Manuale d’uso / di manutenzione del prodotto MX-E501 del fabbricante Sony
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MZ-E501 AEP Model Hong K ong Model SERVICE MANUAL POR T ABLE MINIDISC PLA YER V er 1.2 2001. 12 With SUPPLEMEN T -1 Model Name Using Similar Mechanism MZ-E500 MD Mechanism T ype MT -MZE500-174 Optical.
2 MZ-E501 1. SER VICING NO TE ···················································· 3 2. GENERAL ·································································· 4 3.
3 MZ-E501 * Replacement of CXD2671-205GA (IC601) used in this set requires a special tool. When repairing this de vice with the power on, if you remov e the main board, this device stops w orking. In this case, you work without the de vice stopping by f astening the hook of the Open/Close detection switch (S809).
4 MZ-E501 SECTION 2 GENERAL LOCA TION AND FUNCTION OF CONTROLS >N . VOL+/– GROUP x x X 1 N> VOL+ VOL– . 3 Color Info-LED ./N> VOL +/– HOLD DISPLA Y SOUND PLA YMODE RPT/ENT x GROUP HOLD 3 Color Info-LED This section is e xtracted from instruction manual.
5 MZ-E501 r Disassemble the unit in the order as sho wn below . Note : Follo w the disassembly procedure in the numerical order giv en. 3-1. CASE ASSY , HOLDER ASSY SECTION 3 DISASSEMBL Y Optical pick-up assy (LCX-4E) Mechanism deck Case assy, Holder assy Set Bracket assy MAIN board case assy 1 screws (1.
6 MZ-E501 3-3. BRA CKET ASSY 3 screw (1.7) 1 screw (1.7) 2 brack et (R) ass y 4 brack et (L) assy 3-2. MECHANISM DECK 4 mechanism deck 1 step screw (MD) 5 OP FLEXIBLE boar d (CN501) 6 MO TER FLEXIBLE .
7 MZ-E501 3-4. MAIN BO ARD 3-5. OPTICAL PICK-UP ASSY (LCX-4E) case (rear) 3 battery case lid 2 claw 5 Remov e the solder ing 6 MAIN board 5 Remov e the solder ing 4 ornamental str ip 7 battery case assy 1 screw (1.7) optical pick-up assy (LCX-4E) 3 screw (MI 1.
8 MZ-E501 Remote control LCD • Press and hold down X to hold the current display while the k ey is being pressed. 4-2-3. How to release the TEST MODE When method 1 was used: T urn of f the power and open the solder bridge on T AP601 on the main board.
9 MZ-E501 2. During each test, press and hold do wn > N key or . key for a while to mo ve the optical pickup on the sled outer or inner perimeter . 3. Each test item is assigned with a three-digit item number . T he 100th place is a major item, 10th place is a middle item, and unit place is a minor item.
10 MZ-E501 3. Hereinafter , each time > N key is pressed, the refer ence information display changes as follows: • Press . ke y to go back to the previous display . • Contents of the history codes 0 XX 1 # # # # 0 XX N # # # # 0 XX N1 # # # # 0 XX N2 # # # # 0 XX R – – – – 4-6.
11 MZ-E501 4-8. KEY CHECK MODE 4-8-1. Outline of the function This mode is used to check to make sure that each of the ke ys (including the slide switch) on the set operates normally .(The 1 kHz signal is outputted from the L and R channels of head phones) 4-8-2.
12 MZ-E501 5-4. MANU AL PO WER ADJUSTMENTS 5-4-1. Adjustment sequence The adjustments should be alwa ys perf ormed in the follo wing sequence: 1 Vc PWM Duty (L) adjustment (item No.:762) r 2 Vc PWM Duty (H) adjustment (item No.:763) r 3 VLL PWM Duty adjustment (item No.
13 MZ-E501 3. Press X key to write the adjustment v alue. The adjustment completion display appears as follows. LCD display 5-4-5.Electrical offset adjustment method Note: Doing adjustment by the state that a disc does not enter . 1. Confirm the power v oltage is 1.
