Manuale d’uso / di manutenzione del prodotto ASPIRE 5625 del fabbricante Acer
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Aspire 5625 Series Service Guide PRINTED IN T AIW AN Service guide files and updates are availab le on the ACER/CSD web; for more information, please refer to http://csd.
II Revision History Please refer to the table below for the updates ma de on this service guide. Date Chapter Up dates.
III Copyright Copyright © 2010 by Acer Incorporated. All rights rese rved. No part of this pub lication may be reproduce d, transmitted, transcribed, stored in a retrieval system, or translated into .
IV Conventions The following conventi ons are used in this manual: NOTE: This symbol where placed in th e Serv ic e Gu id e des ignat es a component tha t s hould be recycled according to t he local regulations. SCREEN MESSAGES Denotes actual messages that appear on screen.
V Preface Before using this information and the product it s upports, please read th e fo llowing general info rmation. 1. This Service Guide provides you with all techni cal information relating to the BASIC CON FIGURA TION decided for Acer's "glo bal" product offering.
VI.
VII T able of Contents System Specifications 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .
VIII T able of Contents Removing the Power Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 Removing the LCD Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79 Removing the USB Board .
IX T able of Contents HDD Not Operating C orrectly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 USB Failure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 Other Failures .
X T able of Contents.
Chapter 1 1 System Specifications Features Below is a brief summary of the computer ’s many features: Operating System • Genuine Wind ows® 7 Home Basic 64-bit • Genuine Windows® 7 Home Premium 6 4-bit Platform • CPU AMD AthlonII N330 2.3G 1M 35W Dual-Core • CPU AMD T uri onII N5 30 2.
2 Chapter 1 Storage subsystem • 160/250/320/5 00/640 GB or larger hard disk drive • Multi-in-1 card reader , supporti ng Secure Digital™ (SD), MultiM ediaCard (MMC), Memory S tick® (MS), Memory.
Chapter 1 3 • Acer PowerSmart 3-pin 65 W AC adapter • 95 (W) x 50 (D) x 25.4 (H) mm (3.74 x 1.96 x 1 inches) • 216 g (0.47 lbs)13 with 180 cm DC cable • 66.
4 Chapter 1 • McAfee® Internet Security Suite 20 09 T rial • McAfee® V irus Definitions • MyWinLocker® • Multimedia • Cyberlink® PowerDVD™ • NTI Media Maker™ •G a m i n g • Obe.
Chapter 1 5 System Block Diagram Keyboard LAN Atheros PCIE-LAN AR8151 RJ45 SATA0 150MB CRT HT3 ALINK X4 (10/100/1000) Speaker SATA - ODD USB2.0 Winbond KBC LPC 35mm X 35mm A12 MUXs (S.
6 Chapter 1 Notebook Tour This section provides an overview of th e fea tu r es and function s of the notebook. Top View # Icon Item Description 1 Acer Crystal Eye webcam Web camera for video communication. (only for certain models) 2 Microphone Internal microphone for recording sou nd.
Chapter 1 7 Closed Front View Left View 8 Power Indicates the comp ut er ’s power statu s . Battery Indicates the comp ut er’s batte ry st atus. 1. Charging: The ligh t shows amber when the light is charging. 2. Fully charged: the light shows blue when in AC mode.
8 Chapter 1 Right View 3 External display (VGA) port Connects to a display device (e.g. external, LCD monitor , LCD projector). 4 HDMI HDMI port Supports high definition digital video connections. 5 Ethernet RJ-45) port Connects to an Ethernet 10/100/1000-based netwo r k.
Chapter 1 9 Base View Indicators The computer has several easy-to-read status indica tors. The battery indicato r is visible even when the computer cover is closed. NOTE: 1. Charging: The b at te ry light shows amber w hen the battery is charging. 2. Full y charged: Th e light shows green when i n AC mode.
10 Chapter 1 TouchPad Basics The following items show you how to use the T ouchPad: • Move your finger across the T ouchPad (1) to move the cursor . • Press the left (2) and right (3) buttons located beneath the T ouchPad to perform selection and execution functions.
Chapter 1 11 Using the Keyboard Y our computer has a close-to-ful l-sized keyboard and an embedded numeric keypad, separate cursor , lock, function and special keys. Lock Keys and embedded numeric keypad The keyboard has three lock keys which yo u can toggle on and off.
12 Chapter 1 Windows Keys The keyboard has two keys that perform Wi ndows-specific functions. Key Description Windows key Pressed alone, this key ha s the same effect as clicking on the Windows St art button; it launches the S tart menu.
Chapter 1 13 Hot Keys The computer employs hotkeys or key combinations to access most of the computer 's controls like screen brightness and volu me output. T o activate hotkeys, press and hold the <Fn> key before pressing the other key in the hotkey combination.
14 Chapter 1 Special Keys Y ou can locate the Euro symbol and the US dollar si gn at the upper-cen ter and/or botto m-right of your keyboard. The Euro symbol 1. Open a text editor or word proc essor . 2. Hold <Alt Gr> and the n press the <5> key at the upper-cen ter of the keyboa rd.
Chapter 1 15 Hardware Specifications and Configuration SKU Configuration (see below for individual ite m specifications) Config/ SKU C1(UMA) C2(DI S) C3( DIS) C4(DIS) C5(DIS) 1 ST PN 1ZR8U9R0TN5 1ZR8UAR0TN2 1ZR8UAR0TN3 1ZR8UBR0TN2 1ZR8UCR0TN0 Descriptive NB,ZR8B(AMD 2.
16 Chapter 1 Hard Drive 9.5mm only - SA T A HDD HGST 2.5" 5400rpm 250GB HTS545025B9 A300 Panther B SA T A LF F/ W:C60F Disk imbalance criteria = 0.014g-cm HDD WD 2.5" 5400rpm 320GB WD3200BEVT - 22A23T0,ML32 0S,WD SA T A 8MB LF F/ W:01.01A01 HDD T OSHIBA 2.
Chapter 1 17 VRAM #N/A VRAM HYNIX Graphic DDRIII 800 1Gb H5TQ1G63BFR -12C LF VRAM SAMSUNG Graphic DDRIII 800 1Gb K4W1G1646E- HC12 LF VRAM HYNIX Graphic DDRIII 800 1Gb H5TQ1G63BFR -12C LF VRAM SAMSUNG .
