Manuale d’uso / di manutenzione del prodotto nw8000 del fabbricante HP (Hewlett-Packard)
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Mainten ance and Ser vice Gu id e HP Co mpaq nc8000 B usines s Notebook HP Co mpaq n w8000 Mob ile W o rkstati on Do cu me n t P a r t Nu m be r: 333 954 - 0 05 October 2006 This guide is a troubleshooting reference used for maintaining and servicing the notebook.
© Copyright 2003, 2004, 2006 He wlett-P ackard Dev elopment Company , L.P . Microsoft and W indows are U.S. registered trademarks of Microsoft Corporation. Intel and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Maintenance and Serv ice Guide iii Cont ents 1 Product Description 1.1 Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–13 1.3 Clearing a Password .
iv Maintenance and Servi ce Guide Cont ent s 3 Illustrated Parts Catalog 3.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 3–1 3.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 3–2 3.3 Miscellaneous Plastics Kit Components .
Conte nts Maintenance and Servi ce Guide v 5 Removal and Replacement Procedures 5.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–3 5.3 Preparing the Notebook for Di sassembly .
vi Maintenance and Servi ce Guide Cont ent s 6 Specifications A Connector Pin Assignments B Power Cord Requirements CS c r e w L i s t i n g Index.
Maintenance and Serv ice Guide 1–1 1 Pr oduct Descriptio n The HP Compaq nc8000 Business Notebook and HP Compaq nw8000 Mobile W orkstation offer adv anced modularity , an Intel® Pentium® M process.
1–2 Maintenance and Service Guide Produc t D esc ription 1 . 1 Models Notebook model information is sho w n in T ables 1-1 through 1-3. Configuration code L Y2Z applies to all models of the HP Compaq nc8000 Business Notebook. Configuration code MDBZ applies to all models of the HP Compaq nw8000 Mobile W orkstation.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–3 Key Cnc P 170 U5 80 Y Gg 10 P XXXXXX-XXX 12 3 4 5 6 7 8 9 1 0 Ke y D escription Options 7 Integrated communication/ wireless de vice G = Combination modem + GB NIC N = None b = 802.11b d = 802.
1–4 Maintenance and Service Guide Produc t D esc ription Ta b l e 1 - 2 HP Compaq nc8000 Business Notebook Models These HP Compaq nc8000 Business Not ebook models f e ature the f ollowing: ■ Dual .
Pr oduct Descr iption Maintenance and Serv ice Guide 1–5 These HP Compaq Business Notebook nc 8000 models f e ature the f ollowing: ■ Dual point (pointing stick an d T ouchP ad) pointing device .
1–6 Maintenance and Service Guide Produc t D esc ription Cnc8000 P 160 S5 40 D Gn 51 P Asia P acific A ustralia Belgium Brazil Czech Repub lic Denmark Europe Fr a n c e F rench Canada Germany Greece.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–7 Cnc8000 P 160 S5 40 D Gn 51 2 Asia P acific A ustralia Belgium Brazil Czech Repub lic Denmark Europe Fr a n c e F rench Canada Germany Greece.
1–8 Maintenance and Service Guide Produc t D esc ription Cnc8000 RP 150 U5 60 W Gj 51 P Europe DU250S#ABB Cnc8000 RP 150 X5 40 D Gi 25 P P eople’ s Republic of China DT818P#AB2 Cnc8000 RP 150 X5 4.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–9 Cnc8000 RP 150 X5 40 W Gi 25 P P eople’ s Republic of China DT819P#AB2 Cnc8000 RP 150 X5 60 W Gb 25 P T aiwan DT815P#AB0 Cnc8000 RP 150 Y5 .
1–10 Maintenance and Servi ce Guide Produc t D esc ription Ta b l e 1 - 3 HP Compaq nw8000 Mobile W orkstation Models These HP Compaq nw8000 Mobile W or kst ation models f eature the following: ■ .
Pr oduct Descr iption Maintenance and Serv ice Guide 1–11 These HP Compaq nw8000 Mobile W or kst ation models f eature the following: ■ Dual point (pointing stick an d T ouchP ad) pointing device .
1–12 Maintenance and Servi ce Guide Produc t D esc ription Cnw8000 P 170 U5 60 W Gm 51 P Asia P acific DU534P UUF Cnw8000 P 170 U5 60 W Gd 10 P Asia P acific DU535P UUF Japan DU529P ABJ Cnw8000 P 17.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–13 1. 2 F e a t u r e s ■ Intel Pentium M 1.7-, 1.6-, 1.5-, and 1.4-GHz processors, all with 1024-KB L2 cache and 400-MHz processor side bus, v arying by notebook model ■ 15.1-inch UXGA (1600×1200), SXGA+ (1400×1050), or XGA (1024×768) TFT display with ov er 16.
1–14 Maintenance and Servi ce Guide Produc t D esc ription ■ Integrated Secure Digital (SD) Memory Card flash media slot ■ Integrated 10/100/1000 B ASE-T Ethernet local area network (LAN) NIC with RJ-45 connector ■ Integrated wireless support for Bluetooth® LAN and Mini PCI 802.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–15 ■ Connectors: ❏ SD Card ❏ Infrared ❏ T wo T ype II PC Card slots ❏ RJ-11 (modem) ❏ RJ-45 (NIC) ❏ T wo Univ ersal Serial Bus (USB) 2.
