Manuale d’uso / di manutenzione del prodotto B9700LANQMR del fabbricante Toshiba
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TEC Thermal Printer B-SX4T/SX5T SERIES Document No. EO10-33013B Original Jan., 2003 (Revised Feb., 2003 ) Jan., 2006 ) Product Descri p tion PRINTED IN JAPAN.
EO10-33013B (Revision Date: May 22, 2009) TABLE OF CONTENTS Page 1. OUTLINE ------------------------------------------------------------------------------------------------- 1- 1 1.1 PRINTER SPECIFICATIONS --------------------------------------------------------------------------- 1- 1 1.
1. OUTLINE EO10-33013B (Revision Date: Jan 22, 2009) 1.1 PRINTER SPECIFICATIONS 1- 1 1. OUTLINE 1.1 PRINTER SPECIFICATIONS 1) Various bar codes, characters and graphic data can be printed using both thermal transfer and thermal direct methods.
1. OUTLINE EO10-33013B (Revision Date: May 18, 2006) 1.3 APPEARANCE AND DIMENSIONS (APPROXIMATE) 1- 2 1.3 APPEARANCE AND DIMENSIONS (APPROXIMATE) 1.3.1 Front View/Rear View Front View Rear View 1.3.2 Operation Panel LCD Message Display When the power is turned on and it is ready to print, ON LINE is displayed.
1. OUTLINE EO10-33013B 1.4 BASIC SPECIFICATIONS 1- 3 1.4 BASIC SPECIFICATIONS 1) Printing method ................... Thermal direct printing or thermal transfer printing 2) Print head [B-SX4T: 4 inches] (1) Total number of dots ...... 832 dots (3) Effective print width .
1. OUTLINE EO10-33013B 1.4 BASIC SPECIFICATIONS 1- 4 8) Magnification of bar code UPC/EAN/JAN/CODE93/128/PDF417 ......... Up to 6 modules can be automatically calculated using 1-module width designation (1 to 15 dots). Dots/Module Bar code 2 3 4 5 6 7 8 Min.
1. OUTLINE EO10-33013B 1.4 BASIC SPECIFICATIONS 1- 5 12) White or black background all types of characters are available. 13) Character rotation ......
1. OUTLINE EO10-33013B (Revision Date: Jan. 22, 2009) 1.5 ELECTRONICS SPECIFICATIONS 1- 6 (3) Auto cut mechanism (Option) When the cutter module is installed, the backing paper of the label stock or tag paper is cut individually (stop and cut).
1. OUTLINE EO10-33013B (Revision Date: Jan. 22, 2009) 1.5 ELECTRONICS SPECIFICATIONS 1- 7 Specification of t he MAIN4 PC Board Hardware Softw are Model Flash ROM RAM Kanji ROM (IC7) Kanji Font Registr.
1. OUTLINE EO10-33013B 1.5 ELECTRONICS SPECIFICATIONS 1- 8 XON/XOFF (DC1/DC3) protocol + READY/BUSY (DTR) protocol • When initialized after power on, this printer becomes ready to receiv e data and converts the DTR signal to "High" level (READY).
1. OUTLINE EO10-33013B 1.5 ELECTRONICS SPECIFICATIONS 1- 9 l Interface circuit Input circuit Output circuit Signal level Input voltage: "H" .. +3V~ + 15V Output voltage: "H" .. +6V ~ +13V "L" ... –3V~ – 15V "L" .
1. OUTLINE EO10-33013B 1.5 ELECTRONICS SPECIFICATIONS 1-10 (3) Expansion I/O interface (B-SX4T: Option) Interface circuit Input circuit There are six input circuits, and each input is a current loop using a photo-coupler. The anode of the photo-coupler is connected to common pin COM1 in each of the six circuits.
1. OUTLINE EO10-33013B 1.5 ELECTRONICS SPECIFICATIONS 1-11 (4) USB c Standard: Conforming to Rev. 1.1 d Transfer type: Control transfer, Bulk transfer e Transfer rate: Full speed (12M bps) (5) Network.
1. OUTLINE EO10-33013B 1.5 ELECTRONICS SPECIFICATIONS 1-12 Feed gap sensor (Transmissive sensor) This sensor detects the difference in potential between the backing paper and the label to find the print position of t he label. The feed gap sensor is lo cated at 8 mm to the right of the black mark sensor.