18 Chapter 1 Processor CPU Fan T rue V alue T able (UMA) Throttling 50% : On = 100°C; OFF=85°C OS shut down at 105°C; H/W shut down at 1 10 °C CPU Fan T rue V alue T able (Discrete ) Throttling 50% : On = 95°C; OFF=90°C OS shut down at 100°C; H/W shut down at 80°C North Bridge Chipset Item Specification CPU • AMD AthlonII N330 2.
Chapter 1 19 Features • CPU HyperTransport. Interface • Supports 16-bit up/down HyperTran sport (HT) 3.0 interface up to 4.4 G T/s. • Supports 200, 400, 600, 800 , and 1000 MHz HT1 frequen cies. • Supports 1.6, 1.8, 2.0, and 2.2 GHz HT3 frequ encies.
20 Chapter 1 Item (NB Cont.) Features • Support for GDI exten si ons: • In Windows XP and Windows Vista: Alpha BL T , T ransparent BL T , and Gradient Fill. • In Windows 7: Alpha BL T , Transp a re nt BL T , Color Fill BL T , S tretch BL T , and Clear T ype BL T .
Chapter 1 21 Item (NB Cont.) Features • New multi-level texture cache to gi ve optimal performan ce , greater than 8x the previous designs. • High efficiency ring bus memory controller: • Programmable arbitration logic maximizes memory efficiency , software upgradeable.
22 Chapter 1 Item (NB Cont.) Features • Hardware cursor up to 64x64 pixe ls in 2 bpp, full color AND/XOR mix, and full color 8-bit alpha blend. • Hardware icon up to 128x128 pixels in 2 bpp, with tw o colors, transparent, and inverse transpar ent.
Chapter 1 23 Item (NB Cont.) Features • The RS880M complies w ith all rele vant Windows Logo Program (WLP) requirements from Micros oft for WHQL certification.
24 Chapter 1 Southbridge Chi pset Item Feature Chipset SB820M Package Features *Processor Interface Supports AMD mobile processors code-named “Champlain,” and “Geneva.
Chapter 1 25 Item (SB Cont.) Feature *SA T A Controller Supports six Third generation SA T A ports (compatible with de vices running at 6 Gbits/s, 3 Gbit/s, and1.5 Gbit/s) Complies with SA T A 2.6 specification Supports three modes of operation: *IDE emulation mode AHCI mode (compliant with AHCI specificati on revisio n 1.
26 Chapter 1 System Memory Item (SB Cont.) Features *Power Management ACPI specification 3.0 comp liant powe r management schemes Supports CPU C1e, C2, C3, C3 pop-up, C4, and C5 states Supports system.
Chapter 1 27 Vid e o Sp e c i f i c at i on s * For discrete mode ls only LCD Display/HDM I Resol u tions Supp orted Hard Disk Drive Interface Item Specification Chipset* AMD P ARK_XT AMD MADISON_PRO .
28 Chapter 1 BIOS LCD 15.6” S pindle speed (RPM) 5400 Performance S pecifications Buffer size 8 MB Interface SA T A DC Power Requirements V oltage tolerance 5V ±5% 5V ±5% 5V ±5% 5V ±5% Item Specification BIOS vendor Phoenix BIOS version Release 4.
Chapter 1 29 Bluetooth Audio Codec and Ampli fier Viewing Angle (up/down/right/ left) 15/35/45/45 T emperature Range (°C) Operating S torage (shipp ing) 0 to +50 -20 to +60 Item S pecification Bluetooth Controller Blu etooth module Foxconn Bluetooth BRM 2046 BT2.
30 Chapter 1 LAN Interface Keyboard Media Card Reader Item Specification LAN Chipset A THEROS AR81 51L Package 40pin QFN Features • The AR8151L is the fift h generation Gigabit Ethernet (GbE) controller solution from At heros.
Chapter 1 31 Camera Wireless LAN Battery Item Specifications V endor and model SUYIN/ Chicony/ Liteon T ype CMOS image sensor with WXGA (resolution 1280X800) Interface USB Port Focusing rang e 26.6cm ~ i nfinity Dimensions (L x W x H mm) 65 .0 ±0.3 X 8.
32 Chapter 1.
Chapter 2 33 System Utilities BIOS Setup Utility The BIOS Setup Utility is a hardware configuration prog ram built into y our computer ’s BIOS (Basic Input/ Output System). Y our computer is already properly configu red and optimi zed, and you do not need to run this utility .
34 Chapter 2 Information The Information screen displays a summary of your computer ha rdware inform ation. NOTE: The system information is su bject to diff erent models. Parameter Description CPU T ype This field shows the CP U type and spee d of the system.
Chapter 2 35 Main The Main screen allows th e user to set the system time and date as well as enable and disa ble boot option and recovery . NOTE: The screen above is for your reference only . Actua l values may differ . The table below describes the parameters in this screen.
36 Chapter 2 Processor Assisted Virtualization Enables, disables processor assisted virtualiza tion. Note: this option is only available on CPUs that support this function.
Chapter 2 37 Security The Security screen co ntains parameters that help sa feguard and protect your co mpu ter from unautho ri zed use. The table below describes the parameters in this screen. Settings in boldface are the default and suggested parameter settings.
38 Chapter 2 Setting a Password Follow these steps as you set the user or the supervisor p assword: 1. Use the ↑ and ↓ keys to highlight th e Set Supe rvisor Password parameter and press the Enter key . The Set Supervisor Password box appears: 2. T ype a password in the “Enter New Password” field.
Chapter 2 39 Changing a Password 1. Use the ↑ and ↓ keys to highlight th e Set Supe rvisor Password parameter and press the Enter key . The Set Password box appears. 2. T ype the current p assword in the Enter Curr en t Pa ssw or d field and press Enter .
40 Chapter 2 Boot This menu allows the user to deci de the order of boot de vices to load the operatin g system. Bootable devices includes the USB diskette drives, the onboard hard disk d rive and the DVD drive in the module ba y .