1–16 Maintenance and Servi ce Guide Produc t D esc ription 1. 3 C l e a r i n g a P a s s w o r d If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear the CMOS memory: 1. Prepare the notebook for disassembly (refer to Section “5.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–17 1. 4 P o w e r M a n a g e m e n t The notebook comes with po wer management features that extend battery operating time and conserv e power .
1–18 Maintenance and Servi ce Guide Produc t D esc ription 1 .5 External Com ponents The external components on the front and right side of the notebook are sho wn below and described in T able 1-4.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–19 Ta b l e 1 - 4 Front and Right-Side Components Item Component Function 1 Stereo speakers (2) Produce stereo sound. 2 Displa y release latch Opens the notebook. 3 Mute button Mutes the system volume .
1–20 Maintenance and Servi ce Guide Produc t D esc ription The external components on the rear and left side are sho wn belo w and described in T able 1-5.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–21 Ta b l e 1 - 5 Rear and Left-Side Components Item Component Function 1 USB connectors (2) Connect US B 1.1- and 2.0-compliant de vices to the notebook using a standard USB cable . The bottom connector is a self-powered USB connector .
1–2 2 Maintenance and Servi ce Guide Produc t D esc ription 3 P ower connector Connects an A C adapter or an optional A u tomobile P ow er Adapter/Charger or Aircraft P ow er Adapter .
Pr oduct Descr iption Maintenance and Serv ice Guide 1–2 3 The notebook ke yboard components are shown belo w and described in T able 1-6. Ke yb o a rd C o m p o n e n t s.
1–2 4 Maintenance and Servi ce Guide Produc t D esc ription Ta b l e 1 - 6 Ke yboard Components Item Component Function 1 Windows logo k ey Displays the Windo ws Star t menu. 2 fn ke y Ex e cutes frequently used system functions when pressed in combination with a function ke y or the esc key .
Pr oduct Descr iption Maintenance and Serv ice Guide 1–25 The notebook top components are sho wn below and described in T able 1-7. To p C o m p o n e n t s.
1–2 6 Maintenance and Servi ce Guide Produc t D esc ription Ta b l e 1 - 7 T op Components Item Component Function 1 Intake v ents (2) Enable airflo w to cool inter nal components.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–2 7 T op Com ponents (Continued).
1–2 8 Maintenance and Servi ce Guide Produc t D esc ription Ta b l e 1 - 7 T op Components (Continued) Item Component Function 10 MultiBay light O n: A drive in the MultiBa y is being accessed.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–29 The external components on the bottom of the notebook are sho w n belo w and described in T a ble 1-8.
1–30 Maintenance and Servi ce Guide Produc t D esc ription Ta b l e 1 - 8 Bottom Components Item Component Function 1 MultiBay Suppor ts an optional MultiBa y de vice, such as a drive or battery pack. 2 MultiBay release latch Allows remov al of the MultiBay drive.
Pr oduct Descr iption Maintenance and Serv ice Guide 1–31 1. 6 D e s i g n O v e r v i e w This section presents a design ov erview of ke y parts and features of the notebook. Refer to Chapter 3, “Illustrated Parts Catalog” to identify replacement parts, and Chapter 5, “Remov al and Replacement Procedures” for disassembly steps.
Maintenance and Serv ice Guide 2–1 2 Tr o u b l e s h o o t i n g Å W AR NING: Onl y authori z ed technic ians trained b y HP should re pair this equipment . All tr oubleshooting and r epair procedur es are detailed to allo w only suba ssembl y/module -lev el repair .
2–2 Maintenance and Service Guide T roubleshooting 2. 1 Compu ter Setup and Dia gnosti cs Utilities The notebook features two system management utilities: ■ Computer Setup —A system information and customization utility that can be used e ven when your operating system is not working or does not load.
T roubleshooting Maintenance and Serv ice Guide 2–3 3. T o close Computer Setup and restart the notebook: ❏ Select File > Sa ve Changes and Exit and press enter . – or – ❏ Select File > Ignore Changes and Exit and press enter . 4. When you are prompted to confirm your action, press F10 .
2–4 Maintenance and Service Guide T roubleshooting Selec ting from the Sec urity Menu Ta b l e 2 - 2 Security Menu Select T o Do This Setup P assword Enter , change, or delete a Setup pass word. The Setup pass word is called an administrator pass word in Computer Secur ity , a program accessed from the Windows Control P anel.
T roubleshooting Maintenance and Serv ice Guide 2–5 Selec ting from th e Adv anced M enu Ta b l e 2 - 3 Adv anced Menu Select T o Do This Language Change the Comp uter Setup language. Boot Options Enable/disab le: ■ QuickBoot, which starts the notebook more quickly b y eliminating some star tup tests.
2–6 Maintenance and Service Guide T roubleshooting De vice Options (continued) ■ Change the parallel por t mode from Enhanced P arallel P or t (EPP , the def ault setting) to standard, bidirectional EPP , or Enhanced Capabilities P or t (ECP). ■ Set video-out mode to NTSC (def ault), P AL, NTSC-J , or P AL-M.
T roubleshooting Maintenance and Serv ice Guide 2–7 2.2 Using Diagnos tics for W in do w s When you access Diagnostics for W indows, a scan of all system components is displayed on the screen before the diagnostics windo w opens.
2–8 Maintenance and Service Guide T roubleshooting Obtainin g, S a vin g, or Printin g Dia gnostic Te s t I n f o r m a t i o n 1. Access Diagnostics for W indows b y selecting Start > Settings > Control P anel > Diagnostics for W indows . 2.