1. OUTLINE EO10-33013B 1.5 ELECTRONICS SPECIFICATIONS 1-13 (5) Slit sensor (Transmissive sensor) This sensor detects the rotation count of the ribbon shaft and the ribbon motors. The ribbon motors torque works to take up slack in the ribbon and is dependent on the detected count.
1. OUTLINE EO10-33013B 1.5 ELECTRONICS SPECIFICATIONS 1-14 (7) Rewind full sensor (Transmissive sensor) This sensor detects that the built- in rewinder is full when winding backing paper or printed media onto the take-up spool. It is positioned at 316.
2. SUPPLY SPECIFICATIONS EO10-33013B 2.1 MEDIA 2- 1 2. SUPPLY SPECIFICATIONS Information regarding the supply specifications contained in Product Description is essential to service engineers. Detail specifications and other information on the media and ribbon are described in Supply Manual by model.
2. SUPPLY SPECIFICATIONS EO10-33013B 2.1 MEDIA 2- 2 76.2 mm 10.0 ~ 1500.0 mm 2.0 ~ 10.0 mm Black Mark Min.12 mm 3 00~1 1 20m m Print Side Label Max. 200.0 2 .0~20.0 mm Backing P aper Label 1.5 mm 1.5 mm 10.0 ~ 1500.0m m NOTES: 1. To ensure print quality and print head life use only TOSHIBA TEC specified media.
2. SUPPLY SPECIFICATIONS EO10-33013B 2.1 MEDIA 2- 3 Printing Area Printing Area Cut P osition 1.0 m m 2 mm 2 mm 1.0 m m 1.5 mm 1.5 mm 1.5 mm 1.5 mm Black Mark < Non Print Area > 3) Relationship between the head effective print width and paper. [B-SX4T] [B-SX5T] NOTE: The specifications differ depending on the issue mode.
2. SUPPLY SPECIFICATIONS EO10-33013B 2.2 RIBBON 2- 4 2.2 RIBBON No. Item Specification 1 Shape Spool type B-SX4T 41 to 112 mm 2 Width B-SX5T 41 to 134 mm 3 Max. length 600 m 4 Max. OD ø 90 mm 5 Back treatment Coated Material Cardboard 6 Core Shape See the following figures.
2. SUPPLY SPECIFICATIONS EO10-33013B 2.3 CARE AND HANDLING OF THE MEDIA AND RIBBON 2- 5 2.3 CARE AND HANDLING OF THE MEDIA AND RIBBON • Do not store the media and ribbon for longer than the manufactures recommended shelf life.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.4 SPECIFICATION OF RFID TAG (for B-9704-RFID-U1-US/EU-R, H1-QM-R) 2- 6 2.4 SPECIFICATION OF RFID TAG (fo r B-9704-RFID-U1-US/EU-R, H1-QM-R) 2.4.1 General Description The RFID supplies are RFID tag (wireless IC tag) inlays designed to be converted into tag and label applications.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.4 SPECIFICATION OF RFID TAG (for B-9704-RFID-U1-US/EU-R, H1-QM-R) 2- 7 2.4.3 Location of RFID Tag The location of an RFID tag on a label influences on the accuracy of writing data on the RFID tag.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.4 SPECIFICATION OF RFID TAG (for B-9704-RFID-U1-US/EU-R, H1-QM-R) 2- 8 (2) X-ident’s ISO 18000-6B Tag It is recommended to locat.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.4 SPECIFICATION OF RFID TAG (for B-9704-RFID-U1-US/EU-R, H1-QM-R) 2- 9 5) Cutter When an RFID label or tag is used in cut issue mode, care must be taken not to cut an antenna of the RFID tag or an IC chip in order not to damage the cutter.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.4 SPECIFICATION OF RFID TAG (for B-9704-RFID-U1-US/EU-R, H1-QM-R) 2-10 10) Strip Issue Stripping performance in strip issue mode depends on the type of glue, tag, and backing paper.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.5 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-EU/AU -R) 2-11 2.5 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-EU/AU-R) 2.5.1 General Description The RFID supplies are RFID tag (wireless IC tag) inlays designed to be converted into tag and label applications.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.5 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-EU/AU -R) 2-12 (1) UPM Raflatac’s Rafsec Short Dipole 2 Tag It is recommended t.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: May 29, 2008) 2.5 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-EU/AU -R) 2-13 2.5.4 Short-pitch Tag A short-pitch tag kit is supplied with the B-SX704-RFID-U2-EU/AU-R to enable the RFID kit to encode short-pitch tags properly.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.5 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-EU/AU -R) 2-14 3) Roll-type RFID Supplies When RFID supplies are to be rolled, roll hardness must be concerned. Although it depends on the type of glue, tag, and backing paper, RFID-tag embedded labels tend to stay rolled.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.5 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-EU/AU -R) 2-15 7) Printing on Bump (Chip/Antenna) Area Embedding RFID tags in labels creates bumps in a chip/ante nna area in the labels, causing incomplete printing.