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1 Toshiba Personal Computer QOSMIO F10 Maintenance Manual TOSHIBA CORPORATION File Number 960-498.
Copyright © 2004 by Toshiba Corporation. All rights reserved. Under the cop yright laws, this manual cannot be reproduced in any form without the prior written permissi on of Toshiba. No patent liability is assumed with respect to the use of the in formation contai ned herein.
Preface This maintenance manual describes how to pe rform hardware service maintenance for the Toshiba Personal Computer QOSMIO F10. NOTE: Each model of QOSMIO F10 has a diff erent configuration. For each model’s configuration, refer to the parts list dedicated to it.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the QOSMIO F10 system unit and each FRU. Chapter 2 Troubleshooting Procedures e xplains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronym s are enclosed in parentheses following their definition.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ................................................................................................................... ... 1-1 1.2 System Block Diagram ...........................................
Chapter 3 Tests and Diagnostics 3.1 The Diagnostic Test ................................................................................................... 3-1 3.2 Executing the Diagnostic Test .........................................................
Chapter 4 Replacement Procedures 4.1 Overview ................................................................................................................... .4 - 1 4.2 Battery pack/PC card/Bridge Media ............................................
Appendices Appendix A Handling the LCD Module ........................................................................ A-1 Appendix B Board Layout ............................................................................................. B-1 Appendix C Pin Assignment .
x QOSMIO F 10 Mainte nance Manu al (960- 498).
Chapter 1 Hardware Overview.
1 Hardware Overview 1 Hardware Overview 1-ii QOSMIO F 10 Maint enance Ma nual (960 -498).
1 Hardware Overview Chapter 1 Contents 1.1 Features ................................................................................................................... ... 1-1 1.2 System Block Diagram ..................................................
1 Hardware Overview 1-iv QOSMIO F 10 Maint enance Ma nual (960 -498) Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-4 Figure 1-2 System block diagram .........................................
1 Hardware Overview 1.1 Features 1 Features 1.1 Features The QOSMIO F10 series are high performan ce all-in-one PCs running a Pentium-M processor. The features are listed below. ❑ Microprocessor Microprocessor that is used depends on the model. Mobile Intel ® Pentium ® -M Pentium-M 1.
1.1 Features 1 Hardware Overview ❑ Display LCD Built-in 15.4-inch, XGA (1,280 x 800 dots), 262,144 colors, amorphous silicon TFT color display. Clear Super View LCD. CRT Supported via a RGB connector. TV-out S-VIDEO/Composite out port is su pported.
1 Hardware Overview 1.1 Features ❑ Battery The RTC battery is mounted inside the computer. The main battery is a de tachable lithium ion battery (4,400mAh:Li-Ion, 6-cell). ❑ USB (Universal Serial Bus) Four USB ports are provided. The ports comply with the USB2.
1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the comput er and the system units configuration. Figure 1-1 Front of the computer an d the system units configuration 1-4 QOSMIO F 10 Ma.
1 Hardware Overview 1.2 System Block Diagram 1.2 System Block Diagram Figure 1-2 shows the system block diagram. Figure 1-2 System block diagram QOSMIO F 10 Maint enance Ma nual (960 -498) 1-5.
1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. ❑ CPU Mobile Intel ® Pentium ® -M Pentium-M 1.50GHz (Processor Number ; 715) 1.60GHz (Processor Number ; 725) 1.70GHz (Processor Number ; 735) 1.80GHz (Processor Number ; 745) 2.
1 Hardware Overview 1.2 System Block Diagram ❑ Chipset This gate array has the following elements and functions. • North Bridge (Intel 855PME (MCH-M, B-step)) − Pentium-M processor System Bus support − DRAM Controller : DDR 333/DDR266/DDR200 support − AGP Interface (AGP R2.
1.2 System Block Diagram 1 Hardware Overview ❑ VGA controller • nVIDIA NV36M − VRAM 64MB/128MB − AGP 4x (32bit) − TMDS − TV Encoder ❑ Super I/O (SMSC-made LPC47N217) • Two serial ports.
1 Hardware Overview 1.2 System Block Diagram ❑ LAN (Intel-made ED82562 (Kinnereth) x 1) Controls LAN. Supports 100Base-TX and 10Base-T. ❑ MODEM (Askey-made 1456VQL4 x 1) Supported by MDC. Uses secondary AC97 line. Data and FAX transmission is available.
1.3 2.5-inch Hard Disk Drive 1 Hardware Overview 1.3 2.5-inch Hard Disk Drive A compact, high-capacity HDD with a height of 9.5mm. Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications.
1 Hardware Overview 1.3 2.5-inch Hard Disk Drive Table 1-1 2.5-inch HDD dimensions (2/2) Standard value Parameter FUJITSU G8BC00019610 FUJITSU G8BC000 1C610 FUJITSU G8BC000 1HA10 Width (mm) 70 Outline Height (mm) 9.
1.3 2.5-inch Hard Disk Drive 1 Hardware Overview Table 1-2 2.5-inch HDD specifications (1/2) Specification (TOSHIBA) Parameter HDD2189B HDD2194 B HDD2188 B HDD2191V HDD2A02B HDD2D08B Storage size (formatted) 60GB 80GB 100GB Speed (RPM) 4,200 5,400 4,200 5,400 4,200 5,400 Data transfer speed (Mbits/s) 175.
1 Hardware Overview 1.3 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD specifications (2/2) Specification (FUJITSU) Parameter G8BC00019610 G8BC0001 C610 G8BC00 01HA10 Storage size (formatted) 60GB 100GB Speed (RPM) 4,200 5,400 4,200 Data transfer speed (Mbits/s) 330.
1.4 Optical Drive 1 Hardware Overview 1.4 Optical Drive This model equipped with the DVD super multi dr ive as the optical drive. Som e drives support double layer specification. The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.
1 Hardware Overview 1.4 Optical Drive Table 1-4 DVD Super Multi drive specifications (1/4) Drive Specification Parameter MATSUSHITA (G8CC0001S610 ) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Write CD-R 16x (Zone CLV) CD-RW 4X (CLV) High Speed CD-RW 8X (CLV) DVD-R 4x (Zone CLV) DVD-RW 2x (CLV) DVD+R 2.
1.4 Optical Drive 1 Hardware Overview Table 1-4 DVD Super Multi drive specifications (2/4) Drive Specification Parameter Matsushita (G8CC00021610) Read(KB/s) DVD-ROM MAX 8X CAV CD-ROM MAX 24X CAV Writ.
1 Hardware Overview 1.4 Optical Drive Table 1-4 DVD Super Multi drive specifications (3/4) Drive Specification Parameter Matsushita (G8CC00021611) Supporting Double Layer Read(KB/s) DVD-ROM MAX 8X CAV.
1.4 Optical Drive 1 Hardware Overview Table 1-4 DVD Super Multi drive specifications (4/4) Drive Specification Parameter TEAC (G8CC00024611) Supporting Double Layer Read(KB/s) DVD-ROM MAX 8X CAV CD-RO.
1 Hardware Overview 1.5 Keyboard 1.5 Keyboard A keyboard which consists of 85(US)/86(UK) keys is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-5 is a view of the keyboard.
1.6 TFT Color Display 1 Hardware Overview 1.6 TFT Color Display The TFT color display is 15.4 inch and consists of LCD module and FL inverter boards. 1.6.1 LCD Modu le The LCD module used for the TFT color display uses two backlights as the light source and can display a maximum of 262,144 colo rs with 1,280 x 800 resolution.
1 Hardware Overview 1.6 TFT Color Display 1.6.2 FL Inverter Board The FL inverter board supplies a high freque ncy current to illuminate the LCD module FL.
1.7 Power Supply 1 Hardware Overview 1.7 Power Supply The power supply supplies twenty-five di fferent voltages to the system board. The power supply microcontroller has the following functions. 1. Judges if the DC power supply (AC adap ter) is connected to the computer.
1 Hardware Overview 1.7 Power Supply Table 1-7 Power suppl y output rating (2/2) Power supplied （ Yes/No ） Name Voltage [V] Power OFF Suspend mode Power OFF Boot mode No Battery Use USB0PS-E5V 5 Yes No No USB USB1PS-E5V 5 Yes No No USB SND-P5V 5 No No No AN12941 A4R7-P4V 4.
1.8 Batteries 1 Hardware Overview 1.8 Batteries The PC has the following two batteries. ❑ Main battery ❑ Real time clock (RTC) battery Table 1-8 lists the specifications for these two batteries.