T roubleshooting Maintenance and Serv ice Guide 2–9 6. Select the Begin T esting button. 7. Select a tab to vie w a test report: ❏ Status tab —Summarizes the tests run, passed, and failed during the current testing session.
2–10 Maintenance and Servi ce Guide T roubleshooting 2.3 T roub leshooting Flo wc har ts Ta b l e 2 - 4 T roubleshooting Flo wchar ts Overview Flowch art Description 2.1 “Flowchart 2.1—Initial T roubleshooting” 2.2 “Flowchart 2.2—No Po wer , Part 1” 2.
T roubleshooting Maintenance and Serv ice Guide 2–11 Flo wc har t 2. 1—Initi al T roubleshootin g Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device working? Go to “Flowchart 2.
2–12 Maintenance and Servi ce Guide T roubleshooting Flowch art 2.2 —No P ow er , P a rt 1 1. Reseat the power cables in the Port Replicator and at the AC outlet. 2. Ensure that the AC power source is active. 3. Ensure that the po wer strip is wo rking.
T roubleshooting Maintenance and Serv ice Guide 2–13 Flowch art 2.3—No P ow e r , P art 2 Continued from “Flowchart 2.2—No Power , Part 1” Visually check for debris in battery socket and clean if necessary . Done N Y Power on? Check battery by recharging it, moving it to another notebook, or replacing it.
2–14 Maintenance and Servi ce Guide T roubleshooting Flowch art 2.4 —No P ow er , P a rt 3 Continued from “Flowchart 2.3—No Power , Part 2” Reseat AC adapter in notebook and at power source. Internal or external AC adapter? Done Done Done Done Power on? Power on? Power on? Plug directly into AC outlet.
T roubleshooting Maintenance and Serv ice Guide 2–15 Flowch art 2.5 —No P ow er , P a rt 4 Y N Continued from “Flowchart 2.4—No Power , Part 3” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest.
2–16 Maintenance and Servi ce Guide T roubleshooting Flowchar t 2.6—No Vi deo, P ar t 1 A N Stand-alone or Port Replicator? No video. Replace the following one at a ti me. T est after each replacement. 1. Cable between notebook and no tebook display (if applicable) 2.
T roubleshooting Maintenance and Serv ice Guide 2–17 Flowchar t 2.7—No Vi deo, P ar t 2 Y N Continued from “Flowchart 2.6—No Video, Part 1” Done Adjust external monitor display .
2–18 Maintenance and Servi ce Guide T roubleshooting Flo wc har t 2.8—Nonfunc tioning P ort Repl icator Y N Reseat power cord in Port Replicator and power outlet. N Replace the following Port Replicator components one at a time. Check notebook operation after each replacement.
T roubleshooting Maintenance and Serv ice Guide 2–19 Flowch art 2.9— No OS Loa ding No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive, Part 1” Reseat power cord in Port Replicator and power outlet. No OS loading.
2–20 Maintenance and Servi ce Guide T roubleshooting Flo wc har t 2. 1 0—No OS Loading , Hard Driv e, P ar t 1 Go to “Flowchart 2.17—Nonfunction ing Device” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchart 2.
T roubleshooting Maintenance and Serv ice Guide 2–21 Flo wc har t 2. 1 1—No OS Loading , Hard Drive, P art 2 Continued from “Flowchart 2.10—No OS Loading, Hard Drive, Part 1” Reseat hard drive. Done CD or diskette in drive? 1. Replace hard drive.
2–2 2 Maintenance and Servi ce Guide T roubleshooting Flo wc har t 2. 1 2—No OS Loa ding, H ard Driv e, P ar t 3 Y System files on hard drive? Continued from “Flowchart 2.11—No OS Loading, Hard Drive, Part 2” Clean virus. Done N Install OS and reboot.
T roubleshooting Maintenance and Serv ice Guide 2–2 3 Flo wc har t 2. 1 3—No OS Loa ding , Disk ette Drive Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette and reboot notebook.
2–2 4 Maintenance and Servi ce Guide T roubleshooting Flo wc hart 2. 1 4—N o OS Loading , CD- or DV D - R O M D r iv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD- or DVD-ROM Drive. Install bootable disc and reboot notebook.
T roubleshooting Maintenance and Serv ice Guide 2–25 Flo wc har t 2. 1 5—No Au dio, P art 1 No audio. N Notebook in Port Replicator (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchart 2.
2–2 6 Maintenance and Servi ce Guide T roubleshooting Flowchar t 2. 1 6—N o Audio, P ar t 2 YN Continued from “Flowchart 2.15—No Audio, Part 1” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker .
T roubleshooting Maintenance and Serv ice Guide 2–2 7 Flo wc har t 2. 1 7—N onfunctionin g De vice Done Any physical device detected? Y N Unplug the nonfunctioning de vice from the notebook, and inspect cables and plugs for bent or broken pins or other damage.
2–2 8 Maintenance and Servi ce Guide T roubleshooting Flo wc har t 2. 1 8—N onfunctionin g K e yboard Y N OK? Keyboard not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external keyboard.
T roubleshooting Maintenance and Serv ice Guide 2–29 Flo wc har t 2. 1 9—Nonfunc tioning P oin ting De vice Y N OK? Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device.