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.5 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-EU/AU -R) 2-16 10) Caution for minimum label pitch length When short-pitch media is used, data may be written on a next RFID tag instead of the target RFID tag.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Apr. 24, 2008) 2.5 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-EU/AU -R) 2-17 2.5.6 Improvement of Writing Accuracy As RFID tags use wireless technologies, writing data on the RFID tag may fail depending on environment and characteristics of the RFID tags.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Feb. 6, 2009) 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2-18 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2.6.1 General Description The RFID supplies are RFID tag (wireless IC tag) inlays designed to be conv erted into tag and label applications.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Jul. 15, 2008) 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2-19 (1) Avery Dennison AD-222 Tag It is recommended to locate the vertical center of an RFID tag at 35 mm ± 3 mm from a leading edge of a label and align the horizontal center with the horizontal center of the label.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Jul. 15, 2008) 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2-20 (2) Alien Squiggle Tag It is recommended to locate the vertical center of an RFID tag at 35 mm ± 3 mm from a leading edge of a label and align the horizontal center with the horizontal center of the label.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Jul. 15, 2008) 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2-21 2.6.4 Short-pitch Tag A short-pitch tag kit is supplied with the B-SX704-RFID-U2-US-R to enable the RFID kit to encode short-pitch tags properly.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Jul. 15, 2008) 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2-22 2.6.5 Cautions for using RFID Tags 1) Lift-up of Print Head An RFID tag chip or the thermal head may be damaged when the thermal head passes over the chip.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Jul. 15, 2008) 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2-23 7) Printing on Bump (Chip/Antenna) Area Embedding RFID tags in labels creates bumps in a chip/ante nna area in the labels, causing incomplete printing.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Jul. 15, 2008) 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2-24 10) Caution for minimum label pitch length When short-pitch media is used, data may be written on a next RFID tag instead of the target RFID tag.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: Jul. 15, 2008) 2.6 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-US-R) 2-25 2.6.6 Improvement of Writing Accuracy As RFID tags use wireless technologie s, writi ng data on the RFID tag may fail depending on environment and characteristics of the RFID tags.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: May 22, 2009) 2.7 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-CN -R) 2-26 2.7 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-CN-R) 2.7.1 General Description The RFID supplies are RFID tag (wireless IC tag) inlays designed to be converted into tag and label applications.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: May 22, 2009) 2.7 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-CN -R) 2-27 (1) Omron Wave tag It is recommended to locate the vertical center of an RFID tag at 38 mm ± 3 mm from a leading edge of a label and align the horizontal center with the horizontal center of the label.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: May 22, 2009) 2.7 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-CN -R) 2-28 2.7.4 Short-pitch Tag A short-pitch tag kit is supplied with the B-SX704-RFID-U2-CN-R to enable the RFID kit to encode short-pitch tags properly.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: May 22, 2009) 2.7 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-CN -R) 2-29 7) Printing on Bump (Chip/Antenna) Area Embedding RFID tags in labels creates bumps in a chip/ante nna area in the labels, causing incomplete printing.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: May 22, 2009) 2.7 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-CN -R) 2-30 10) Caution for minimum label pitch length When short-pitch media is used, data may be written on a next RFID tag instead of the target RFID tag.
2. SUPPLY SPECIFICATIONS EO10-33013B (Revision Date: May 22, 2009) 2.7 SPECIFICATION OF RFID TAG (for B-SX704-RFID-U2-CN -R) 2-31 2.7.6 Improvement of Writing Accuracy As RFID tags use wireless technologies, writing data on the RFID tag may fail depending on environment and characteristics of the RFID tags.