Chapter 2 41 Exit The Exit screen allows you to save or discard any changes you made an d qui t th e BIOS Utility . The table below describes the parameters in this screen. Parameter Description Exit Saving Changes Exit System Setu p and save your changes to CMOS.
42 Chapter 2 BIOS Flash Utility The BIOS flash memory upd ate is required for the following conditions: • New versions of system programs • New features or options • Restore a BIOS when it becomes corrupted.
Chapter 2 43 DOS Flash Utility Perform the following steps to use the DOS Flash Utility: 1. Press F2 during boo t to enter the Setup Men u. 2. Select Boot Menu to modify the boot priority order , for example, if using U SB HDD to Update BIOS, move USB HDD to position 1.
44 Chapter 2 6. Flash is complete when the message Fl ash progra mming complete displays. WinFlash Utility Perform the following steps to use the WinFlash Utility: 1. Double click the WinFlash executable. 2. Click OK to begin the update. Wi nF lash closes al l applications and shuts down the system.
Chapter 2 45 Remove HDD/BIOS Password Utilities This section provide you with remo ving HDD/BIOS method: Remove HDD Password: When the user keys in the wrong password three times, the system reports the following error code to user . T o unlock the HDD password, perform the following steps: 1.
46 Chapter 2 Removing BIOS Passwords: If you key in the wrong Supervisor Password three time s, System Disabled displa ys on the screen. See the image below . T o reset the BIOS password, run clnpwd.exe as follows: 1. From a DOS prompt, Execute clnpwd.
Chapter 2 47 Miscellaneous Utilities Using Boot Sequence Selector Boot Sequence Selector allows the boot order to be changes without accessing the BIOS. T o use Boot Sequence Selector , perform the following steps: 1. Enter into DOS. 2. Execute BS.exe to display the usage screen.
48 Chapter 2 Example 1: Read DMI In formation from Memory Input: dmitools /r Output: Manufacturer (T ype1, Offset04h): Acer Product Name (T ype1, Offset05h): Aspire one xxxxx Serial Number (T ype1, Of.
Chapter 3 49 Machine Disassembly and Replacement This chapter contains step-by-s tep procedures on how to disass emble the notebook computer for maintenance and troubleshooting .
50 Chapter 3 Pre-disassembly Instructions Before proceeding with the disassembly procedure, make su re that you do the following: 1. T urn off the power to the system and all peripherals. 2. Unplug the AC adapter and all power and signal cab les from the system.
Chapter 3 51 Disassembly Process The disassembly pro cess is divided i nto the following sections: • External components disassembly • Main unit disassembly • LCD module disassembly The flowcharts provided in the su cceeding disasse mbl y sections illustrate the entire disa ssembly seque nce.
52 Chapter 3 External Module Disassembly Process NOTE: The product previews seen in the disassembl y proce dures may not represent the final product color or configuration. Screw List Ste p Screw Qu antity Part No. Base Cover Disassembly M2.5*5 8 86.ARE07.
Chapter 3 53 External Modules Disassembly Flowchart Disconn ec t p ower and sig nal c ab les from s ys t em Re mov e Dummy C ar d Turn off sys t em and p er i ph eral s po we r Re mov e DIM M Re mov e.
54 Chapter 3 Removing the Battery Pack 1. T urn the computer over . 2. Slide the battery lock/unl ock latch to the unlock p osition. 3. Slide and hold the battery relea se latch to the release pos ition (1), then slide out the battery pack from the main unit (2).
Chapter 3 55 Removing the Dummy Card 1. Press the dummy card in to allo w it to spring out. 2. Pull the dummy card out..
56 Chapter 3 Removing the Base Door 1. See “Removing the Battery Pack” on page 54. 2. Remove the eight (8) screws. 3. Lift the base door up at the finger indent ation location provided in the bottom cover . Ste p Screw Quantity Screw T ype Base Door Disassembly M2.
Chapter 3 57 4. Lift the base door out and away ..
58 Chapter 3 Removing the Hard Disk Drive Module 1. See “Removing the Battery Pack” on page 54. 2. See “Removing the Base Door” on page 56. 3. Grasp the pull tab on the top of the HDD. 4. Pull the tab horizontally to slide the HDD out of the connector dock.
Chapter 3 59 6. Remove the two (2) screws of the HDD bracket. 7. Lift the bracket away from the HDD. Ste p Screw Quantity Screw T ype HDD Bracket Disassembly M3*3Ni 2.
60 Chapter 3 Removing the DIMM Module 1. See “Removing the Battery Pack” on page 54. 2. See “Removing the Base Door” on page 56. 3. Push the memory module clips outwards.
Chapter 3 61 Removing the WLAN Module 1. See “Removing the Battery Pack” on page 54. 2. See “Removing the Base Door” on page 56. 3. Detach the two (2) cables from the Wireless LAN module. IMPORT ANT : T a ke note of the Main (black cable connecting to pcb socket 1 ) and Auxiliary (white cable connecting to pcb socket 2 ) connectors.
62 Chapter 3 5. Pull the WLAN mod ule out and away ..
Chapter 3 63 Removing the ODD Module 1. See “Removing the Battery Pack” on page 54. 2. See “Removing the Base Door” on page 56. 3. Push the ODD module out of the bay at the location shown.
64 Chapter 3 5. Remove the two (2) screws of the ODD bracket. 6. Remove the ODD bracket. 7. Pry the ODD bezel off the ODD module. Ste p Screw Quantity Screw T ype ODD Module Disassembly M2*3Ni 2.
Chapter 3 65 Removing the RTC Battery 1. See “Removing the Battery Pack” on page 54. 2. See “Removing the Base Door” on page 56. 3. Disconnect the RTC connector . 4. Pull the RTC battery of f the mainb oard. NOTE: The RTC battery has been highlighted with the yellow circle as shown in the previous image.
66 Chapter 3 Main Unit Disassembly Process IMPORT ANT : Cable paths and positioning may not represen t the actual model. During the removal and replacement of components, ensure all a vailable cabl e channels and clips are used and that the cables are replaced in the same position.
Chapter 3 67 Main Unit Disassembly Flowchart Remove External Modul es before proceeding Remove Mainboard Remove LCD Module Remove Keyboard Remove Upper Cover Remove Thermal Module Remove Bluetooth Mod.