1 Hardware Overview 1.8 Batteries 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and dete cts a full charge when the AC adaptor and battery are connected to the computer.
1.8 Batteries 1 Hardware Overview 1.8.3 RTC Batter y The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-11 lists the Time required for charges of RTC battery and data preservation time.
1 Hardware Overview 1.9 AC Adapter 1.9 AC Adapter The AC adapter is used to charge the battery. Table 1-12 lists the AC adapter specifications. Table 1-12 AC adapter specifications Parameter Specification (G71C00024410) Power 90W (Peak 105W) Input voltage AC 100 to 240V Input frequency 50Hz/60Hz Input voltage 1.
1.9 AC Adapter 1 Hardware Overview 1-28 QOSMIO F 10 Maint enance Ma nual (960 -498).
Chapter 2 Troubleshooting Procedures.
2 Troubleshooting Procedures 2 2-ii QOSMIO F 10 Maint enance Ma nual (960 -498).
2 Troubleshooting Procedures Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart ...........................................
2 Troubleshooting Procedures 2.9 Display Troubleshooting .......................................................................................... 2-47 Procedure 1 External Monitor Check ....................................................... 2-47 Procedure 2 Diagnostic Test Program Execution Check .
2 Troubleshooting Procedures Figures Figure 2-1 Troubleshooting flowchart ............................................................................. 2-3 Figure 2-2 A set of tool for debug port test ..................................................
2 Troubleshooting Procedures 2-vi QOSMIO F 10 Mainten ance Manu al (960- 498).
2 Troubleshooting Procedures 2.1 Troubleshooting 2 2.1 Troubleshooting Chapter 2 describes how to determine which Fi eld Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU ” m eans the replaceable unit in the field.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide fo r determining which troubleshooting procedures to execute.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Figure 2-1 Troubleshooting flowchart (1/2) QOSMIO F 10 Maint enance Ma nual (960 -498) 2-3.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (2/2) 2-4 QOSMIO F 10 Maint enance Ma nual (960 -498).
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart If the diagnostics program cannot detect an e rror, the problem may be intermittent. The Test program should be executed several tim es to is olate the problem.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting The power supply controller cont rols many functions and compone nts. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Table 2-2 DC IN icon DC IN icon Power supply status Lights green DC power is being supplie d from the AC adapter. Blinks orange Power supply malfunctio n *1 Doesn’t light Any condition other than those above.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 2 Error Code Check If the power supply microprocessor detects a ma lfunction, the DC IN icon blinks orange.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Table 2-3 Error code Error code Where error occurs 1*h DC Power (AC Adapte r) 2*h Main battery 3:h 2nd batte ry 4*h S3V output 5*h 1R5-C1V.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Main Battery Error code Meaning 21h Main battery charge curre nt is over 12.0A. 22h Main battery discharge cu rrent is over 0.5A when there is no load. 23h Main battery charge curre nt is over 3.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1R5-C1V output Error code Meaning 60h 1R5-C1V voltage is over 2.16V wh en the computer is powered on/off. 61h 1R5-C1V voltage is 1.275V or less when the computer is powered on. 62h 1R5-C1V voltage is 1.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures E3V output Error code Meaning A0h E3V voltage is over 3.96V when the computer is powered on/off. A1h E3V voltage is 2.81V or less when the computer is powered o n. A2h E3V voltage is 2.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 2R5-B2V output Error code Meaning E0h 2R5-B2V voltage is over 3. 00V when the computer is powered on/off. E1h 2R5-B2V voltage is 2.1 25V or less when the computer is powered on. E2h 2R5-B2V voltage is 2.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connection Check The wiring diagram related to th e power supply is shown below: Any of the connectors may be disconnected. Perform Check 1. Check 1 Make sure the AC adapter and the AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 5 Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures .
2.4 System Board Troubleshooting 2 Troubleshooting Procedures 2.4 System Board Troubleshooting This section describes how to determine if the sy stem board is defective.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 1 Message Check When the power is turned on, the system perfor ms the Initial Reliability T est (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures If any other error message displays, perform Check 3. Check 3 The IRT checks the system board. When the IRT detects an erro r, the system stops or an error message appears. If one of the following error messages (1) th rough (17), (22) or (23) is displayed, go to Procedure 4.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Procedure 2 Debug Port Check Check the D port status by a debug port test. Th e tool for debug port test is shown below. Figure 2-2 A set of to ol for debug port test The test procedures are follows: 1.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (1/9) D port status Inspection items Details Permission of A20 and Cl ear of software reset .
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (2/9) D port status Inspection items Details F004h/F005h Saving key scan code Setting TASK_1ms_TSC Controlling fan Enabling system spea ker Releasing mute Initializing sound items (for BEEP) Making the volume max.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (3/9) D port status Inspection items Details Initialization of MCHM Initialization of ICH4M.D31.Func0 Initialization of ICH4M.D31.Func1 Initialization of USB.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (4/9) D port status Inspection items Details (F103h) Resume error check S3 recovery error (I.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (5/9) D port status Inspection items Details (F105h) CPU clock measurement Check of paramete.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (6/9) D port status In spection items Details PCI bus initialization (connection of DS Bus) .
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (7/9) D port status Inspection items Details F10Dh INIT_NDP (Initializ ation of NDP) Storing.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (8/9) D port status Inspection items Details (F11Ch) (In the case of “Boot”) BM loading .
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (9/9) D port status Inspection items Details Initialization of Bluetooth (for models supp or.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (1/3) D port status Inspection items Details Sets the parallel port to D0 state (for models supporting printer) F12Fh Release resources used for fin gerprint authentication.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Debug port (Suspend mode) error status (2/3) LED Status Test item Contents Storing CPU register Permission of system area and me.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (3/3) LED Status Test item Contents (F13Ah) Power LED control during suspendin g Isolates.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port (Resume mode) error status (1/4) LED Status Test item Contents F100h Refer to IRT F101h Refer to IRT F102h Refer to IRT Refer to IRT Clears flag for SMI control. F103h Update of Resume counter Checks the WakeUp factors.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (2/4) LED Status Test item Contents (F122h) AC'97 control Initializing of temperature.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port (Resume mode) error status s (3/4) LED status Test item Con tents Recovery of user alarm setting and cancel of alarm .
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (4/4) LED status Test item Con tents (F12Ah) Process related to CPU Setting of CPU clock to SETUP designation Waiting for motor-off of disabled HDD Final decision of USB FDD information Post-process of PRE_BOOT_SETUP Clears PWRBTN_STS.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures 2-36 QOSMIO F 10 Maint enance Ma nual (960 -498) Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board.
2 Troubleshooting Procedures 2.5 USB 3.5” FDD Troubleshooting 2 2.5 USB 3.5” FDD Troubleshooting This section describes how to determine if the USB 3.5” FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2.5 USB 3.5” FDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the FDD connected to the computer, turn on the com puter and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures.
2 Troubleshooting Procedures 2.5 USB 3.5” FDD Troubleshooting Procedure 3 Connector Check and Replacement Check The USB FDD connector may be disconnected from the system board or SD board. Check visually that the connector is c onnected to one of them firmly.
2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting This section describes how to determine if the 2.5” HDD is functioning properly. Perform the steps below starting with Procedure 1 and con tinuing with the other pr ocedures as required.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 2 Message Check When the power is turned on, the system perfor ms the Initial Reliability T est (IRT) installed in the BIOS ROM. When the test detects an erro r, an error message is displayed on the screen.
2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 3 Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To fo rmat the HDD, start with Check 1 below and perform the other steps as required.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnosti cs Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 5 Connector Check and Replacement Check The HDD is connected to the connector of th e system board.
2 Troubleshooting Procedures 2.7 Keyboard Troubleshooting 2.7 Keyboard Troubleshooting To determine if the computer’s keyboard is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed.
2.8 Touch Pad Troubleshooting 2 Troubleshooting Procedures 2.8 Touch Pad Troubleshooting To determine if the computer’s touch pad is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed.
2 Troubleshooting Procedures 2.9 Display Troubleshooting 2.9 Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
2.9 Display Troubleshooting 2 Troubleshooting Procedures Procedure 3 Connector Check and Cable Check The LCD module is connected to the system board by an LCD/FL cable. The FL inverter board is also connected to the system board by an LCD/FL cable. And the FL is connected to the FL inverter board by the HV cable.
2 Troubleshooting Procedures 2.9 Display Troubleshooting Procedure 4 Replacement Check The FL lamp, FL inverter, LCD module, system board and LCD/FL cable are connected to display circuits.
