770 FAN interface connector (3-pin) Table C-29 FAN interface connector (3-pin) Pin No.
Appendix C Pin Assignments Appendices C.31 PJ5523 CRT interface connector (15-pin) Table C-31 CRT interface connector (15-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 RED-PXP O 2 GREEN-PXP O 3 BLUE-PXP O 4 NC - 5 GND - 6 GND - 7 GND - 8 GND - 9 P5V - 10 GND - 11 NC - 12 CRTSCL-P5P I/O 13 SHSYNC-P5P O 14 SVSYNC-P5P O 15 CRTSDA-P5P I/O C.
Appendices Apx.C Pin Assignments Sound Board C.33 PJ3000 System board interface connector (30-pin) Table C-33 System board interface connector (30-pin) Pin No.
Appendix C Pin Assignments Appendices C.36 PJ3003 Headphone connector (6-pin) Table C-36 Headphone connector (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 A-GND - 2 HEADL-PXP O 3 HEADR-PXP.
Appendices Apx.C Pin Assignments LED Board C.37 PJ3100 System board interface connector (14-pin) Table C-37 System board interface connector (14-pin) Pin No.
Appendix C Pin Assignments Appendices Sensor/Switch Board C.38 PJ3200 System board interface connector (10-pin) Table C-38 System board interface connector (10-pin) Pin No.
Appendices Apx.C Pin Assignments USB Board C.39 PJ3300 System board interface connector (6-pin) Table C-39 System board interface connector (6-pin) Pin No. Signal Name I/O Pin No. Signal Name I/O 1 GND - 2 GND - 3 Not Mount - 4 Not Mount - 5 GND - 6 GND - C.
Appendix C Pin Assignments Appendices TECRA M1 Maintenance Manual (960-436) C -33.
Appendix D Keyboard Scan/Character Codes Appendix D Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Code set 1 Code set 2 Cap No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 29 | 2B AB 5D F0 5D *5 30 Caps Lock 3A BA 58 F0 5.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (3/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 58 Ctrl 1D 9D 14 F0 14 *3 60 Alt (L) 38 B8 11 F0 1.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *.
Appendix D Keyboard Scan/Character Codes Table D-2 Scan codes with left Shift key Code set 1 Code set 2 Cap No. Key top Make Break Make Break 55 / E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0 12.
Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Code set 1 Code set 2 Cap No. Key top Make Break Make Break 75 INS E0 2A E0 52 E0 D2 E0 AA E0 12 E0 70 E0 F0 70 E0 F0 12 7.
Appendix D Keyboard Scan/Character Codes Table D-5 Scan codes in overlay mode Code set 1 Code set 2 Cap No. Keytop Make Break Make Break 09 8 (8) 48 C8 75 F0 75 10 9 (9) 49 C9 7D F0 7D 11 0 (*) 37 B7 .
Appendix D Keyboard Scan/Character Codes D-8 TECRA M1 Maintenance Manual (960-436) Table D-7 No.126 key scan code Code set 1 Code set 2 Key top Shift Make Make Pause Co mm on * E1 1D 45 E1 9D C5 E1 14 77 E1 F0 14 F0 77 Ctrl* E0 46 E0 C6 E0 7E E0 F0 7E *: This key generates only make codes.
Appendix E Key Layout Appendices Appendix E Appendix E Key Layout E.1 United Kingdom (UK) Keyboard Figure E-1 UK keyboard E.2 United States (US) Keyboard Figure E-2 US keyboard TECRA M1 Maintenance Ma.
Appendices Appendix E Key Layout E-2 TECRA M1 Maintenance Manual ( 960-436).
Appendix F Wiring Diagrams Appendices Appendix F Appendix F Wiring Diagrams F.1 Parallel Port Wraparound Connector -SELECT -PINT Figure F-1 Parallel port wraparound connector F.
Appendices Appendix F Wiring Diagrams F-2 TECRA M1 Maintenance Manual (960-436) F.3 LAN Loopback Connector ( 1 ) BIBAP ( TX+ ) ( 2 ) BIDAN ( TX- ) (3) BIDBP (R X+) (6) BIDBN (RX-) Figure F-3 LAN loopb.
Appendix G BIOS Rewrite Procedures Appendices Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk for the com puter that has renewed BIOS data.
Appendices Appendix G BIOS Rewrite Procedures G-2 TECRA M1 Maintenance Manual (960-436).
Appendix H EC/KBC Rewrite Procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: BIOS/EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1.
Appendices Appendix H EC/KBC Rewrite Procedures H-2 TECRA M1 Maintenance Manual (960-436).
Appendix I Reliability Appendices Appendix I Appendix I Reliability The following table shows MTBF (Mean Time Between Failures). Table I-1 MTBF Time (hours) MTBF 5,336 TECRA M1 Maintenance Manual (960.
Appendices Appendix I Reliability I-2 TECRA M1 Maintenance Manual (960-436).
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il Toshiba tecra m1 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Toshiba tecra m1 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Toshiba tecra m1 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Toshiba tecra m1 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Toshiba tecra m1, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Toshiba tecra m1.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Toshiba tecra m1. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Toshiba tecra m1 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