68 Chapter 3 Screw List Ste p Screw Quantity Part No. Upper Cover Disassembly M2.5*4Ni 6 86.EDM07. 003 M2.0*3 3 86.A08V7.005 Lower Cover Disassembly M2.5*5 20 86.ARE07.003 T2.5*2Ni 1 86.B1907.005 Switch Board Disassembly T2.5*2Ni 2 86.B1907.005 Power Module Disassembly T2.
Chapter 3 69 Removing the Keyboard IMPORT ANT : The keyboard is easily warped or damaged durin g the re moval process. T ake care not to use excessive force when removing to prevent damage. 1. See “Removing the Battery Pack” on page 54. 2. See “Removing the Base Door” on page 56.
70 Chapter 3 8. Flip the keyboard ov er . 9. Detach the keyboard FPC. a. Unlock the FPC b. Pull the keyboard awa y a b.
Chapter 3 71 Removing the Upper Cover 1. See “Removing the Keyboard ” on page 69. 2. Unlock and disconnect the T ouchpad board FFC. 3. Unlock and disconnect the switch board FFC.
72 Chapter 3 5. Disconnect the speaker cable. 6. Remove the nine (9) screws in the upper cover . Ste p Screw Quantity Screw T ype Upper Cover Disassembly M2.
Chapter 3 73 7. T urn the computer over and remove the twenty-one (21) screws in the lower cover . 8. T urn the computer ninety degrees. Push the upper cove r apart from the lower cover in the location shown. Ste p Screw Quantity Screw T ype Lower Cover Disassembly M2.
74 Chapter 3 9. Pry the upper cover away from the lower cover along the front edge. 10. Push the upper cover off the bottom cover . 11 . Lay the computer fl at t hen pull the upper cover away from the lower cover .
Chapter 3 75 Removing the Switch Board 1. See “Removing the Upper Cove r” on page 71. 2. Remove the two (2) screws. 3. Lift the switch board away from the upper cover and turn it over . Ste p Screw Quantity Screw T ype Switch Board Disassembly T2.
76 Chapter 3 4. Unlock and disconnect the switch board FFC..
Chapter 3 77 Removing the Power Board 1. See “Removing the Upper Cove r” on page 71. 2. Unlock and disconnect the power board FFC. 3. Remove the two (2) screws.
78 Chapter 3 4. Lift the power board away ..
Chapter 3 79 Removing the LCD Module 1. See “Removing the Upper Cove r” on page 71. 2. Pull the LCD connector restraining tape off the mainboard. 3.
80 Chapter 3 5. Disconnect the microphone connector. 6. Pull the microphone cab le off the assembly . 7. T urn the computer over and remove the an tenna cables fro m the retention guides.
Chapter 3 81 8. Remove the WLAN cables from the retention guides. 9. T urn the computer over and pu ll the adhesive tape along with the c abl e bundle off the bottom cover .
82 Chapter 3 11 . Remove the righ t antenna cables adhesive tape along with th e cable bundle. 12. Remove the right antenna cables from th e retention guide. 13. Remove the two (2) screws from the two hinges. Ste p Screw Quantity Screw T ype LCD Module Hinge Disassembly M2.
Chapter 3 83 14. Lift the LCD module out of the assembly ..
84 Chapter 3 Removing the USB Board 1. See “Removing the Upper Cove r” on page 71. 2. Unlock and remove the USB board FFC. 3. Remove the one (1) screw securing the USB Board to the Lower Cover . Ste p Screw Quantity Screw T ype USB Board Disassembly M2.
Chapter 3 85 4. Lift away the USB board. 5. Unlock and remove the USB board FFC from the mainboard..
86 Chapter 3 Removing the Bluetooth Module 1. See “Removing the Upper Cove r” on page 71. 2. Detach the Bluetooth module cable from the mainboard. 3. Remove the one (1) screw . Ste p Screw Quantity Screw T ype. Bluetoot h Mo du l e Disassembly M2.
Chapter 3 87 4. LIft the Bluetooth module away from the computer . 5. Detach the Bluetooth module cable from the module..
88 Chapter 3 Removing the Mainboard 1. See “Removing the Upper Cove r” on page 71. 2. See “Removing the USB Board” on page 84. 3. See “Removing the Bluetooth Modu le” on page 86. 4. T urn the computer over and disconnect the power cable fro m the mainboard.
Chapter 3 89 6. Remove the main board out of the assembly: lift th e internal edge up first then pull ou t the external connector edge..
90 Chapter 3 Removing the Thermal Module 1. See “Removing the Mainboard” on page 88. 2. Disconnect the thermal module fan connector . 3. Loosen the four (4) captive screws in ord er: 4, 3, 2, and last 1. 4. Lift the thermal module away from the main board.
Chapter 3 91 Removing the CPU 1. See “Removing the Mainboard” on page 88. 2. See “Removing the Therma l Module” on page 90. 3. Unlock the CPU. Use a flat head screw driver to turn the screw 180º counter clockwise. NOTE: The location of the locking lug on the CPU screw .
92 Chapter 3 Removing the PCH Thermal Unit 1. See “Removing the Mainboard” on page 88. 2. See “Removing the Therma l Module” on page 90. 3. Loosen the one (1) captive screw . 4. Lift the thermal unit away . NOTE: Circui t boards >10 cm² have been h ighlight ed with a yellow rect angle as shown in the previous image.
Chapter 3 93 Removing the Power Cable Assembly 1. See “Removing the Mainboard” on page 88. 2. Remove the power cable from the retention guides. 3. Remove the one (1) screw from the power assembly bracket. Ste p Screw Quantity Screw T ype Power Assembly Disassembly M2.
94 Chapter 3 4. Lift the power cable a ssembly out of the chassis. 5. Lift the power cable connector out of the bracket..
Chapter 3 95 LCD Module Disassembly Process IMPORT ANT : Cable paths and positioning may not represen t the actual model. During the removal and replacement of components, ensure all a vailable cabl e channels and clips are used and that the cables are replaced in the same position.
96 Chapter 3 Removing the LCD Bezel 1. See “Removing the Switch Board” on page 75. 2. Remove the two (2) bezel screw covers and screws. 3. Pry the bezel away from the top and then work around o ne corner . Ste p Screw Quantity Screw T ype LCD Bezel Disassembly M2.