2.10 Optical Drive Troubleshooting 2 Troubleshooting Procedures 2.10 Optical Drive Troubleshooting To check if the optical drive is defective or not, follow the troubles hooting procedures below as instructed.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if the modem is defective or malf unctioning, follow the troubleshooting procedures below as instructed.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures Check 5 The cable between the SD board and sy stem board m ay be faulty. Replace it with a new one following the instructions in Chapter 4. If the problem still occur s, perform Check 6. Check 6 The system board may be faulty.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.12 LAN Troubleshooting To check if the computer’s LAN is defec tive or malfunctioning, follow the troubleshooting procedures below as instructed.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting This section describes how to determine if the computer's W ireless LAN is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting Procedure 2 Antennas' Connection Check The wireless LAN function-wiri ng diagram is shown below: Any of the connections may be disconnected.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check The wireless LAN board, wireless LAN antennas or the system board may be damaged.
2 Troubleshooting Procedures 2.14 Sound Troubleshooting 2.14 Sound Troubleshooting To check if the sound function is defective or not, follow the troubleshooting procedures below as instructed.
2.14 Sound Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check Check 1 When the headphone does not work properly, it may be faulty. Replace it with a new one. If the problem stil l occurs, perform Check 5. Check 2 When the external microphone does not work properly, it may be faulty.
2 Troubleshooting Procedures 2.15 TV Tuner Troubleshooting 2.15 TV Tuner Troubleshooting To check if the TV tuner is defective or not, follow the troubl eshooting procedures below as instructed.
2.15 TV Tuner Troubleshooting 2 Troubleshooting Procedures 2-60 QOSMIO F10 Maintenance Ma nual (960- 498).
Chapter 3 Tests and Diagnostics.
3-ii QOSMIO F10 Maintenance Manual (960-498).
Chapter 3 Contents 3.1 The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu .................................................................................
3.21.2 Operations .......................................................................................... 3-47 3.22 Log Utilities ............................................................................................................. 3-48 3.22.
Tables Table 3-1 Subtest names............................................................................................... 3-12 Table 3-2 Error codes and error status names .............................................................. 3-35 Table 3-3 Hard disk controller status register contents .
3-vi QOSMIO F10 Maintenance Manual (960-498).
3 Tests and Diagnostics 3.1 The Diagnostic Test 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Program s are stored on some Diagnostic Disks.
3.1 The Diagnostic Test 3 Tests and Diagnostics NDP TEST EXPANSION TEST CD-ROM/DVD-ROM TEST Other tests are: Wireless LAN TEST (Wireless LAN TEST disk) LAN/Modem/Bluetooth/IEEE1394.
3 Tests and Diagnostics 3.1 The Diagnostic Test 3.1.2 H/W (Hardware) initial information setting tool The H/W initial inform ation setting tool consists of the following programs.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2 Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer with pressing the F12 .
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test NOTE : To exit the DIAGNOSTIC TEST MENU, press Esc . If a test program is in progress, press Ctrl + Break to exit the test program. If a test program is in progress, press Ctrl + C to stop the test program.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter . When you select 1- SYSTEM TEST , the following message will appear: SYSTEM TEST NAME XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display sc.
3.3 Setting of the hardware configuration 3 Tests and Diagnostics 3.3 Setting of the hardware configuration To execute this program, select 2-Repair initial config set in the startup menu, press Enter and follow the directions on the screen. The H/W initial inform ation setting tool consists of following subtests.
3 Tests and Diagnostics 3.3 Setting of the hardware configuration • Setting of the HWSC • Setting of the UUID • Display of the DMI information (including UUID) • Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order.
3.3 Setting of the hardware configuration 3 Tests and Diagnostics Subtest 08 System configuration display This subtest displays the information of the system configuration. When the following message appears, confirm the contents and press Enter . Press [Enter] key For more details on the system configuration inform ation, refer to "3.
3 Tests and Diagnostics 3.4 Heatrun Test 3.4 Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu and press Enter . After selecting this test, the same subtests as 3.23 Running Test are executed successively. For more details on the procedure and test content, refer to Running Test.
3.5 Subtest Names 3 Tests and Diagnostics 3.5 Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No.
3 Tests and Diagnostics 3.5 Subtest Names Table 3-1 Subtest names (2/2) No. Test Name Subtest No. Subtest Name 6 PRINTER [Not supported] 01 02 03 Ripple pattern Function Wrap around 7 ASYNC [Not suppo.
3.6 System Test 3 Tests and Diagnostics 3.6 System Test To execute the System Test, select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.6 System Test If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. Subtest 04 Quick Charge This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format.
3.7 Memory Test 3 Tests and Diagnostics 3.7 Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.8 Keyboard Test 3.8 Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.9 Display Test 3 Tests and Diagnostics 3.9 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.9 Display Test Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter .
3.9 Display Test 3 Tests and Diagnostics Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns. HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHH.
3 Tests and Diagnostics 3.10 Floppy Disk Test 3.10 Floppy Disk Test CAUTION : Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD because the contents of the floppy disk will be erased.
3.10 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter . The following message will appear during the floppy disk test.
3 Tests and Diagnostics 3.11 Printer Test 3.11 Printer Test CAUTION : Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE : An IBM compatible printer must be connected to the system to execute this test.
3.11 Printer Test 3 Tests and Diagnostics Subtest 02 Function This subtest is for IBM compatible printers, and tests the following f unctions: Normal print Double-width print Compressed print Emphasiz.
3 Tests and Diagnostics 3.12 Async Test 3.12 Async Test CAUTION : Async Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.13 Hard Disk Test 3 Tests and Diagnostics 3.13 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter , and follow the directions on the screen. CAUTION : The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed.
3 Tests and Diagnostics 3.13 Hard Disk Test 3. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest.
3.13 Hard Disk Test 3 Tests and Diagnostics 3-28 QOSMIO F10 Maintenance Manual (960-498) Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder and then reads the data while moving from cylinder to cylinder.
3 Tests and Diagnostics 3.14 Real Timer Test 3 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.14 Real Timer Test 3 Tests and Diagnostics Subtest 03 Real time carry CAUTION : When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments.
3 Tests and Diagnostics 3.15 NDP Test 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3.16 Expansion Test 3 Tests and Diagnostics 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound NOTE: : PCMCIA wraparound test is not supported for this model.
3 Tests and Diagnostics 3.16 Expansion Test Subtest 02 RGB monitor ID NOTE: To execute this subtest, an external monitor with monitor ID function is required. Connect the external monitor to the PC for the test of ID acquisition. The judgment of acquisition is based on the panel data.
3.17 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.17 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE : For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1.
3 Tests and Diagnostics 3.18 Error Code and Error Status Names 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3.18 Error Code and Error Status Names 3 Tests and Diagnostics Table 3-2 Error codes and error status names (2/3) Device name Error code Error status name FDD 01 02 03 04 08 09 10 20 40 80 60 06 EE FD.
3 Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 Error codes and error status names (3/3) Device name Error code Error status name (HDD) CC E0 0A EE DA 12 HDD - WRITE FAULT HDD.
3.19 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight- digit number.
3 Tests and Diagnostics 3.19 Hard Disk Test Detail Status Table 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error.
3.20 ONLY ONE TEST 3 Tests and Diagnostics 3.20 ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter . The following menu appears in the display.
3 Tests and Diagnostics 3.20 ONLY ONE TEST Subtest 01 Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed.
3.20 ONLY ONE TEST 3 Tests and Diagnostics Subtest 02 Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch.
3 Tests and Diagnostics 3.20 ONLY ONE TEST Subtest 03 GP Button This subtest checks if the AV buttons (10 buttons) work properly. The following m essage appears in the display. Press button [0] Press the AV button from the left (the AV button nearest to power button).
3.20 ONLY ONE TEST 3 Tests and Diagnostics Slide the switch to OFF position. Then, the following message appears in the display. KILL SWITCH ON !! Slide the switch to ON position.
3 Tests and Diagnostics 3.20 ONLY ONE TEST Subtest 06 Touch Pad (Scroll Button) This subtest checks if the scroll button of touch pad works properly. The following m essage appears in the display.
3.20 ONLY ONE TEST 3 Tests and Diagnostics Press Enter and following message appears in the display. Check [PowerSW-LED]= Green Check if the Power Switch LED lights in the following order. (Green -> Orange -> Blue -> OFF) Press any key and the following m essage appears in the display.