2–30 Maintenance and Servi ce Guide T roubleshooting Flo wc har t 2.20—No Net w ork/Modem Connec tion Y Disconnect all power from the notebook and open. No network or modem connection. N Done Digital line? Network or modem jack active? Replace jack or have jack activated.
Maintenance and Serv ice Guide 3–1 3 I llustrated P arts C a talog This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers and option part numbers.
3–2 Maintenance and Service Guide Illustrated P art s Catalog 3.2 Notebook Major Com ponents Notebook Major C omponents.
Illustr ated P art s Catalog Maintenance and Serv ice Guide 3–3 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components Item Description Spare P ar t Number 1 Display assemb lies 15.
3–4 Maintenance and Service Guide Illustrated P art s Catalog Notebook Major C omponents (Continued).
Illustr ated P art s Catalog Maintenance and Serv ice Guide 3–5 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components (Continued) Item Description Spare P ar t Number Miscellaneous Cable Kit , inc.
3–6 Maintenance and Service Guide Illustrated P art s Catalog Notebook Major C omponents (Continued).
Illustr ated P art s Catalog Maintenance and Serv ice Guide 3–7 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components (Continued) Item Description Spare P ar t Number 14 Mini PCI communications boar ds 802.11a/b/g LAN NIC 802.11b/g LAN NIC 802.11b W500 modem boar d (for use in J apan) 802.
3–8 Maintenance and Service Guide Illustrated P art s Catalog *Not illustrated. Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components Item Description Spare P ar t Number.
Illustr ated P art s Catalog Maintenance and Serv ice Guide 3–9 3. 3 M iscellan eous P l asti cs Kit Com ponents Miscellaneou s Plasti cs Kit C omponents T able 3-2 Miscellaneous Plastics Kit Compon.
3–10 Maintenance and Servi ce Guide Illustrated P art s Catalog 3.4 Miscell aneous Ca ble Kit Comp one nts Miscellaneou s Cable Kit C omponents Ta b l e 3 - 3 Miscellaneous Cable Kit Components Spar.
Illustr ated P art s Catalog Maintenance and Serv ice Guide 3–11 3.5 M a s s St ora g e D e vi ces Mass St or age Dev ices T able 3-4 Mass Storage Devices Spare P ar t Number Information Item Descri.
3–12 Maintenance and Servi ce Guide Illustrated P art s Catalog 2 Optical drives 24X Max D VD+R W/R and CD-RW Combo Driv e 8X Max D VD-R OM Dr iv e 24X Max D VD/CD-R W Combo Dr iv e 24X Max CD-ROM Driv e 349242-001 349241-001 349243-001 349240-001 3 MultiBay de vices 1.
Illustr ated P art s Catalog Maintenance and Serv ice Guide 3–13 3.6 Miscell aneous Ta b l e 3 - 5 Spare P ar ts: Miscellaneous (not illustrated) Description Spare P ar t Number AC a d a p t e rs 90.
3–14 Maintenance and Servi ce Guide Illustrated P art s Catalog 3.7 Sequential P ar t Number Lis ting Ta b l e 3 - 6 Spare P ar ts: Sequential P ar t Number Listing Spare P ar t Number Description 2.
Illustr ated P art s Catalog Maintenance and Serv ice Guide 3–15 325526-001 802.11b/g LAN board mi ni PCI communications board 325814-001 Nylon, entr y le vel 325815-001 Nylon, top load, Samsung 325.
3–16 Maintenance and Servi ce Guide Illustrated P art s Catalog 341520-121 Ke yboard (including po inting stick) - F rench Canada 341520-131 K eyboard (including pointing stic k) - P or tugal 341520.
Illustr ated P art s Catalog Maintenance and Serv ice Guide 3–17 345058-001 Display assemb ly , 15.0-inch, XGA, TFT 345059-001 Display assemb ly , 15.
3–18 Maintenance and Servi ce Guide Illustrated P art s Catalog 349242-001 24X Max D VD+R W/R and CD-RW combo drive 349243-001 24X Max D VD/CD-R W combo dr ive 353395-001 Intel P entium M (D othan) processor , 2.0 GHz 356596-001 Intel P entium M (D othan) processor , 1.
Maintenance and Serv ice Guide 4–1 4 Remo v al and Repla cement Preliminaries This chapter provides essential information for proper and safe remov al and replacement service.
4–2 Maintenance and Service Guide Remo val and R eplacement Preliminar ies 4.2 Ser vice Consi derations The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures.
Remo val and R eplacement Pr eliminaries Maintenance and Serv ice Guide 4–3 4.3 Pre v entin g Dama ge to Re mo v able Dri v es Remov able driv es are fragile components that must be handled with care.
4–4 Maintenance and Service Guide Remo val and R eplacement Preliminar ies 4.4 Pre v enting El ectrosta tic Dam ag e Many electronic components are sensiti ve to electrostatic discharge (ESD). Circuitry design and structure determine the degree of sensiti vity .
Remo val and R eplacement Pr eliminaries Maintenance and Serv ice Guide 4–5 4.5 P ac k aging and T ransportin g Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes.
4–6 Maintenance and Service Guide Remo val and R eplacement Preliminar ies 4.6 W orks tation Precau tions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with approve d static-shielding material (refer to T able 4-2 ).
Remo val and R eplacement Pr eliminaries Maintenance and Serv ice Guide 4–7 4.7 Groundin g Equip ment an d Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system.
4–8 Maintenance and Service Guide Remo val and R eplacement Preliminar ies T able 4-1 shows ho w humidity affects the electrostatic v oltage le vels generated by dif ferent activities. T able 4-2 lists the shielding protection provided by antistatic bags and floor mats.