Chapter 3 97 4. Pry open the bottom corners and along the bottom edge. 5. Lift the bezel off the modu le..
98 Chapter 3 Removing the Camera Board 1. See “Removing the LCD Bezel” on page 96. 2. Disconnect the camera connector . 3. Pull up the camera b oard.
Chapter 3 99 Removing the LCD Panel 1. See “Removing the Camera Board” on page 98. 2. Remove the four (4) screws of the LCD panel. 3. Remove the two (2) screws in the left hinge. Ste p Screw Quantity Screw T ype LCD Panel Disassembly M2.5x3 4 Ste p Screw Quantity Screw T ype Remove Left Hinge M2.
100 Chapter 3 4. Lift the left hinge off the module. 5. Lift the LCD panel out. 6. Lift the LCD panel out, turn o ver and remove the protective tape over the FPC cable connector .
Chapter 3 101 7. Disconnect the FPC cable..
102 Chapter 3 Removing the Antennas 1. See “Removing the LCD Panel” on page 99. 2. Remove the cables from the retention guides. 3. Free the cables completely .
Chapter 3 103 5. Pry the antenna off the casing. 6. Remove the two (2) screws of the right hinge. 7. Lift away the hinge. Ste p Screw Quantity Screw T ype Right Hinge Disassembly M2.
104 Chapter 3 8. Remove the cables from the retention guide s. 9. Pry the antenna off the casing..
Chapter 3 105 Removing the Microphone Cable 1. See “Removing the Antennas” on page 102. 2. Pry the microphone up. 3. Lift the microphone cable out of the retention gui des.
106 Chapter 3 LCD Reassembly Procedure NOTE: Adhesive is required to be added at various steps to cables and components. Locations of adhesive to be added is designated with a: NOTE: During manufacture a cyanoacrylate gl ue is used pro v ided by Holdtite Adhesives L TD.
Chapter 3 107 Replacing the Antennas 1. See See “Replacing the Microphone” on page 106. 2. Adhere the an t enna down firmly onto the LC D m od u l e cas ing.
108 Chapter 3 4. Replace the right hinge. 5. Replace the two (2 ) screws. Ensure that the cable is coming ou t of the hinge correctly . 6. Adhere the left antenna to the casing, pressing firmly down on the foil and antenna. Ste p Screw Quantity Screw T ype Replace Right Hinge M2.
Chapter 3 109 7. Lay the cables along the retention gui des..
11 0 Chapter 3 Replacing the LCD FPC Cable 1. Connect the FPC cable connector . 2. Place the protective clear adhesive myla r tape down firmly over the connector.
Chapter 3 111 Replacing the LCD Panel 1. Place the LCD panel into LCD module as shown bottom edge first, making sure the cable is not trapped behind the panel.
11 2 Chapter 3 3. Replace the two (2 ) screws, while ensuring the ca bles pass through the hinge co rrectly . Ste p Screw Quantity Screw T ype Replace Left Hinge M2.
Chapter 3 11 3 Replacing the Camera Board 1. Replace the camera cable and adhe re the tapes. 2. Apply adhesive and lay the Camera Board board down pressing firmly .
11 4 Chapter 3 Replacing the LCD Bezel 1. Place the bezel hinge covers over the hinges. 2. Press down on the top middle edge of the bezel to engag e the locking clips.
Chapter 3 11 5 3. Press down on the be zel edge working simul taneously around the edges to the bottom..
11 6 Chapter 3 4. Replace the two (2) bezel screws and screw covers. Ste p Screw Quantity Screw T ype Replace LCD Bezel M2.5*4 2.
Chapter 3 11 7 Main Unit Reassembly Process Replacing the Power Assembly 1. Place the power jack into the bracket. 2. Place the bracket into the lower cover .
11 8 Chapter 3 3. Replace the one (1) screw . 4. Lay the cables in the retention guides. Ste p Screw Quantity Screw T ype Replace Power Assembly M2.5*4 1.
Chapter 3 11 9 Replacing the PCH Thermal Module 1. Place the PCH thermal module on the chip. 2. T ighte n the one (1) captive screw . Replacing the CPU IMPORT ANT : The mainboard ha s a Pin1 locator that must be positioned correspo nding to the marker on the CPU.
120 Chapter 3 2. Using a flat-bladed screw driver , rotate the CPU locking screw 180° clockwise to secure the CPU in place..
Chapter 3 121 Replacing the Thermal Module IMPORT ANT : Apply a suitable thermal grease and ensure all heat pads are in place before replacing the Thermal Module. The following thermal grease type s are approved for use: • Silmore GP50 • Honeywell • Jet Motor 7762 The following thermal pads are approved for use: • Eapus XR-PE 1.
122 Chapter 3 Replacing the Main Board 1. Slide the main board external connector edge in first to the lower case, th en lowe r into place. 2. Replace the one (1) screw to secure the mainboard to the lower cover. 3. T urn the computer over and connect the power connector .
Chapter 3 123 Replacing the USB Card 1. Place the USB card into the lower case external edge first. 2. Replace the one (1) screw . 3. Connect and lock the USB card FFC to the USB board.
124 Chapter 3 4. Connect and lock the USB card FFC to the mainboard..
Chapter 3 125 Replacing the Bluetooth Module 1. Connect the Bluetooth cable to the Bluetooth mod ule. 2. Place the Bluetooth mo dule onto the mainbo ard pressing down firmly . 3. Replace the one (1) screw . Ste p Screw Quantity Screw T ype. Replace Bluetooth Module M2 .
126 Chapter 3 4. Connect the Bluetooth module cable to the main board..
Chapter 3 127 Replacing the LCD Module 1. Place the LCD module hinges into position on the lo wer case. 2. Replace the two (2 ) screws, one each i n the left and right h inges. 3. Insert the right antenna cabl es through the lower cover and pull thro ugh from the other side.
128 Chapter 3 4. Lay the right antenna cables under the retention guides and adh ere the tape. 5. Push the left antenna cables through the lower cover and adhere the tape. 6. Lay the microphone cable in the location sh own and press firmly to adhere the cable.