3 Tests and Diagnostics 3.21 Head Cleaning 3.21 Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.
3.22 Log Utilities 3 Tests and Diagnostics 3.22 Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk, or output the data to a printer or the display.
3 Tests and Diagnostics 3.22 Log Utilities 3.22.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, the error information is displayed in the following format: XXXXX ERRORS CNT TS-NO PASS.
3.23 Running Test 3 Tests and Diagnostics 3.23 Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3.24 Floppy Disk Drive Utilities 3.24.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE : This program is only for testing a floppy disk drive.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 – HDD-ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a m essage similar to the one below: Insert source disk into drive A: Press any key when ready.
3.24 Floppy Disk Drive Utilities 3 Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h).
3 Tests and Diagnostics 3.24 Floppy Disk Drive Utilities QOSMIO F10 Maintenance Manual (960-498) 3-55 (k) The following message will appear. To finish the dum p, select 3 . Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU.
3.25 System Configuration 3 Tests and Diagnostics 3 3.25 System Configuration 3.25.1 Function Description NOTE : To display the system configuration, the write protect tab should be OFF position. If the tab is ON position, move the tab to OFF position and restart the test.
3 Tests and Diagnostics 3.25 System Configuration 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display.
3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transm itting-receiving test (Intel- made Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) W hen a defective is detected in the test, following typical cause is considered. Bad connection of wireless LAN card • • • • • • Using a wrong wireless LAN card (Using unspecified card) Defective wireless LAN card Check the connection and execute the subtest again.
3.26 Wireless LAN Test Program (Intel-made b/g) 3 Tests and Diagnostics Subtest03 Antenna check & communication test of 11b mode Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine.
3 Tests and Diagnostics 3.26 Wireless LAN Test Program (Intel-made b/g) Check the connection and condition, and execute the subtest again. Subtest04 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transm itting-receiving test (Intel- made Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
3 Tests and Diagnostics 3.27 Wireless LA N Test Program (Intel-made a/b/g) If a defective is found during the test, NG m essage will appear in the display.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics Press any key to return to the test m enu. W hen a defective is detected in the test, following typical cause is considered.
3 Tests and Diagnostics 3.27 Wireless LA N Test Program (Intel-made a/b/g) Press any key to return to the test menu. W hen a defective is detected in the test, following typical cause is considered.
3.27 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics Subtest05 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For m ore details on procedure and contents of this subtest, refer to Subtest04 Communication test of 11a m ode.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) 3.28 Wireless LAN Test Program (Askey-made) This section describes how to perform the wireless LAN transm itting-receiving test (Askey- made Atheros b/g, a/b/g).
3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics 4. When the program disk 2 starts, f ollowing menu will appear in the display. To execute the subtest, press test number and Enter .
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Askey-made) Subtest02 MAC Address Check This subtest reads out the MAC address of the card installed and confirm s if it is valid. When the MAC address is valid one, following m essage will appear in the display.
3.28 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics Moreover, following typical cause is considered. Bad connection of wireless LAN card • • • • Bad connection of wireless LAN .
3 Tests and Diagnostics 3.29 LAN/M odem/Bluetooth/IEEE1394 Test Program 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Mode m/Bluetooth/IEEE1394 test in FDD and turn on the power.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Subtest01 (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3 Tests and Diagnostics 3.29 LAN/M odem/Bluetooth/IEEE1394 Test Program Subtest02 (GbE) CAUTION : Gigabit Ethernet (GbE) test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter .
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.29.2 Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Electric Manufacture Co.
3 Tests and Diagnostics 3.29 LAN/M odem/Bluetooth/IEEE1394 Test Program 3.29.3 Bluetooth test CAUTION : Bluetooth test is not supported for this model. To execute this test, input 3 and press Enter . Note : Use another computer that can communicate by the Bluetooth as a reference machine to perform this test.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Subtest01 BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter .
3 Tests and Diagnostics 3.29 LAN/M odem/Bluetooth/IEEE1394 Test Program If the target machine has any problem, it displays Error m essasge. The following message is displayed. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code Meaning 0x01 Unknown HCI Command.
3 Tests and Diagnostics 3.29 LAN/M odem/Bluetooth/IEEE1394 Test Program Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collision.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.
3 Tests and Diagnostics 3.29 LAN/M odem/Bluetooth/IEEE1394 Test Program ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If any problem is detected during the test, the massage FAIL is displayed on the tester machine with the error code as shown below. The error code begins with the least significant digit.
3 Tests and Diagnostics 3.29 LAN/M odem/Bluetooth/IEEE1394 Test Program Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout.
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3-84 QOSMIO F10 Maintenance Manual (960-498) 3.29.4 IEEE1394 test To execute this test, input 4 and press Enter . NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a responder machine to perform this test.
3.30 Sound Test program 3 Tests and Diagnostics 3 Tests and Dia tics 3.30 Sound Test program gnos This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3.30 Sound Test program 3 Tests and Diagnostics To return to the Sound test menu, Press 9 and Enter . Then following message will appear in the display.
3 Tests and Diagnostics 3.30 Sound Test program Subtest02 Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave.
3.30 Sound Test program 3 Tests and Diagnostics 3.30.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter . Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared).
3 Tests and Diagnostics 3.30 Sound Test program Subtest02 English Narration W hen selecting this subtest, narration in English starts. For m ore details on the procedure, refer to the subtest01. Subtest03 Test Tone A Caution: Before starting subtest03, be sure to set the sound at proper volume.
3.30 Sound Test program 3 Tests and Diagnostics (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.31 SETUP 3.31 SETUP 3.31.1 Function Description This program displays the current system setup inform ation as listed below: 1. Memory 2. System Date/Time 3. Battery 4. Password 5. Boot Priority (a) Boot Priority (b) Network Boot Protocol 6.
3.31 SETUP 3 Tests and Diagnostics 3.31.2 Accessing the SETUP Program While pressing ESC , turn on the power. Then press F1 . The following display appears.
3 Tests and Diagnostics 3.31 SETUP Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to m ove between items in a column. Press Fn + ↑ ( PgUp) and Fn + ↓ ( PgDn) to move between the two pages.
3.31 SETUP 3 Tests and Diagnostics SETUP Options The SETUP screen is divided into 13 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s mem ory. This field displays the total amount of mem ory installed and is automatically calculated by the computer.
3 Tests and Diagnostics 3.31 SETUP NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS .
3.31 SETUP 3 Tests and Diagnostics HDD Auto Off Use this option to set the duration of the HDD automatic power off function. xx Min. Automatically turns off the power to the hard disk drive if it is not used for the duration set. The duration xx can be set to 1 , 3 , 5 , 10 , 15 , 20 or 30 minutes.
3 Tests and Diagnostics 3.31 SETUP 4. Password This option sets or resets the user password for power on and instant security ( Fn+F1 ). Registered The user password has been registered. Not registered The user password has not been registered. For details on setting the user password, refer to the User’s Manual.
3.31 SETUP 3 Tests and Diagnostics This option is used to select the display when booting up. Auto-Selected Selects an external monitor if one is connected. Otherwise it selects the internal LCD. (Default) LCD+AnalogRGB Selects both the internal LCD and the external monitor for simultaneous display.
3 Tests and Diagnostics 3.31 SETUP 7. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache.
3.31 SETUP 3 Tests and Diagnostics Set the parameters for the Auto Power On (automatic power on) function in the “OPTIONS” window. To set the time, use Space bar or BackSpace . Press ↓ to move the cursor to the right and ↑ to move the cursor to the left when you set the date and time.
3 Tests and Diagnostics 3.31 SETUP Mode 2 Sets to Mode 2. Glows blue (Power ON) / Alternately flashes green and orange (Standby) / Alternately flashes green and blue (Power OFF/Hibernation) Mode 3 Sets to Mode 3.
3.31 SETUP 3 Tests and Diagnostics 11. Peripheral Use this option to select the peripheral's mode. (a) Internal Pointing Device This option enables or disables the touch pad Enabled Enables the touch pad. (Default) Disabled Disables the touch pad.
3 Tests and Diagnostics 3.31 SETUP 13. PCI LAN This option sets the Enable / Disable of the built-in LAN functions. Enabled Enables built-in LAN functions.
3.31 SETUP 3 Tests and Diagnostics 3-104 QOSMIO F10 Maintenance Manual (960-498).
Chapter 4 Replacement Procedures.