Maintenance and Serv ice Guide 5–1 5 Remo v al and Repla cement Procedur es This chapter provides remo val and replacement procedures. There are 62 scre ws in eight dif ferent sizes that must be removed, replaced, and loosened when servicing the notebook.
5–2 Maintenance and Service Guide Remo val and R eplacement Procedur es 5. 1 S e r i a l N u m b e r Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–3 5 .2 D isassembly Se quence Ch art Use the chart belo w to determine the section number to be referenced when removing notebook components. Disassembl y Sequence Char t Section Description # of Screws Removed 5.
5–4 Maintenance and Service Guide Remo val and R eplacement Procedur es Section Description # of Screws Removed 5.20 Speaker 6 5.21 T ouchPad 3 5.22 F an assemb ly 4 5.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–5 5 .3 Preparing t he Notebook for Disasse mbly Before you begin an y removal or installation procedures: 1.
5–6 Maintenance and Service Guide Remo val and R eplacement Procedur es 4. Remov e the battery pack by follo wing these steps: a. T urn the notebook upside do wn with the front facing you. b . Slide and hold the battery release latch 1 to ward the back of the notebook.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–7 5. Remov e the battery bezel by sliding it down and of f of the battery pack. ✎ The battery bezel is included in the Miscellaneous Plastics Kit, spare part number 345066-001.
5–8 Maintenance and Service Guide Remo val and R eplacement Procedur es 6. Remov e the hard driv e by following these steps: a. T urn the notebook upside do wn with the front facing you. b . Remo ve the T8M2.0×6.0 hard driv e cover scre w 1 . c. Slide and hold the tab on the hard dri ve cov e r to the left 2 .
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–9 e. Use the Mylar tab 1 to slide the hard dri ve to the right 2 to disconnect it from the system board.
5–10 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es g. Remov e the two T5M2.5×4.0 screws 1 and the two PM3.0×3.5 scre ws 2 that secure the hard driv e to the hard dri ve frame. h. Use a 4.0-mm socket to remo ve the two M2.0×10.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–11 5 .4 Notebook Feet The notebook feet are adhesi ve-backed rubber pads. The feet are included in the Miscellaneous Plastics Kit, spare part number 345066-001. The feet attach to the base enclosure as illustrated belo w .
5–12 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5. 5 M u l t i B ay D evi c e 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the left side facing you. 3. Slide and hold the MultiBay release latch to ward you 1 .
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–13 5 .6 Bluetoot h Board 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the left side facing you. 3. Remov e the T8M2.0×6.
5–14 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5. Disconnect the Bluetooth cable from the Bluetooth board 1 and the system board 2 . ✎ The Bluetooth cable is included with the Bluetooth board and is also included in the Miscellaneous Cables Kit, spare part number 345056-001.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–15 5 .7 Integra ted Smart C ard ✎ The integrated smart card is located in the bottom PC Card slot. 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e any PC Card or spacer from the top PC Card slot.
5–16 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es ✎ The integrated smart card bezel is included in the Miscellaneous Plastics Kit, spare part number 345066-001. 5. Eject the smart card from the notebook using a flat-bladed tool to press the small metal eject tab 1 to the left of the smart card.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–17 5 .8 O ptical Driv e 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the right side facing you. 3. Remov e the T8M2.0×6.
5–18 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5. 9 Ke y b o a r d 1. Prepare the notebook for disassembly (refer to Section 5.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–19 3. Remov e the T8M2.×6.0 screw that secures the ke yboard to the notebook.
5–20 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 4. T urn the notebook right-side up with the front facing you. 5. Open the notebook. 6. Slide the four tabs 1 on the top edge of the ke yboard to ward you. 7. Lift the rear edge of the ke yboard up and swing it toward you 2 until it rests on the palm rest.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–21 8. Release the zero insertion force (ZIF) connector 1 to which the pointing stick cable is attached and disconnect the cable 2 . 9. Release the ZIF connector 3 to which the ke yboard cable is attached and disconnect the cable 4 .
5–2 2 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5 . 1 0 Mem ory Expansion Board 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Spread the retaining tabs 1 that secure the memory expansion board to the sock et.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–2 3 5 . 1 1 Modem Board 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Remov e the two T8M2.0×4.0 screws 1 that secure the modem board to the notebook.
5–2 4 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5. T urn the modem board upside do wn 1 . 6. Disconnect the modem cable 2 from the modem. Disconnecting the Modem Boar d Cable 7. Remov e the modem board. Re verse the abo ve procedure to install the modem board.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–25 ✎ Some computer models hav e two T orx7 with pin security screws (M2.0×4.0) securing the Mini PCI communications board to the computer . A T7 pin bit scre w driv er is required to remove the Mini PCI communications board on these computer models.
5–2 6 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5. Disconnect the two antenna cables 1 from the board. Make note of which cable connects to which terminal. 6. Spread the retaining tabs 2 that secure the Mini PCI communications board to the socket.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–2 7 5. 1 3 H e a t S i n k 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Remov e the fi ve T8M2.0×4.0 screws 1 that secure the heat sink to the notebook.
5–2 8 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es ✎ Carefully clean any thermal grease residue from the heat sink 1 and processor surfaces 2 each time you remov e the heat sink.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–29 5. 1 4 P r o c e s s o r 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Remov e the heat sink (refer to Section 5.