Chapter 3 129 7. Connect the microphone ca ble. 8. Lay the L VDS cable across the assembl y as shown and press down firmly . 9. Connect th e L VDC cable.
130 Chapter 3 10. Press the L VDS connector left and right adhesive tabs down onto the mainboard..
Chapter 3 131 Replacing the Power Board 1. Place the power board into the upper cover . 2. Replace the two (2) screws. 3. Connect and lock the FFC..
132 Chapter 3 Replacing the Switch Board 1. Connect and lock the FFC. 2. T urn the switch board over and place into the upper cover . 3. Replace the two (2) screws.
Chapter 3 133 Replacing the Upper Cover 1. Place the upper cover onto the lower cover aligni ng the hinges first and then press do wn around the edges.
134 Chapter 3 2. Replace the nine (9) screws. 3. T urn the computer over and replace the bottom co ver twenty-one (21) screws. Ste p Size Quantity Screw T ype Upper Cover Assembly M2*3 3 (blue call out) M2*5 Ni 6 (red call out) Ste p Size Quantity Screw T ype Lower Cover Assembly M2.
Chapter 3 135 4. Connect the sp ea ke r cab l e. 5. Connect and lock the switch board FFC. 6. Connect and lock the power board FFC..
136 Chapter 3 7. Connect and lock the button board FFC..
Chapter 3 137 Replacing the Keyboard 1. Connect the FFC to th e mainboard. 2. T urn the keyboard over and in se rt the bottom edge in first, then push to down ensure the five latches across the top are fully secured.
138 Chapter 3 Replacing the Wireless LAN Module 1. Lay the white wireless LAN antenna cable into the retention gui des. 2. Lay the white and black wireless LAN ant enna cables into the retention guides. 3. Insert the wireless LAN module into the connector .
Chapter 3 139 4. Replace the one screw . 5. Replace the connectors. The white (Aux) ca ble attaches to the connector marked 2 on the board . The black (Main) cable attaches to the connector marked 1 o n the board. Ste p Size Quantity Screw T ype WLAN Assembly M2.
140 Chapter 3 Replacing the DIMM Module 1. Slide the DIMM module in to the connector . 2. Press down till the locking springs click into place..
Chapter 3 141 Replacing the Hard Disk Drive 1. Place the HDD bracket onto the HDD. 2. Replace the two (2) screws. 3. Insert the HDD into the bay inserti ng the bra cket flanges in to the lower cover slots first.
142 Chapter 3 4. Grasp the tab and slide the HDD firmly into the docking connector ..
Chapter 3 143 Replacing the RTC Battery 1. Place the RTC battery onto the mainboard and press down firmly . 2. Connect the RTC battery cable to the mainboard.
144 Chapter 3 Replacing the ODD Module 1. Replace the ODD bezel. 2. Replace the ODD bracket..
Chapter 3 145 3. Replace the two (2 ) screws of the ODD bracket. 4. Push the ODD completely into the bay until flush with the lower co ver . Ste p Screw Quantity Screw T ype ODD Module Disassembly M2*.
146 Chapter 3 Replacing the Base Door 1. Insert the base door edge fla nges into the slots. 2. Lower the base door. 3. Replace the eight (8) screws. Ste p Size Quantity Screw T ype Base Door Assembly M2.
Chapter 3 147 Replacing the Battery 1. Slide the battery into position. 2. Close the locking la tch. Replace the Dummy Card Push the dummy card into the sl ot until it clicks into place.
148 Chapter 3.
Chapter 4 149 Troubleshooting Common Problems Use the following procedure as a gui de for computer problems. NOTE: The diagnosti c tests are intended to test only Acer products. Non-Acer products, prototype cards, or modified options can give false e rrors and invalid system responses.
150 Chapter 4 Power On Issue If the system doesn’t power on, perform the following acti ons one at a time to correct the problem. Do not replace non-defective FRUs: Computer Shuts down Intermittently If the system powers off at intervals, perform the fo llowing actions one at a time to correct the problem.
Chapter 4 151 No Display Issue If the Displa y doesn’t work, perform the following actions one at a time to correct the prob lem. Do not replace non-defective FRUs: No POST or Video If the POST or video doesn’t display , perform the foll owing actions one at a time to correct the problem.
152 Chapter 4 If the computer boots correctly , add the devices one by one until the fai lure po int is discovered. 6. Reseat the memory modules. 7. Remove the drives (see “Disa s semb ly Process” on page 51). 8. If the Issue is still not resolved, see “Online Support Information” on page 219.
Chapter 4 153 6. If the Issue is still not resolved, see “Online Support Information” on page 219. LCD Failure If the LCD fails, perform the following actions one at a time to correct the problem.
154 Chapter 4 Built-In Keyboard Failure If the built-in Keyboard fails, perform the foll owing actions one at a ti me to correct the problem. Do not replace non-defective FRUs: Start Keyboard properly.
Chapter 4 155 TouchPad Failure If the To u c h P a d doesn’t work, perform the follo wing actions one at a time to correct the problem. Do not replace non-defective FRUs: Start Check M/B T/P FFC Re .
156 Chapter 4 Internal Speaker Failure If the internal Speakers fail, perform the following actions one at a time to correct the probl em. Do not replace non-defective FRUs: Sound Problems If sound problems are experienced, p erform the following actions one at a time to correct the problem.
Chapter 4 157 9. Restore system and file settings from a k nown good date using System Restor e . If the issue is not fixed, repeat the prec eding steps and select an earl ier time and date. 10. Reinstall the Operating System. 11 . If th e Issue is still not resolved, see “Online Support Information” on page 219.
158 Chapter 4 8. If the Issue is still not resolved, see “Online Support Information” on page 219. HDD Not Operating Correctly If the HDD does not op erate correctly , perform the following ac tions one at a time to correct the problem. 1. Disconnect all external devices.
Chapter 4 159 USB Failure If the rightside USB port fails, perform the following actio ns one at a time to correct the problem. Do not replace non-defective FRUs: Other Failures If the VGA board, LAN .
160 Chapter 4 Intermittent Problems Intermittent system hang problems can be caused by a variety of reasons th at have nothin g to do with a hardware defect, such as: cosmic radiation, electros tatic discharge, or software errors. FRU replacement should be considered only when a recurring prob lem exists.