4 Replacement Procedures 4 4-ii QOSMIO F 10 Maint enance Ma nual (960 -498).
4 Replacement Procedures Chapter 4 Contents 4.1 Overview ................................................................................................................... .4 - 1 Safety Precautions ....................................................
4 Replacement Procedures 4.14.2 Guide ..................................................................................................... 4-42 4.15 Heat sink/CPU .......................................................................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing the PC card ................................................................
4 Replacement Procedures 4-vi QOSMIO F 10 Mainten ance Manu al (960- 498) Figure 4-30 Applying si licon grease .................................................................................... 4-46 Figure 4-31 Removing the VGA heat sink ...........
4 Replacement Procedures 4.1 Overview 4 4.1 Overview This chapter describes the procedure for rem oving and replacing the fi eld replaceable units (FRUs) in the PC. It may not be necessary to remove all the F RUs in order to replace one. The chart below provides a guide as to whic h other FRUs must be removed before a particular FRU can be removed.
4.1 Overview 4 Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions w hile working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba.
4 Replacement Procedures 4.1 Overview Before You Begin Take note of the following points before star ting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.
4.1 Overview 4 Replacement Procedures Disassembly Procedure Three main types of cable connector are used. Pressure plate connector • • • Spring connector Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cab le out from the connect or.
4 Replacement Procedures 4.1 Overview Assembly Procedure After the computer has been disassembled and th e part that caused the fault has been repaired or replaced, the computer must be reassem bled. Take note of the following general points when assembling the computer.
4.1 Overview 4 Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION : Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall ou t) causing a short circuit or other damage.
4 Replacement Procedures 4.1 Overview Screw Notation To make maintenance of the co mputer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body.
4.2 Battery pack/PC card/Bridge Me dia 4 Replacement Procedures 4.2 Battery pack/PC card/Bridge Media 4.2.1 Battery pack Removing the battery pack The following describes the procedure for re m oving the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the batter y pack.
4 Replacement Procedures 4.2 Battery pack/PC card/Bridge Media NOTE : Dispose of the used battery pack in a ccordance with the laws and ordinances of your local authority. Installing the battery pack The following describes the procedure for rein stalling the battery pack (See Figure 4-1).
4.2 Battery pack/PC card/Bridge Me dia 4 Replacement Procedures 4.2.2 PC card Removing the PC card The following describes the procedure for removing the PC card (See Figure 4-2). CAUTION: Insert or remove the PC card in accordance with any instructions in the PC card manual or the manuals of the computer system you are using.
4 Replacement Procedures 4.2 Battery pack/PC card/Bridge Media 4.2.3 Bridge Media (SD Card / Memory Stick / xDPicture Card/Multi Media Card) Removing the Bridge media The following describes the procedure for re m oving the bridge media (See Figure 4-3).
4.3 HDD 4 Replacement Procedures 4.3 HDD Removing the HDD The following describes the procedure for removing the HDD (See Figure 4-4 and 4-5). CAUTION: Be careful not to drop or leave screws in the PC. Take care not to press on the top or bottom of the HDD.
4 Replacement Procedures 4.3 HDD 4. Remove the following screws fixing the HDD assembly . • F3 × 4S FLAT BIND screw x4 5. Detach the HDD holder from the HDD .
4.3 HDD 4 Replacement Procedures Installing the HDD The following describes the procedure for in stalling an HDD (See Figure 4-4 and 4-5). 1. Attach the laminate cover to the HDD. 2. Install the HDD to the HDD holder and secure them with the following screws .
4 Replacement Procedures 4.4 Memory module 4.4 Memory module CAUTION: The power of the computer must be turned off when you remove the memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch the memory module termi nals.
4.4 Memory module 4 Replacement Procedures Installing the memory module To install the memory module, confirm that the computer is in boot m ode. Then perform the following procedure (See Figure 4-6). 1. Insert the memory module into the connector of the computer slantwise (term inal side first) and press it to connect firmly.
4 Replacement Procedures 4.5 Keyboard/Bluetooth 4.5 Keyboard/Bluetooth 4.5.1 Keyboard Removing the keyboard The following describes the procedure for rem o ving the keyboard (See Figure 4-7 to 4-9). CAUTION: As the keytop may fall out, when handli ng the keyboard always hold it by the frame and do not touch the keytop.
4.5 Keyboard/Bluetooth 4 Replacement Procedures 5. Remove the following screws fixing the keyboard • M2.5 × 2.8B FLAT BIND screw x2 M2.5x2.8B FLAT BIND Figure 4-8 Removing the keyboard 6. Lift the upper side of the keyboard and turn it face down on the palm rest.
4 Replacement Procedures 4.5 Keyboard/Bluetooth 7. Remove the following screws fixing the keyboard support plate . • M2.5 × 2.8B FLAT BIND screw x2 8. Remove the keyboard support plate . M2.5 × 2.8B FLAT BIND Slit Keyboard support plate CN3230 Keyboard Ke y board flexible cable Figure 4-9 Removing the keyboard support plate 9.
4.5 Keyboard/Bluetooth 4 Replacement Procedures Installing the keyboard The following describes the procedure for inst alling the keyboard (See Figure 4-7 to 4-9). 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard flexible cable to the connector CN3230 on the system board.
4 Replacement Procedures 4.5 Keyboard/Bluetooth 4.5.2 Bluetooth Removing the Bluetooth The following describes the procedure for rem oving the bluetooth (See Figure 4-10). 1. Disconnect the bluetooth flat cable from the connector CN4400 on the system board.
4.6 Switch membrane 4 Replacement Procedures 4.6 Switch membrane Removing the switch membrane The following describes the procedure for rem o ving the switch membrane (See Figure 4-11). 1. Remove the following screw and remove the LCD CON holder . • M2.
4 Replacement Procedures 4.6 Switch membrane Installing the switch membrane The following describes the procedure for inst alling the switch membrane (See Figure 4-11). 1. Connect the switch membrane to the connector CN9650 on the system board. 2. Slide the switch membrane to install and secure it with the following screw .
4.7 Optical drive 4 Replacement Procedures 4.7 Optical drive NOTE : Do not apply excessive force to the top of an optical drive. Do not touch the shaded portion of the fi gure below, when you remove or install the drive. Removing the optical drive The following describes the procedure for rem ovi ng the optical drive (S ee Figure 4-12 and 4- 13).
4 Replacement Procedures 4.7 Optical drive 3. Remove the following screws to remove the side bracket from the optical drive. • M2 × 3C SUPER THIN HEAD screw x2 • M2 × 3.
4.8 Display assembly 4 Replacement Procedures 4.8 Display assembly Removing the display assembly The following describes the procedure for rem o ving the display assembly (See Figure 4-14 to 4-18). 1. Close the display and turn the computer upside down.
4 Replacement Procedures 4.8 Display assembly 3. Tun over the computer and open the display. 4. Remove the following screws and remove the harness cover . • M2.5 × 6B FLAT BIND screw x2 • M2.5 × 10B FLAT BIND screw x1 M2.5 × 10B FLAT BIND Harness cover M2.
4.8 Display assembly 4 Replacement Procedures 5. Disconnect the LCD harness from the connector PJ5600 on the system board. 6. Unlock the connector CN3201 and disconnect the touch pad cable from the connector on the system board. 7. Unlock the connector CN9550 and disconnect the SJ board flat cable from the connector on the sound board.
4 Replacement Procedures 4.8 Display assembly 9. Lift up the display assembly from the Optical drive side first to unhook the latches. 10. Remove the display assembly from the base assembly and place it next to the base assembly. 11. Remove the following screws and remove the w ireless LAN cover on the base assembly.
4.8 Display assembly 4 Replacement Procedures 12. Disconnect the w ireless LAN antenna cables from the wireless LAN board. Wireless LAN antenna cable Aux (black) Wireless LAN antenna cable Main (white.
4 Replacement Procedures 4.8 Display assembly Installing the display assembly The following describes the procedure for instal ling the display assem bly (See Figure 4-14 to 4-18). 1. Connect the wireless LAN antenna cables (Main (white cable ) and Aux (black cable)) to the connectors on the wireless LAN board.
4.9 SD board/MDC 4 Replacement Procedures 4.9 SD board/MDC 4.9.1 SD board Removing the SD board The following describes the procedure for removing the SD board (See Figure 4-19). 1. Disconnect the SD board flat cable from the connector CN9510 on the SD board.
4 Replacement Procedures 4.9 SD board/MDC M2.5x4B FLAT BIND SVP harness CN2410 SD board flat cable RJ11 connecto r Speaker cable L TV tuner cable CN9614 TV tuner coaxial cable M2.