14 MZ-E501 3. If NG in the overall CD adjustments, return to Reset NV and perform from the electrical of fset adjustment again. LCD display XXX: NG item No. 4. If OK through the overall CD adjustments, then perform ov erall MO adjustments. LCD display 5.
15 MZ-E501 Contents Trac king servo ON ABCD gain adjustment KF gain adjustment RF gain adjustment FCS gain adjustment TRK gain adjustment READ GR V adjustment 1 R GR V setting • servo OFF SLED mov e.
16 MZ-E501 r W A VEFORMS Note on Schematic Dia gram: MAIN SECTION • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated except f or electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified.
17 17 MZ-E501 SI0 SCK0 S00 XCS NV 217 12 160 161 9 3 194 195 221 XRF RST PDS1 XCS NV SI0 SCK0 S00 XTEST PD S0 S MON SSB CLK SSB DATA VREF MON OFTRK MUTE XHP STB BEEP 142 RMC DTCK 167 OPR LED R PWM 163.
18 18 MZ-E501 IC 601 IC 901 IC 301 IC 501 CSP (Chip Size Package) S801 x E E S806 GROUP S803 . S802 (INFO) >N S805 VOL + S804 VOL – S808 HOLD OFF ON DRY BA TTERY SIZE "AA" (IEC DESIGNA TION LR6) 1PC, 1.5V 1-681-868- 11 (11) 11 (11) MAIN BOARD (SIDE A) * 12 A B C D E F G 3456789 1 0 6-2.
19 19 MZ-E501 IC 801 IC 551 RECHARGEABLE BA TTERY NC-6WM 1PC, 1.2V 600mAh MAIN BOARD (SIDE B) TO RVDD R-DA T A R-KEY RGND L R COM TO MOTOR FLEXIBLE BOARD (M901 : SPINDLE MOTOR) (M902 : SLED MOTOR) S80.
20 20 MZ-E501 OPR_LED_G_H OPR_LED_G_L OPR_LED_R_H OPR_LED_R_L TAP602 6-4. SCHEMA TIC DIA GRAM – MAIN SECTION (1/3) – • See page 16 f or W av eforms.
21 21 MZ-E501 IC B/D IC B/D C956 0.1 6-5. SCHEMA TIC DIA GRAM – MAIN SECTION (2/3) – • See page 23, 24 for IC Bloc k Diagrams..
22 22 MZ-E501 IC B/D (INFO) 6-6. SCHEMA TIC DIA GRAM – MAIN SECTION (3/3) – • See page 23 f or IC Block Diagrams ..
23 MZ-E501 6-7. IC BLOCK DIA GRAMS 56 55 42 41 40 CPUO W1 V1 U1 PWM OE 7 VM1 RO1 8 FO1 9 10 VM12 PGND1 11 RO2 12 PGND2 13 FO2 CPAIP CPAIM CPBIP CPBIM CPAO CPB0 VM3 RO3 FO3 VM34 PGND3 RO4 PGND4 FO4 14 .
24 MZ-E501 56 55 42 41 40 VLON XWK1 XWK2 XWK3 XWK4 VSTV 7 VRMC GND 8 VL VLO 9 10 VL 11 L2 12 PGND2 13 PGND2 VIF VA VAFB VDFB VIFFB GND VC VCO VCOUT L1 VC NC PGND1 PGND1 14 15 16 17 18 19 20 39 38 37 3.
25 MZ-E501 6-8. IC PIN FUNCTION DESCRIPTION • IC501 SN761057DBT (RF AMP , FOCUS/TRACKING ERR OR AMP) Pin No . Pin Name I/O Description 1 TE O T racking error signal output to the system controller (.
26 MZ-E501 • IC601 CXD2671-205GA (SYSTEM CONTROL) Pin No . Pin Name I/O Description 1 OPR_LED_G_H O High intensity green LED control (open) 2 OPR_LED_G_L O Low intensity green LED control (open) 3 X.
27 MZ-E501 Pin No . Pin Name I/O Description 47 FE I F ocus error signal input 48 A UX1 I Support signal input (A/D input) 49 VC I Middle point voltage input 50 ADIO O Not used (open) 51 ADR T I A/D c.