5–30 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 4. Use a flat-bladed scre wdriver to turn the processor locking scre w one-quarter turn counterclockwise 1 .
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–31 5. 1 5 L E D Sw i t c h C ove r 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the rear facing you. 3. Remov e the T8M2.
5–3 2 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 4. T urn the notebook right-side up with the front facing you. 5. Open the notebook. 6. Lift the left 1 and right 2 sides of the LED switch cov er to disengage the cov er from the notebook.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–33 5. 1 6 R TC B a t t e r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 345066-001. 1. Prepare the notebook for disassembly (refer to Section 5.
5–34 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5 . 1 7 Securit y Module ( TP M) 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the LED switch cover (refer to Section 5.15 ). 3. Remov e the PM3.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–35 5 . 1 8 Displa y Assembl y 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Disconnect the wireless antenna cables from the Mini PCI wireless communications board (refer to Section 5.
5–3 6 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 7. Position the notebook with the rear facing to ward you. 8. Remov e the two T8M2.0×6.0 screws 1 that secure the display hinge cov ers to the notebook. 9. Remov e the two T8M2.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–3 7 10. Lift the display assembly straight up 1 to remov e it from the notebook. 11. If necessary , remo ve the display hinge cov ers 2 from the display assembly . ✎ The display hinge cov ers are included in the Miscellaneous Plastics Kit, spare part number 345066-001.
5–38 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5. 1 9 To p C ove r 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Remov e the LED switch cover (refer to Section 5.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–39 7. T urn the notebook right-side up with the front facing you. 8. Remov e the TM2.
5–40 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 10. Disconnect the speaker 1 and microphone cables 2 . 11. Release the ZIF connector 3 to which the T ouchPad cable is attached and disconnect the T ouchPad cable 4 from the system board.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–41 5 .20 Speak er ✎ The speaker is included with the top co ver , spare part number 345061-001. 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K eyboard (refer to Section 5.
5–4 2 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5. 2 1 T o u c h Pa d ✎ The T ouchPad and bracket are included with the top co ver , spare part number 345061-001. 1. Prepare the notebook for disassembly (refer to Section 5.
Remo val and Replace ment Procedur es Maintenance and Servi ce Guide 5–4 3 4. Remov e the bracket. 5. Remov e the T ouchP ad 1 from the top cover . 6. Release the ZIF connector 2 to which the T ouchPad cable is attached and disconnect the cable 3 . Re mov ing the T ouc hP ad Re verse the abo ve procedure to install the T ouchPad and bracket.
5–44 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5 .2 2 F an Asse mbly 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K eyboard (refer to Section 5.9 ) ❏ Heat sink (refer to Section 5.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–45 2. Disconnect the fan cable 1 . 3. Remov e the T8M2.0×4.0 screw 2 that secures the fan assembly to the notebook. 4. Remov e the fan assembly 3 from the notebook. 5. Remov e the three PM1.
5–46 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 5. 23 Sys t e m B o a r d ✎ When replacing the system board, ensure that the follo w ing components are remov ed from the defectiv e system board and installed on the replacement system board: ■ Memory expansion boards (refer to Section 5.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–4 7 2. Remov e the four T8M2.0×4.0 screws that secure the system board to the notebook.
5–48 Maintenance and Servi ce Guide Remo val and R eplacement Procedur es 3. Flex and hold the front right corner of the base enclosure out 1 to allo w the system board to clear the base enclosure. 4. Lift the front edge of the system board 2 until the board clears the base enclosure.
Remo val and Replace ment Procedur es Maintenance and Serv ice Guide 5–49 6. If necessary , disconnect the modem cable from the system board and remov e the cable. ✎ The modem cable is included in the Miscellaneous Cables Kit, spare part number 345056-001.
Maintenance and Serv ice Guide 6–1 6 Spec if ica tions This chapter provides physical and performance specif ications. Ta b l e 6 - 1 Notebook Dimensions Height Width Depth 4.1 cm 32.6 cm 27.5 cm 1.61 in 12.83 in 10.83 in W eight (with main batter y pack and MultiBa y weight sav er) 2.
6–2 Maintenance and Service Guide Spe c i ficat ions Altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) 0 to 3,048 m 0 to 9,144 m 0 to 10,000 ft 0 to 30,000 ft Sh.
Specific atio ns Maintenance and Serv ice Guide 6–3 Ta b l e 6 - 2 15.0-inch, UXGA, TFT Displa y Dimensions Height Width Diagonal 29.9 cm 22.8 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 140 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
6–4 Maintenance and Service Guide Spe c i ficat ions Ta b l e 6 - 3 15.1-inch, SXGA+, TFT Displa y Dimensions Height Width Diagonal 29.9 cm 22.8 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 150:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
Specific atio ns Maintenance and Serv ice Guide 6–5 Ta b l e 6 - 4 15.0-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 29.9 cm 22.8 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 150:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m at Configuration 0.
6–6 Maintenance and Service Guide Spe c i ficat ions T able 6-5 Hard Drives 80-GB 60-GB 40-GB User capacity per drive 1 80 GB 60 GB 40 GB Dimensions Height Width We ig h t 9.
Specific atio ns Maintenance and Serv ice Guide 6–7 Ta b l e 6 - 6 External A C Adapter W eight A C adapter Po w e r c o r d 0.29 kg 0.13 kg 0.65 lb 0.29 lb P ower supply Operating v oltage Operating current Operating frequency range Maximum transient 90 to 264 V A C RMS 1.