4.9 SD board/MDC 4 Replacement Procedures 4-34 QOSMIO F 10 Maint enance Ma nual (960 -498) 4.9.2 MDC Removing the MDC The following describes the procedure for removing the MDC (See Figure 4-20). 1. Turn over the SD board. 2. Remove the following screws fixing the MDC and pull the MDC straight up from the connector CN3000 on the SD board.
4 Replacement Procedures 4.10 Fan 4 4.10 Fan Removing the fan The following describes the procedure for rem oving the fan (See Figure 4-21). 1. Disconnect the fan cable from the CN8770 on the system board. 2. Remove the following screws and remove the fan.
4.11 Wireless LAN board 4 Replacement Procedures 4.11 Wireless LAN board Removing the wireless LAN board The following describes the procedure for re m oving the wireless LAN board (See Figure 4- 22). 1. Open the left and right latches holding the wireless LAN board and remove it.
4 Replacement Procedures 4.12 System board 4.12 System board CAUTION: 1. When handling the system board, alwa ys hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.
4.12 System board 4 Replacement Procedures M2.5x4B FLAT BIND BATT CONN cover SD board flat cable Insulator DC-IN jack USB harness SVP harness M2.5x4B FLAT BIND Wireless LAN KILL switch Figure 4-24 Rem.
4 Replacement Procedures 4.12 System board Installing the system board The following describes the procedure for inst alling the system board (See Figure 4-23 and 4-24). 1. Connect the DC-IN jack, SD board flat cable and SVP harness to the system board.
4.13 RTC battery 4 Replacement Procedures 4.13 RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery (See Figure 4-25). 1. Disconnect the RTC battery ha rness from the connector CN 8490 on the system board.
4 Replacement Procedures 4.14 TV tuner module/Guide 4.14 TV tuner module/Guide 4.14.1 TV tuner module Removing the TV tuner module The following describes the procedure for remo ving the TV tuner module (See Figure 4-26). 1. Disconnect the TV tuner harness from the connector on the TV tuner module.
4.14 TV tuner module/Guide 4 Replacement Procedures Installing the TV tuner module The following describes the procedure for inst alling the TV tuner module (See Figure 4-26). 1. Insert the TV tuner module terminals slantwise into the connector on the system board and secure it with the following screws.
4 Replacement Procedures 4.14 TV tuner module/Guide USB harness CN9501 TV tuner harness TV tuner coaxial cable M2x4 BIND Guide Figure 4-27 Removing the guide Installing the guide The following describes the procedure for installing the guide (See Figure 4-27).
4.15 Heat sink/CPU 4 Replacement Procedures 4.15 Heat sink/CPU Removing the heat sink/CPU The following describes the procedure for re m oving the heat sink and CPU (See Figure 4-28 and 4-29). 1. After Removing the following screws, remove the heat sink holder and heat sink .
4 Replacement Procedures 4.15 Heat sink/CPU 2. Unlock the CPU by rotating the cam on the CPU socket 180 degrees to the counterclockwise with a flat-blade screwdriver. 3. Remove the CPU. Cam Figure 4-29 Removing the CPU Installing the heat sink/CPU The following describes the procedure for inst alling the heat sink and CPU (See Figure 4-28 to 4-30).
4.15 Heat sink/CPU 4 Replacement Procedures NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Figure 4-30 Applying silicon grease 5. Install the heat sin k and heat sink holder and secure them with the following screws in the order of numbers mark ed on the heat sink holder.
4 Replacement Procedures 4.16 VGA Heat sink 4.16 VGA Heat sink Removing the VGA heat sink The following describes the procedure for removing the VGA heat sink (See Figure 4-31).
4.17 PC card cover 4 Replacement Procedures 4.17 PC card cover Removing the PC card cover The following describes the procedure for rem o ving the PC card cover (See Figure 4-32). 1. Remove the following screws securing the PC card cover. • M2 × 3Z BIND screw x2 2.
4 Replacement Procedures 4.18 Speaker/VGA fan 4.18 Speaker/VGA fan Removing the Speaker/VGA fan The following describes the procedure for re moving the speaker and VGA fan (See Figure 4- 33). 1. Pull out the speaker cable L (red cable) under the insulator and the glass tapes.
4.18 Speaker/VGA fan 4 Replacement Procedures Installing the Speaker/VGA fan The following describes the procedure for inst alling the speaker and VGA fan (See Figure 4- 33). NOTE: When installing speakers , make sure they are fit to the guides closely by pressing them from the top.
4 Replacement Procedures 4.19 Battery latch 4.19 Battery latch Removing the battery latch The following describes the procedure for rem ovi ng the battery latch (See Figure 4-34 and 3- 35). 1. Remove the following screws fixing the battery latch assembly.
4.19 Battery latch 4 Replacement Procedu res Installing the battery latch The following describes the procedure for instal ling the battery latch (See Figure 4-34 and 4- 35). 1. Install the battery lock button . 2. Set the spring on the battery latch and install the batte ry latch on the battery latch assembly .
4 Replacement Procedures 4.20 Touch pad 4.20 Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-36). 1. Remove the glass tape fixing the touch pad flexible cable. 2. Disconnect the touch pad flat cable from the touch pad.
4.20 Touch pad 4 Replacement Procedures Installing the touch pad The following describes the procedure for in stalling the touch pad (See F igure 4-36). NOTE : Do not reuse the touch pad so that it c an not be used after peeling off from the computer.
4 Replacement Procedures 4.21 SJ board 4.21 SJ board Removing the SJ board The following describes the procedure for removing the SJ board (See Figure 4-37). 1. Disconnect the microphone cable from the connector CN6000 on the SJ board. 2. Unlock the connector CN9560 on the SJ board and disconnect the SJ board flat cable from it.
4.21 SJ board 4 Replacement Procedu res Installing the SJ board The following describes the procedure for in stalling the SJ board (See Figure 4-37). 1. Pass through the SJ board flat cable into the slit of the middle fram e and arrange it along the guide on the in sulator.
4 Replacement Procedures 4.22 Microphone 4.22 Microphone Removing the microphone The following describes the procedure for removing the microphone (See Figure 4-38). 1. Remove the following screw to remove the microphone hold guide from the base assembly.
4.23 LCD unit/FL inverter 4 Replacement Procedures 4.23 LCD unit/FL inverter Removing the LCD unit/FL inverter The following describes the procedure for removing the LCD unit and FL inverter (See Figure 4-39 to 4-42). 1. Open widely the display panel and pull up both the hinge caps to remove by slightly pressing them toward the display.
4 Replacement Procedures 4.23 LCD unit/FL inverter 4. Remove the following screw fixing the FL inverter. • M2x4Z SUPER THIN HEAD screw x1 5. (for model with wirele ss LAN or Bluetooth) Pull out one insulator and peel off the other one adhered to the FL inverter.
4.23 LCD unit/FL inverter 4 Replacement Procedures 9. Remove the following screws fixing the LCD unit. • M2x4Z SUPER THIN HEAD screw x4 10. W ith the bottom edge of the LCD unit on the display cover, lift onl y the top edge of the LCD unit.
4 Replacement Procedures 4.23 LCD unit/FL inverter 11. Remove the following screws to remove the right and left L CD supports from the LCD unit. • M2x3C SUPER THIN HEAD screw x4 M2x3C SUPER THIN HEA.
4.23 LCD unit/FL inverter 4 Replacement Procedures Installing the LCD unit/FL Inverter The following describes the procedure for inst alling the LCD unit and FL inverter (See Figure 4-39 to 4-42). 1. Secure the LCD supports (left and right) to the LCD unit with the following screws .
4 Replacement Procedures 4.24 Wireless antennas/ LCD harness 4.24 Wireless antennas/ LCD harness 4.24.1 Wireless antennas Removing the wireless antennas The following describes the procedure for re m oving the wireless antennas (See Figure 4-44 and 4-44).
4.24 Wireless antennas/ LCD harness 4 Replacement Procedures 3. Peel off the glass tapes fixing the wireless LAN antenna cables and bluetooth antenna cable and peel off the wireless LAN antennas and bluetooth antenna from the display cover.
4 Replacement Procedures 4.24 Wireless antennas/ LCD harness 4.24.2 LCD harness Removing the LCD harness The following describes the procedure for remo ving LCD harness (See Figure 4-45 and 4-46). 1. Remove the following screw securing the LCD harness holder and remove the LCD harness holder (display cover side).