28 MZ-E501 Pin No . Pin Name I/O Description 91 DSPVDD2 — Power supply (for DSP block) 92 DSPVSS1 — Ground (for DSP block) 93 SPCU I Brushless spindle motor driv e comparison signal input (U) 94 S.
29 MZ-E501 Pin No . Pin Name I/O Description 156, 157 TEST1, TEST0 I T erminal 1, 0 for the main test 158 EV A I EV A/FLASH chip discrimination terminal 159 OPR LED O Operation LED control (Not used i.
30 MZ-E501 Pin No . Pin Name I/O Description 210 TSB SL V CHK I TSB slav e check 211 K-T AI_MON I Not used (open) 213 MCUVSS1 — Ground (for the microcomputer block) 214 CA V CL V SW O Not used (open.
SECTION 7 EXPLODED VIEWS NO TE: • -XX, -X mean standardized parts, so they may hav e some differences from the original one. • Items marked “*” are not stocked since the y are seldom required for routine service. Some delay should be anticipated when ordering these items.
32 MZ-E501 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 51 1-680-453-11 MOTOR FLEXIBLE BOARD 52 3-222-392-01 SCREW (M1.4), T APPING 53 3-222-394-01 CHASSIS 54 3-224-779-01 SPRING, THRUST DETENT 55 4-222-216-01 GEAR (SA) 56 3-338-645-51 WASHER 57 4-218-233-01 SCREW (1.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 33 SECTION 8 ELECTRICAL P AR TS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 34 MZ-E501 C956 1-107-820-11 CERAMIC CHIP 0.1uF 16V C963 1-107-820-11 CERAMIC CHIP 0.1uF 16V < CONNECTOR > ∗ CN501 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20P ∗ CN551 1-793-124-11 CONNECTOR, FPC (ZIP) 8P < DIODE > D101 8-719-064-91 DIODE 02DZ2.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 35 MZ-E501 < SWITCH > S801 1-786-033-11 SWITCH, T ACTILE ( x ) S802 1-786-033-11 SWITCH, T ACTILE ( >N ) S803 1-786-033-11 SWITCH, T ACTILE ( .
36 MZ-E501 MEMO.
MZ-E501 AEP Model Hong K ong Model SERVICE MANUAL SUPPLEMENT -1 V er 1.2 2001. 12 Subject : 1. Schematic dia gram and printed wiring board are c hang ed.
2 MZ-E501 How to distinguish the sets P ar ts code of printed wir ing board are changed. Before c hange After change Part No. Description 1-681-868-12 MAIN BORD Part No. Description 1-681-868-11 MAIN BORD Location of par ts code on changed printed wiring board.
3 3 MZ-E501 2-1. BLOCK DIA GRAM SECTION 2 DIA GRAMS SI0 SCK0 S00 XCS NV 217 12 160 161 9 3 194 195 221 XRF RST PDS1 XCS NV SI0 SCK0 S00 XTEST PD S0 S MON SSB CLK SSB DATA VREF MON OFTRK MUTE XHP STB B.
4 4 MZ-E501 2-2. PRINTED WIRING BO ARD – MAIN SECTION (SIDE A) – 12 A B C D E F G H I 3456789 1 0 1 1 1 2 1 3 1 4 1-681-868- 12 (12) IC 501 IC 601 IC 301 IC 901 15 6 7 10 12 13 15 18 19 24 C301 S806 GROUP S804 VOL- S808 HOLD OFF ON S805 VOL+ S801 S803 S802 DRY BA TTERY SIZE "AA" (IEC DESIGNA TION LR6) 1PC, 1.
5 5 MZ-E501 2-3. PRINTED WIRING BO ARD – MAIN SECTION (SIDE B) – IC 551 IC 903 IC 801 J301 COM R L S809 (OPEN/CLOSE DETECT SWITCH) TO MOTOR FLEXIBLE BOARD (M901 : SPINDLE MOTOR) (M902 : SLED MOTOR) MAIN BOARD (SIDE B) RECHARGEABLE BA TTERY NC-6WM 1PC, 1.