3. OPTIONAL KIT EO10-33013B (Revision Date: May 22, 2009) 3. OPTIONAL KIT 3- 1 3. OPTIONAL KIT Applicable Model Option Name Type B-SX4T/5T- QQ/QP B-SX4T/5T-QM-R Use B-4205-QM O X Swing cutter module B-4205-QM-R X O B-8204-QM O X Rotary cutter module B-8204-QM-R X O This cutter module uses a swing or rotary cutter.
3. OPTIONAL KIT EO10-33013B 3.1 CUTTER MODULE: B-4205-QM/QM-R (Swing Cutter), B-8204-QM/QM-R (Rotary Cutter) 3- 2 3.1 CUTTER MODULE: B-4205-QM/QM-R (Swing Cutter), B-8204-QM/QM-R (Rotary Cutter) This compact cutter module uses a built-in swing/rota ry cutter.
3. OPTIONAL KIT EO10-33013B 3.5 PCMCIA INTERFACE BO ARD: B-9700-PCM-QM/QM-R 3- 3 3.5 PCMCIA INTERFACE BOARD: B-9700-PCM-QM/QM-R The PCMCIA Interface board allows use of the following ATA card, LAN card, or flash memory card when connected to the CPU PC board.
3. OPTIONAL KIT EO10-33013B (Revision Date: Feb. 15,2007) 3.9 RFID MODULE: B-9704-RFID-U1-US /U1-EU/U1-EU-R/H1-QM/H1-QM-R 3- 4 3.9 RFID MODULE: B-9704-RFID-U1-U S/U1-EU/U1-EU-R/H1-QM/H1-QM-R Installing this module enables the printer to write data on an RFID tag as well as to print on the surface of RFID supplies.
3. OPTIONAL KIT EO10-33013B (Revision Date: May 22,2009) 3.10 RFID MODULE: B-SX704-RFID-U2-EU/AU/US-R 3- 5 3.10 RFID MODULE: B-SX704-RFID-U2-EU/AU/US/CN-R Installing this module enables the printer to write data on an RFID tag as well as to print on the surface of RFID supplies.
3. OPTIONAL KIT EO10-33013B (Revision Date: May 22,2009) 3.10 RFID MODULE: B-SX704-RFID-U2-EU/AU/US-R 3- 6 To use this device, printer firmware V4.7 or great er is required. Upgrade the firmware to V4.5 or greater, if necessary. For the downloading procedur e, refer to Section 7 PROGRAM DOWN LOAD.
3. OPTIONAL KIT EO10-33013B (Revision Date: Apr. 24, 2008) 3.11 Wireless LAN Board: B-9700-WLAN-QM-R 3- 7 3.11 Wireless LAN Board: B-9700-WLAN-QM-R Hardware Specification Item Specification Wired LAN part Connected to a wi red LAN port of the printer.
3. OPTIONAL KIT EO10-33013B (Revision Date: Apr. 24, 2008) 3.11 Wireless LAN Board: B-9700-WLAN-QM-R 3- 8 Country code As available frequency bands are different from c ountry to country, be sure to set a country code before installing a wireless LAN module in a u ser’s printer.
3. OPTIONAL KIT EO10-33013B (Revision Date: Apr. 24, 2008) 3.11 Wireless LAN Board: B-9700-WLAN-QM-R 3- 9 NOTE : MAC address can be checked by using “arp -a” comm and on MS-DOS Prom pt. <Example> The following screen shows an example of exec uting an arp –a command on MS-DOS Prompt.
3. OPTIONAL KIT EO10-33013B (Revision Date: Apr. 24, 2008) 3.11 Wireless LAN Board: B-9700-WLAN-QM-R 3- 10 <Downloading the firmware> LED Status LAN status LED1 LED2 LED3 Blink at the same time Firmware is being overwritten.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il Toshiba B9700LANQMR è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Toshiba B9700LANQMR - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Toshiba B9700LANQMR imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Toshiba B9700LANQMR ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Toshiba B9700LANQMR, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Toshiba B9700LANQMR.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Toshiba B9700LANQMR. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Toshiba B9700LANQMR insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