4.24 Wireless antennas/ LCD harness 4 Replacement Procedures 2. Remove the following screw securing the LCD harness holder and remove the LCD harness holder (middle frame side). • M2.5 × 2.8B FLAT BIND screw x1 3. Remove the LCD harness from the guide.
4 Replacement Procedures 4.25 Hinge 4.25 Hinge Removing the Hinge The following describes the procedure for rem oving hinge (See Figure 4-47 to 4-49). 1. Remove the following screws securing the display cover and detach the display cover . • M2.5 × 6 PSP TIGHT screw x4 M2.
4.25 Hinge 4 Replacement Procedures 2. Remove the following screws and remove the hinges (displa y cover side). • M2.5 × 6B FLAT BIND screw x2 ( L o c k t i g h t ) M2.5x6B FLAT BIND (Locktight) Hinges (display cover side) Figure 4-48 Removing the hi nge (display cover side) 3.
4 Replacement Procedures 4.25 Hinge QOSMIO F 10 Maint enance Ma nual (960 -498) 4-69 Installing the Hinge The following describes the procedure for in stalling the hinge (See Figure 4-47 to 4-49). 1. Install the hinges (middle frame side) on the back side of the m iddle frame and secure them with the following screw s .
Appendices.
Appendices App-ii QOSMIO F10 Maintenance Manual (960- 498).
Appendices Appendix Contents Appendix A Handling the LCD Module ......................................................................... A-1 Appendix B Board Layout .....................................................................................
Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged duri ng assembly or disassembly.
Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with co tton or a soft cloth. If it is still dirty, try breathing on the surface to create a light cond ensate and wipe it again. If the surface is very dirty, we recomme nd a CRT cleaning agent.
Appendix A Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the m odule, so guard against damage from electrostatic discharge.
Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module 10. If you transport the module, do not use pack ing material that c ontains epoxy resin (amine) or silicon glue (alcohol or oxide).
Appendix A Handling the LCD Module A-6 QOSMIO F10 Maintenance Ma nual (960-4 98).
Appendices C.18 CN4200 1394 I/F connector (4-pin) .......................................................... C-10 C.19 IS2101 MEDIA BRIDGE I/F connector (42-pin) ................................... C-10 C.20 CN1400 Memory connector A (200-pin) .......
Appendices Appendix D Keyboard Scan/Character Codes .............................................................. D-1 Appendix E Key Layout .................................................................................................. E-1 E.1 Keyboard Layout .
Appendices Figures Figure B-1 System board layout (front) .......................................................................... B-1 Figure B-2 System board layout (back) .......................................................................... B-3 Figure B-3 SD board layout (front) .
Appendices Table C-10 USB connector 0 (port 0) (4-pin) .................................................................. C-6 Table C-11 USB I/F Relay connector (8-pin) .................................................................. C-7 Table C-12 USB connector 1 (port 2) (4-pin) .
Appendices App-viii QOSMIO F10 Maintenance Manua l (960-498) Table C-42 TV-tuner co nnector (12-pin) ....................................................................... C-29 Table C-43 SVP connector (14-pin) .......................................
Appendix B Appendix B Board Layout B.1 System Board Front View (e) (b) (c) (a) (d) (p) (f) (o) (g) (n) (h) (i) (j) (m) (l) (k) Figure B-1 System board layout (front) QOSMIO F 10 Maint enance Ma nual (.
B.1 System Board Front View Appendix B Board Layout Table B-1 System board ICs and connectors (front) Mark Number Name (a) CN5801 TV Input connector (b) CN9500 SD board I/F connector (c) CN9650 SWITCH.
Appendix B Board Layout B.2 System Board Back View B.2 System Board Back View (e) (b) (c) (d) (a) (f) (g) (h) (r) (i) (j) (q) (k) (l) (m) (p) (o) Figure B-2 System board layout (back) (n) QOSMIO F 10 .
B.2 System Board Back View Appendix B Board Layout Table B-2 System board ICs and connectors (back) Mark Number Name (a) CN8810 1st battery connector (b) CN8490 RTC battery connector (c) CN1820 ODD I/.
Appendix B Board Layout B.3 SD Board Front View B.3 SD Board Front View ( f ) (g) ( e ) ( d ) ( c ) ( b ) ( a ) ( h ) ( i ) ( l ) ( k ) (j) Figure B-3 SD board layout (front) Table B-3 SD board connec.
B.4 SD Board Back View Appendix B Board Layout B.4 SD Board Back View (a) Figure B-4 SD board layout (back) Table B-4 SD board connectors (back) Mark Number Name (a) CN3000 MDC I/F connector B-6 QOSMI.
Appendix B Board Layout B.5 SJ Board Front View B.5 SJ Board Front View (b) (a) Figure B-5 SJ board layout (front) Table B-5 SJ board connectors (front) Mark Number Name (a) DS6000 Headphone connector.
B.6 SJ Board Back View Appendix B Board Layout B-8 QOSMIO F10 Maint enance Ma nual (960- 498) B.6 SJ Board Back View (a) (b) Figure B-6 SJ board layout (back) Table B-6 SJ board connectors (back) Mark.
Appendix C Appendix C Pin Assignment System Board (FCLSY*) C.1 CN1800 HDD I/ F connector (44-pin) Table C-1 HDD I/F connector (44-pin) PIN No. Signal name I/O PIN No.
C.2 CN1820 ODD I/F connector (50-pi n) Appendix C Pin Assignment C.2 CN1820 ODD I/F connector (50-pin) Table C-2 ODD I/F connector (50-pin) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.3 CN2110 PC card I/F connector (70-pin) C.3 CN2110 PC card I/F connector (70-pin) Table C-3 PC card I/F connector (70-pin) (1/2) PIN No.
C.4 CN3230 Keyboard I/F connector (34- pin) Appendix C Pin Assignment Table C-3 PC card I/F connector (70-pin) (2/2) PIN No. Signal name I/O PIN No. Signal name I/O 51 MCVCCA-EYV I 52 MCVPPA-EYV I/O 5.
Appendix C Pin Assignment C.5 CN4400 Bluetooth I/F connector (20-pin) C.5 CN4400 Bluetooth I/F connector (20-pin) Table C-5 Bluetooth I/ F connector (20-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 N.C. - 3 BTMDL-P3N O 4 N.C. - 5 N.C.
C.8 CN8770 FAN connector (3-pin) Appendix C Pin Assignment C.8 CN8770 FAN connector (3-pin) Table C-8 FAN connector (3-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 FAN VCC I 2 GND - 3 FANG0-P3P I C.9 CN8780 FAN connector (for VGA) (3-pin) Table C-9 FAN connector (for VGA) (3-pin) PIN No.
Appendix C Pin Assignment C.11 CN4612 USB I/F Relay connector (8-pin) C.11 CN4612 USB I/F Relay connector (8-pin) Table C-11 USB I/F Relay connector (8-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 USB1PS-E5V I 2 USB1PS-E5V I 3 USBP4-S3N I/O 4 USBP4-S3P I/O 5 GND - 6 GND - 7 GND - 8 N.
C.15 CN9500 Sound board I/F connector (50-pin) Appendix C Pin Assignment C.15 CN9500 Sound boar d I/F connector (50-pin) Table C-15 Sound board I/F connector (50-pin) PIN No.
Appendix C Pin Assignment C.16 CN9650 SWITCH I/F connector (20-pin) C.16 CN9650 SWITCH I/F connector (20-pin) Table C-16 SWITCH I/F connector (20-pin) PIN No.
C.18 CN4200 1394 I/F connector (4-p in) Appendix C Pin Assignment C.18 CN4200 1394 I/F connector (4-pin) Table C-18 1394 I/F connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 TPB0-E3N I/O 2 TPB0-E3P I/O 3 TPA0-E3N I/O 4 TPA0-E3P I/O C.
Appendix C Pin Assignment C.20 CN1400 Memory connector A (200-pin) C.20 CN1400 Memory connector A (200-pin) Table C-20 Memory connector A (200-pin) (1/3) PIN No.
C.20 CN1400 Memory connector A (200- pin) Appendix C Pin Assignment Table C-20 Memory connector A (200-pin) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 65 SDQ26-B2P I/O 66 SDQ30-B2P I/O 67 S.
Appendix C Pin Assignment C.20 CN1400 Memory connector A (200-pin) Table C-20 Memory connector A (200-pin) (3/3) PIN No. Signal name I/O PIN No. Signal name I/O 135 SDQ34-B2P I/O 136 SDQ39-B2P I/O 137.