Chapter 4 161 POST Code Reference Tables These tables describe the POST codes and components of the POST process. Post Code Range Code POST Routine Description 02h V erify Real Mode 03h Disable Non-Ma.
162 Chapter 4 38h Shadow system BIOS ROM 3Ah Autosize cache 3Ch Advanced configurati on of chipset registers 3Dh Load alternate registe rs with CMOS values 42h Initialize interrupt vectors 45h POST d .
Chapter 4 163 83h Configure non-MCD IDE controllers 84h Detect and install external parallel ports 85h Initialize PC-co mpa tible PnP ISA devices 86h Re-initialize onboard USB ports.
164 Chapter 4 BDh Display MultiBoot menu BEh Clear screen (optional) BFh Check virus and backup reminde rs C0h T ry to boot with INT 19 C1h Initialize POST Error Manager (PEM) C2h Initialize error log.
Chapter 5 165 Jumper and Connector Locations Mainboard Top View CCD/MIC Speaker LCD Cardreader K/B T/P USB B/T Chapter 5.
166 Chapter 5 Mainboard Bottom View VGA HDMI LAN USB MIC Headphon e/ SPDIF Batter DC-in ODD HDD FAN WLAN.
Chapter 5 167 BIOS Recovery BIOS Recovery by Crisis Disk BIOS Recovery Boot Block The BIOS Recovery Boot Block is a sp ecial block of BIOS. It is used to boot up the system with minimum BIOS initialization. Users can enable this f eature to restore the BIOS firmware to the factory settings if a BIOS flash process fails.
168 Chapter 5.
Chapter 6 169 FRU (Field Replaceable Unit) List This chapter gives you the FRU (Field Repla ceable Unit) listing in global configurations of the compu ter . Refer to this chapter whenever ordering for parts to repair or for RMA (Return Merchandise Authorization).
170 Chapter 6 Main Assembly Item Description Part Number 1 Keyboard KB.I170A.172 2 T op Cover 60.PTN07.002 3 Function Board 55.PU407.003 4 Battery BT .
Chapter 6 171 NOTE: Part numbers may be different depending on your model. Please refer to the FRU List for a full li sting of part numbers. 7 ODD Bracket 33.PTN07.001 8 USB Board 55.PU407.002 9 CPU KC.33001.DMP 10 WWAN Card LC.21300.008 1 1 WLAN Card NI.
172 Chapter 6 LCD Assembly NOTE: Part numbers may be different depending on your model. Please refer to the FRU List for a full li sting of part numbers. Item Description Pa rt Number 1 LCD Cover 60.PU407.002 2 LCD Bezel 60.PTN07.005 3 LCD Panel LK.15606.
Chapter 6 173 FRU List CA TEGORY P ARTNAME ACER P ART NO. ADAPTER Adapter DEL T A 65W 19V 1.7x5.5x1 1 Y ellow ADP-65JH DB A, L V5 LED LF AP .06501.026 Adapter LITE-ON 65W 19V 1.7x5.5x1 1 Y ell ow P A-1650- 22AC L V5 LED LF AP .06503.024 Adapter HIPRO 65W 19V 1.
174 Chapter 6 CABLE PWR CORD V943B30001218008 DANISH 3P 27.A03V7.006 PWR CORD(ISR)1.8M 3PBLK FZ0I0008-038 27.T A TV7.005 PWR CORD V50CB3T3012180QD T W-1 1 0V ,3P 27.A99V7.002 POWER CORD(SWI)1.8M 3PBLAC K FZ010008-01 1 27.A99V7.004 POWER CORD(IT) 1.8M 3PBLACK FZ0100 08-008 27.
Chapter 6 175 DVD RW DRIVE DVD/RW SUPER MUL TI 9.5MM MODULE 6M.PTN07.001 ODD TOS HIBA Super-Multi DRIVE 9.5mm T ray DL 8X TS- U633F LF W/O bezel SA T A (HF + Windows 7) KU.00801.034 ODD P ANASON IC Supe r-Mu lti DRIVE 9.5mm T ray DL 8X UJ892 LF W/O bezel SA T A GBAS2.
176 Chapter 6 HDD HGST 2.5" 5400rpm 500GB HTS545050B9A300 Panther B SA T A LF F/W:C60F Disk imbalance criteria = 0.014g-cm KH.50007.010 HDD WD 2.5" 5400rpm 640GB WD6400BEVT -22A0RT0, ML320 SA T A 8MB LF F/W:01.01A01 KH.64008.004 HDD BRACKET 33.
Chapter 6 177 Keyboard ACER AC7T_A1 0B AC7T Internal 17 St andard 104KS Black S panish T exture KB.I170A.166 Keyboard ACER AC7T_A1 0B AC7T Internal 17 St andard 103KS Black Arabic T exture KB.I170A.147 Keyboard ACER AC7T_A1 0B AC7T Internal 17 St andard 104KS Black FR/Arabic T exture KB.
178 Chapter 6 Liteon 1.3M L T 966 5AL (09P2SF1 19 ) AM.21400.069 Liteon 1.3M L T6AASP( 09P2BF127) AM.21400.070 MEMOR Y Memory ELPIDA SO-DIMM DDRIII 1066 1GB EBJ10UE8BDS0-AE-F LF 128*8 0.065um KN.1GB09.012 Memory SAMSUNG SO-DIMM DDRIII 1066 1 GB M471B2873EH1-CF8 LF 64* 16 0.
Chapter 6 179 SCREW SCREW M2.5*4.0-I(BUWZN)(NYLON P A TCH)IRON 86 .EDM07.003 SCREW M2.5*5-I(BNI)(NYLOK) 86.A03V7.003 SCREW M2.5*2-I (NI,NYLOK)IRO N 86 .EDM07.002 SCREW M2.0*3.0-I-NI-NYLOK 86.A08V7.005 SCREW M3*0.5+3.5I 86.N1407.0 07 SCREW M2.5*2.5-I(BNI)(NYL OK) IRON 86.