6 6 MZ-E501 2-4. SCHEMA TIC DIA GRAM – MAIN SECTION (1/3) – Note on Schematic Dia gram • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated e xcept f or electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified.
7 7 MZ-E501 2-5. SCHEMA TIC DIA GRAM – MAIN SECTION (2/3) – Note on Schematic Diagram • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated except f or electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified.
8 8 MZ-E501 2-6. SCHEMA TIC DIA GRAM – MAIN SECTION (3/3) – Note on Schematic Diagram • All capacitors are in µ F unless otherwise noted. pF: µµ F 50 WV or less are not indicated except f or electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified.
9 MZ-E501 6-7. IC BLOCK DIA GRAMS 56 55 42 41 40 CPUO W1 V1 U1 PWM OE 7 VM1 RO1 8 FO1 9 10 VM12 PGND1 11 RO2 12 PGND2 13 FO2 CPAIP CPAIM CPBIP CPBIM CPAO CPB0 VM3 RO3 FO3 VM34 PGND3 RO4 PGND4 FO4 14 1.
10 MZ-E501 56 55 42 41 40 VLON XWK1 XWK2 XWK3 XWK4 VSTV 7 VRMC GND 8 VL VLO 9 10 VL 11 L2 12 PGND2 13 PGND2 VIF VA VAFB VDFB VIFFB GND VC VCO VCOUT L1 VC NC PGND1 PGND1 14 15 16 17 18 19 20 39 38 37 3.
11 MZ-E501 6-8. IC PIN FUNCTION DESCRIPTION • IC501 SN761057DBT (RF AMP , FOCUS/TRACKING ERR OR AMP) Pin No . Pin Name I/O Description 1 TE O T racking error signal output to the system controller (.
12 MZ-E501 • IC601 CXD2671-207GA (SYSTEM CONTROL) Pin No . Pin Name I/O Description 1 OPR_LED_G_H O High intensity green LED control (open) 2 OPR_LED_G_L O Low intensity green LED control (open) 3 X.
13 MZ-E501 Pin No . Pin Name I/O Description 47 FE I F ocus error signal input 48 A UX1 I Support signal input (A/D input) 49 VC I Middle point voltage input 50 ADIO O Not used (open) 51 ADR T I A/D c.
14 MZ-E501 Pin No . Pin Name I/O Description 91 DSPVDD2 — Power supply (for DSP block) 92 DSPVSS1 — Ground (for DSP block) 93 SPCU I Brushless spindle motor driv e comparison signal input (U) 94 S.
15 MZ-E501 Pin No . Pin Name I/O Description 156, 157 TEST1, TEST0 I T erminal 1, 0 for the main test 158 EV A I EV A/FLASH chip discrimination terminal 159 OPR LED O Operation LED control (Not used i.
16 MZ-E501 Pin No . Pin Name I/O Description 210 TSB SL V CHK I TSB slav e check 211 K-T AI_MON I Not used (open) 213 MCUVSS1 — Ground (for the microcomputer block) 214 CA V CL V SW O Not used (open.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 17 SECTION 2 ELECTRICAL P AR TS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 18 MZ-E501 MAIN @Replacement of IC601 used in this set requires a special tool. C954 1-107-820-11 CERAMIC CHIP 0.1uF 16V C955 1-107-820-11 CERAMIC CHIP 0.1uF 16V C956 1-107-820-11 CERAMIC CHIP 0.
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 19 MZ-E501 MAIN < COMPOSITION CIRCUIT BLOCK > RB301 1-233-970-11 RES, NETWORK (CHIP TYPE) 33K RB302 1-233-966-11 RES, NETWORK (CHIP TYPE) 6.
MZ-E501 REVISION HIST OR Y Clicking the ver sion allows you to jump to the re vised page. Also, clicking the v ersion at the upper right on the revised page allo ws you to jump to the next re vised page.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il Sony MX-E501 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Sony MX-E501 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Sony MX-E501 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Sony MX-E501 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Sony MX-E501, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Sony MX-E501.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Sony MX-E501. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Sony MX-E501 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.