C.21 CN1401 Memory connector B (200- pin) Appendix C Pin Assignment C.21 CN1401 Memory connector B (200-pin) Table C-21 Memory connector B (200-pin) (1/3) PIN No.
Appendix C Pin Assignment C.21 CN1401 Memory connector B (200-pin) Table C-21 Memory connector B (200-pin) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 63 GND - 64 GND - 65 SDQ26-B2P I/O 66 S.
C.21 CN1401 Memory connector B (200- pin) Appendix C Pin Assignment Table C-21 Memory connector B (200-pin) (3/3) PIN No. Signal name I/O PIN No. Signal name I/O 135 SDQ34-B2P I/O 136 SDQ39-B2P I/O 13.
Appendix C Pin Assignment C.22 CN2200 Mini PCI I/F connector (124-pin) C.22 CN2200 Mini PCI I/F connector (124-pin) Table C-22 Mini PCI I/F c onnector (124-pin) (1/2) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.
C.22 CN2200 Mini PCI I/F connector ( 124-pin) Appendix C Pin Assignment Table C-22 Mini PCI I/ F connector (124-pin)(2/2) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.23 CN2400 WW Tuner I/F connector (124-pin) C.23 CN2400 WW Tuner I/F connector (124-pin) Table C-23 WW Tuner I/F connector (124-pin) (1/2) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C. - 2 N.C. - 3 N.C. - 4 N.C. - 5 N.
C.23 CN2400 WW Tuner I/F connector ( 124-pin) Appendix C Pin Assignment Table C-23 WW Tuner I/F connector (124-pin)(2/2) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.24 CN3201 PAD I/F connector (4-pin) C.24 CN3201 PAD I/F connector (4-pin) Table C-24 PAD I/F connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 GND - 2 IPDCLK-P5P I/O 3 IPDDAT-P5P I/O 4 GND - C.25 PJ5600 LCD I/F connector (41-pin) Table C-25 LCD I/F connector (41-pin) PIN No.
C.26 CN5080 CRT I/F connector (15- pin) Appendix C Pin Assignment C.26 CN5080 CRT I/F connector (15-pin) Table C-26 CRT I/F connector (15-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 CRTRED-PXP I 2 CRTG RN- PXP I 3 CRTBLU-PXP I 4 N.C - 5 GND - 6 GND - 7 GND - 8 GND - 9 DDC-P5V I 10 GND - 11 N.
Appendix C Pin Assignment C.29 CN5502 D-video I/F connector (14-pin) C.29 CN5502 D-video I/F connector (14-pin) Table C-29 D-video I/F connector (14-pin) PIN No.
C.31 CN3000 MDC I/F connector (30- pin) Appendix C Pin Assignment SD Board (FCLSD*) C.31 CN3000 MDC I/F connector (30-pin) Table C-31 MDC I/F connector (30-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 N.C - 2 GND - 3 GND - 4 N.C - 5 N.C - 6 N.
Appendix C Pin Assignment C.33 CN4621 USB I/F connector (port 4) (4-pin) C.33 CN4621 USB I/F connector (port 4) (4-pin) Table C-33 USB I/F connector (port 4) (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 (USBV) - 2 (D-0) I/O 3 (D+0) I/O 4 GND - C.
C.36 CN9550 Sound jack board I/F connector (21-pin) Appendix C Pin Assignment C.36 CN9550 Sound jack board I/F connector (21-pin) Table C-36 Sound jack board I/F connector (21-pin) PIN No.
Appendix C Pin Assignment C.37 CN9510 System boar d I/F connector (50-pin) C.37 CN9510 System board I/F connector (50-pin) Table C-37 System board I/F connector (50-pin) PIN No.
C.38 J2410 TV Antenna connector (4-p in) Appendix C Pin Assignment C.38 J2410 TV Antenna connector (4-pin) Table C-38 TV antenna connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 (CN9 611-3) I/O 2 (CN9611-1) I/O 3 (CN9 611-2) I/O 4 (CN9611-4) I/O C.
Appendix C Pin Assignment C.42 CN9614 TV-tuner connector (12-pin) C.42 CN9614 TV-tuner connector (12-pin) Table C-42 TV-tuner connector (12-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 TV-GND - 2 LINL-PXP I 3 TV-GND - 4 LINR-PXP I 5 TV-GND - 6 COMP01-PXP I 7 TV-GND - 8 LUMA01-PXP I 9 TV-GND - 10 CROM01-PXP I 11 TV-GND - 12 TV-GND - C.
C.44 CN6000 Internal Microphone I/F connect or (2-pin) Appendix C Pin Assignment SJ board (FCLSJ*) C.44 CN6000 Internal Microp hone I/F connector (2-pin) Table C-44 Internal Microphone I/F connector (2-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 (VREF1-P2V) I 2 A-GND - C.
Appendix C Pin Assignment C.47 CN9560 Sound boar d I/F connector (21-pin) C.47 CN9560 Sound boar d I/F connector (21-pin) Table C-47 Sound board I/F connector (21-pin) PIN No.
C.47 CN9560 Sound board I/F connector (21-pin) Appendix C Pin Assignment C-32 QOSMIO F10 Mainten ance Manu al (960- 498).
Appendix D Keyboard S can/Character Codes Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Code set 1 Code set 2 Cap No.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 29 | 2B AB 5D F0 5D *5 30 Caps Lo ck 3A BA 58 F0 .
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (3/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 58 Ctrl 1D 9D 14 F0 14 *3 60 Alt (L) 38 B8 11 F0 1.
Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 07 *.
Appendix D Keyboard Scan/Character Codes Table D-2 Scan codes with left Shift key Code set 1 Code set 2 Cap No. Key top Make Break Make Break 55 / E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0 12.
Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Code set 1 Code set 2 Cap No. Key top Make Break Make Break 75 INS E0 2A E0 52 E0 D2 E0 AA E0 12 E0 70 E0 F0 70 E0 F0 12 7.
Appendix D Keyboard Scan/Character Codes Table D-5 Scan codes in overlay mode Code set 1 Code set 2 Cap No. Keytop Make Break Make Break 09 8 (8) 48 C8 75 F0 75 10 9 (9) 49 C9 7D F0 7D 11 0 (*) 37 B7 .
Appendix D Keyboard Scan/Character Codes D-8 QOSMIO F 10 Mainte nance Manu al (960- 498) Table D-7 No.126 key scan code Code set 1 Code set 2 Key top Shift Make Make Pause Co m mo n * E1 1D 45 E1 9D C5 E1 14 77 E1 F0 14 F0 77 Ctrl* E0 46 E0 C6 E0 7E E0 F0 7E *: This key generates only make codes.
Appendix E Key Layout Appendix E Key Layout E.1 Keyboard La yout Figure E-1 Keyboard layout (for US) Figure E-2 Keyboard layout (for UK) QOSMIO F 10 Maint enance Ma nual (960- 498) E-1.
E.1 Keyboard Layout Appendix E Key Layout E-2 QOSMIO F10 Mai ntenance Manual (9 60-498).
Appendix F Appendix F Wiring Diagrams F.1 LAN Loopback Connector (1) BIBAP ‘ (TX + ) ( 2 ) BIDA N (TX -) (3) BIDBP (RX+ ) (4) BIDBN (RX-) Figure F-1 LAN loopback connector QOSMIO F 10 Maint enance M.
F.1 LAN Loopback Connector A ppendix F Wiring Diagrams F-2 QOSMIO F10 Mai ntenance Manual (9 60-498).
Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite th e system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS NOTE: 1.
Appendix G BIOS Rewrite Procedures G-2 QOSMIO F10 Maintena nce Manual (960- 498).
Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite th e EC/KBC system program when you update the EC/KBC system. Tools To rewrite the EC/KBC, you need the following tool: EC/KBC rewriting disk for the computer Rewriting the EC/KBC NOTE: 1.
Appendix H EC/KBC Rewrite Procedures H-2 QOSMIO F10 Maintena nce Manual (960- 498).
Appendix I Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration . Table I-1 MTBF Component Time (hours) System 5,277 QOSMIO F 10 Main.
Appendix I Reliability I-2 QOSMIO F 10 Maint enance Ma nual (960 -498).
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il Toshiba 960-498 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Toshiba 960-498 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Toshiba 960-498 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Toshiba 960-498 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Toshiba 960-498, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Toshiba 960-498.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Toshiba 960-498. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Toshiba 960-498 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