6–8 Maintenance and Service Guide Spe c i ficat ions T able 6-8 24X Max D VD+R W/R and CD-R W Combo Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A u dio CD.
Specific atio ns Maintenance and Serv ice Guide 6–9 T able 6-9 24X Max D VD/CD-R W Combo Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A u dio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F o rm 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.
6–10 Maintenance and Servi ce Guide Spe c i ficat ions T able 6-10 8X D VD-ROM Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A u dio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F o rm 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.
Specific atio ns Maintenance and Serv ice Guide 6–11 T able 6-11 24X CD-ROM Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A u dio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F o rm 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.
6–12 Maintenance and Servi ce Guide Spe c i ficat ions T able 6-12 System DMA Hard ware DMA System Function DMA0 A vailab le for audio DMA1* Entertainment audio (default; alternate = DMA0, DMA3, non.
Specific atio ns Maintenance and Serv ice Guide 6–13 T able 6-13 System Interrupts Hard ware IRQ System Function IRQ0 System timer IRQ1 Ke yboard controller IRQ2 Cascaded IRQ3 COM2 IRQ4 COM1 IRQ5 Au.
6–14 Maintenance and Servi ce Guide Spe c i ficat ions T able 6-14 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller 1 010 - 01F Unused 020 - .
Specific atio ns Maintenance and Serv ice Guide 6–15 I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor b .
6–16 Maintenance and Servi ce Guide Spe c i ficat ions I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared port 300 - 31F Unused 320 - 36F Unused 370 - 37.
Maintenance and Serv ice Guide A–1 A Conn ec tor P in As signmen ts Ta b l e A - 1 RJ-45 Network Interface Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receive – 3 Receiv e + 7 U.
A–2 Maintenance and Service Guide Connec tor Pin As signments Ta b l e A - 2 RJ-11 Modem Pin Signal Pin Signal 1 TX+ (ISDN modem) 4 Ring (modem) 2 TX- (ISDN modem) 5 RX+ (ISDN modem) 3 Tip (modem) 6.
Connec tor P in Assignments Maintenance and Serv ice Guide A–3 Ta b l e A - 4 S-Video Pin Signal Pin Signal 1 Ground (Y) 3 Y -Luminance (Intensity) 2 Ground (C) 4 C-Chrominance (Color) Ta b l e A - .
A–4 Maintenance and Service Guide Connec tor Pin As signments Ta b l e A - 6 A udio Line-Out Pin Signal 1G r o u n d 2 Left audio out 3 Right audio out Ta b l e A - 7 Microphone Pin Signal Pin Signa.
Connec tor P in Assignments Maintenance and Serv ice Guide A–5 Ta b l e A - 8 P arallel Pin Signal Pin Signal 1 Strobe 14 A uto linefeed 2 Data bit 0 15 Error 3 Data bit 1 16 Initialize paper 4 Data.
A–6 Maintenance and Service Guide Connec tor Pin As signments Ta b l e A - 9 Serial Pin Signal Pin Signal 1 Carrier detect 6 Data set ready 2 Receiv e data 7 Ready to send 3 T ransmit data 8 Clear t.
Maintenance and Serv ice Guide B–1 B P o w er C ord Requirements The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 V A C. The po wer cord included with the notebook meets the requirements for use in the country where the equipment is purchased.
B–2 Maintenance and Service Guide P o wer Cor d Requirements Gen eral Requirements The requirements listed belo w are applicable to all countries: ■ The length of the po wer cord must be at least 1.
P o wer Cor d Requir ements Maintenance and Serv ice Guide B–3 Countr y-Spec ific Requirements 3-Conductor P ower Cor d Requirements Country Accredited Agency Applicable Note Number A ustralia EANSW.
B–4 Maintenance and Service Guide P o wer Cor d Requirements United Kingdom BSI 1 United States UL 2 Notes 1. The fle xible cord must be <HAR> T ype HO5VV -F , 3-conductor, 1.
Maintenance and Serv ice Guide C–1 C Sc r e w Li sting This appendix provides specif ication and reference information for the scre ws used in the notebook. All screws listed in this appendix are av ailable in the Miscellaneous Screw Kit, spare part number 345057-001.
C–2 Maintenance and Servi c e Guide Scr ew Listing Ta b l e C - 1 T orx T5M2.5×4.0 Screw Color Qty . Length Thread Head Width Silver 2 4 .0 mm 2.5 mm 5.0 mm Where used: 1 T wo screws that secure the hard drive to the hard drive fr ame (documented in Section 5.
Sc rew Li st i ng Maintenance and Serv ice Guide C–3 T orx T5M2 . 5×4.0 S cre w , Phillips P M3. 0×3 . 5 Scr ew , and M2 . 0×10.0 Ali gnment Pin L ocations.
C–4 Maintenance and Servi c e Guide Scr ew Listing T orx T8M2 . 0×6. 0 Sc re w Locations Ta b l e C - 4 T orx T8M2.0×6.0 Screw Color Qty . Length Thread Head Width Black 27 6.0 mm 2.0 mm 5.0 mm Where used: 1 One screw that secures the har d driv e cover to the notebook (documented in Section 5.
Sc rew Li st i ng Maintenance and Serv ice Guide C–5 T orx T8M2 . 0×6. 0 Sc re w Locations Ta b l e C - 4 T orx T8M2.0×6.0 Screw (Continued) Color Qty . Length Thread Head Width Black 27 6.0 mm 2.0 mm 5.0 mm Where used: Se venteen screws that secure the top co ver to the notebook (documented in Section 5.
C–6 Maintenance and Servi c e Guide Scr ew Listing T orx T8M2 . 0×6. 0 Sc re w Location Ta b l e C - 4 T orx T8M2.0×6.0 Screw (Continued) Color Qty . Length Thread Head Width Black 27 6.0 mm 2.0 mm 5.0 mm Where used: One screw that secures the speak er to the top cover (documented in Section 5.
Sc rew Li st i ng Maintenance and Serv ice Guide C–7 Phillips P M1.5×3 . 0 Scr ew L ocations Ta b l e C - 5 Phillips PM1.5×3.0 Screw Color Qty . Length Thread Head Width Black 3 3.0 mm 1.5 mm 3.0 mm Where used: T wo screws that secure the Bluetooth board to the Bluetooth cov er (documented in Section 5.
C–8 Maintenance and Servi c e Guide Scr ew Listing P h i l l i p s PM3. 5 × 3.0 S cre w Lo c a t i on Ta b l e C - 6 Phillips PM3.5×3.0 Screw Color Qty . Length Thread Head Width Black 3 3.0 mm 1.5 mm 3.5 mm Where used: One screw that secures the secu rity card to the system board (documented in Section 5.
Sc rew Li st i ng Maintenance and Serv ice Guide C–9 T orx T8M2 . 0×4. 0 Scr ew L ocations Ta b l e C - 7 T orx T8M2.0×4.0 Screw Color Qty . Length Thread Head Width P ewter 20 4.0 mm 2.0 mm 5.0 mm Where used: 1 T wo screws that secure the mo dem board to the system board (documented in Section 5.
C–10 Maintenance and Servi ce Guide Scr ew Listing T orx T8M2 . 0×4. 0 Scr ew L ocations Ta b l e C - 7 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width P ewter 20 4.0 mm 2.0 mm 5.0 mm Where used: Five scre ws that secure the speaker to the top cov er (documented in Section 5.
Sc rew Li st i ng Maintenance and Serv ice Guide C–11 T orx T8M2 . 0×4.0 S cre w Locati on Ta b l e C - 7 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width P ewter 20 4.0 mm 2.0 mm 5.0 mm Where used: One screw that secures the f an assembly to the notebook (documented in Section 5.
C–12 Maintenance and Servi ce Guide Scr ew Listing T orx T8M2 . 0×4. 0 Scr ew L ocations Ta b l e C - 7 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width P ewter 20 4.0 mm 2.0 mm 5.0 mm Where used: F our screws that secure the system board to the notebook (documented in Section 5.
Sc rew Li st i ng Maintenance and Serv ice Guide C–13 T orx T8M2 . 0×3 .5 Sc re w Locations Ta b l e C - 8 T orx T8M2.0×3.5 Screw Color Qty . Length Thread Head Width Silver 3 3 .5 mm 2.0 mm 5.0 mm Where used: Three screws that secure the T ouc hP ad and brack e t to the top co ver (documented in Section 5.
C–14 Maintenance and Servi ce Guide Scr ew Listing Phillips P M1. 5×4.0 Sc re w Locations Ta b l e C - 9 Phillips PM1.5×4.0 Screw Color Qty . Length Thread Head Width Black 3 4.0 mm 1.5 mm 3.0 mm Where used: Three screws that secure the f an to the fan housing (documented in Section 5.
Maintenance and Serv ice Guide Index–1 Inde x 1394 connector 1–21 A AC adapter spare part number 3–13 , 3–14 specifications 6–7 application key 1–24 audio line-out jack location 1–19 pin.
Index–2 Maintenance and Servi ce Guide Index Computer Setup Advanced Menu 2–5 File Menu 2–3 overview 2–2 Security Menu 2–4 connector pin assignments audio line-out jack A–4 external monito.
Index Maintenance and Serv ice Guide Index–3 E electrostatic discharge 4–4 , 4–8 external monitor connector location 1–22 pin assignments A–3 F f1 through f12 function keys 1–24 fan assemb.
Index–4 Maintenance and Servi ce Guide Index M mass storage devices, spare part numbers 3–11 memory expansion board illustrated 3–4 , 3–6 removal 5–22 spare part numbers 3–5 , 5–22 micro.
Index Maintenance and Serv ice Guide Index–5 P packing precautions 4–5 parallel connector location 1–22 pin assignments A–5 password, clearing 1–16 PC Card eject buttons 1–19 PC Card slots.
Index–6 Maintenance and Servi ce Guide Index smart card removal 5–15 spare part number 3–5 , 5–15 speaker, removal 5–41 specifications AC adapter 6–7 battery pack 6–7 CD-ROM Drive 6–11.
Index Maintenance and Serv ice Guide Index–7 U Universal Serial Bus (USB) connector location 1–21 pin assignments A–2 V vent 1–22 , 1–26 video troubleshooting 2–16 volume control buttons 1.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il HP (Hewlett-Packard) nw8000 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del HP (Hewlett-Packard) nw8000 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso HP (Hewlett-Packard) nw8000 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul HP (Hewlett-Packard) nw8000 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il HP (Hewlett-Packard) nw8000, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del HP (Hewlett-Packard) nw8000.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il HP (Hewlett-Packard) nw8000. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo HP (Hewlett-Packard) nw8000 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