180 Chapter 6.
Appendix A 181 Model Definition and Configuration Model RO Country Acer Part No Description AS5625G- P924G50Mn EMEA Germany LX.PV702.097 AS562 5G-P924G50Mn W7 HP64A TDE1 MC MADISON_PRO1GBCks_3V3 2*2G/ 500_L/BT/6L3.0/5R/ CB_bgn_1.3C_AL_DE1 1 AS5625G- P824G50Mn WW WW S2.
182 Appendix A AS5625G- P924G50Mn EMEA Algeria LX.PV702.086 AS562 5G-P924G50Mn EM W7HP64EMA TDZ1 MC MADISON_PRO1GBCks_3V3 2*2G/500_L/ 6L3.0/5R/C B_bgn_1.3C_AL_ES81 AS5625G- P924G50Mn EMEA South Africa LX.PV702.085 AS5625G-P92 4G50Mn EM W7HP64EMA TZA1 MC MADISON_PRO1GBCks_3V3 2*2G/500_L/ 6L3.
Appendix A 183 AS5625G- P924G50Mn EMEA Latvia LX.PV702.071 AS5625G-P924G50Mn W7HP64A TL V1 MC MADISON_PRO1GBCks_3V3 2*2G/500_L/ 6L3.0/5R/C B_bgn_1.3C_AL_RU22 AS5625G- P924G50Mn EMEA UK LX.PV702.070 AS5625G-P924G50Mn W7HP64A TGB1 MC MADISON_PRO1GBCks_3V3 2*2G/ 500_L/6L3.
184 Appendix A AS5625G- P924G50Mn EMEA Greece LX.PV702.054 AS5625G-P92 4G50Mn W7 HP64A T GR1 MC MADISON_PRO1GBCks_3V3 2*2G/ 500_L/6L3.0/5R/C B_bgn_1.3C_AL_EL31 AS5625G- P924G50Mn EMEA Austria LX.PV702.053 AS562 5G -P924G50Mn W7HP64A T A T1 MC MADISON_PRO1GBCks_3V3 2*2G/500_L/ 6L3.
Appendix A 185 AS5625G- P824G32Mn EMEA South Africa LX.PV702.039 AS5625G-P82 4G32Mn EM W7HP64EMA TZA1 MC MADISON_PRO1GBCks_3V3 2*2G/320/ 6L3.0/5R/C B_bgn_1.3C_AL_ES81 AS5625G- P824G32Mn EMEA Middle East LX.PV702.038 AS5625G-P82 4G32Mn EM W7HP64EMA TME4 MC MADISON_PRO1GBCks_3V3 2*2G/320/ 6L3.
186 Appendix A AS5625G- P824G32Mn EMEA UK LX.PV702.024 AS5625G-P824G32Mn W7HP64A TGB1 MC MADISON_PRO1GBCks_3V3 2*2G/ 320/6L3.0/5R/CB_bgn_1.3 C_AL_EN1 1 AS5625G- P824G32Mn EMEA Eastern Europe LX.PV702.023 AS5625G-P82 4G32Mn W7HP64A TEU5 MC MADISON_PRO1GBCks_3V3 2*2G/ 320/6L3.
Appendix A 187 AS5625G- P824G32Mn EMEA Austria LX.PV702.007 AS562 5G -P824G32Mn W7HP64A T A T1 MC MADISON_PRO1GBCks_3V3 2*2G/320/ 6L3.0/5R/C B_bgn_1.3C_AL_DE61 AS5625G- P824G32Mn EMEA France LX.PV702.006 AS5625G-P824G32Mn W7HP64A TFR1 MC MADISON_PRO1GBCks_3V3 2*2G/ 320/6L3.
188 Appendix A AS5625G- P824G50Mi EMEA Russia LX.PU802.090 AS5625G-P824G50Mi W7HP64RUA TRU1 MC P ARK_ XT512Cks_3V3 2*2G/500_L / 6L3.0/5R/C B_bg_1.3C_AL_RU1 1 AS5625G- P824G50Mn EMEA Middle East LX.PU802.089 AS5625G-P824G50Mn EM W7HP64EMA TME4 MC P ARK_XT5 12Cks_3V3 2*2G/500_L/6L3.
Appendix A 189 AS5625G- P824G50Mn EMEA Switzerla nd LX.PU802.075 AS5625G-P824G50Mn W7 HP64A TCH1 MC P ARK_ XT512Cks_3V3 2*2G/500_L / 6L3.0/5R/C B_bgn_1.3C_AL_IT41 AS5625G- P824G50Mn EMEA Luxembo urg LX.PU802.074 AS5625G-P824G50Mn W7 HP64A TLU3 MC P ARK_ XT512Cks_3V3 2*2G/500_L / 6L3.
190 Appendix A AS5625G- P824G50Mn EMEA Denmark LX.PU802.058 AS562 5G-P824G50Mn W7HP64A TDK2 MC P ARK_ XT512Cks_3V3 2*2G/500_L / 6L3.0/5R/CB_ bgn_1.3C_AL_ENS1 AS5625G- P824G50Mn EMEA Eastern Europe LX.PU802.057 AS5625G-P824G50Mn W7 HP64A TEU7 MC P ARK_ XT512Cks_3V3 2*2G/500_L / 6L3.
Appendix A 191 AS5625G- P324G32Mn EMEA Middle East LX.PU802.042 AS5625G-P324G32Mn EM W7HP64EMA TMEB MC P ARK_XT5 12Cks_ 3V3 2*2G/320/6L3.0/5R/ CB_bgn_1.3C_AL_AR A1 AS5625G- P324G32Mn EMEA Middle East LX.PU802.041 AS5625G-P324G32Mn EM W7HP64EMA TME2 MC P ARK_XT5 12Cks_ 3V3 2*2G/320/6L3.
192 Appendix A AS5625G- P324G32Mn EMEA Baltic LX.PU802.028 AS5625G-P324G32Mn W7HP64A TBC5 MC P ARK_ XT512Cks_3V3 2*2G/320/ 6L3.0/5R/C B_bgn_1.3C_AL_L T1 1 AS5625G- P324G32Mn EMEA Holland LX.PU802 .027 AS5625G-P324G32Mn W7HP64A TNL1 MC P ARK_ XT512Cks_3V3 2*2G/320/ 6L3.
Appendix A 193 AS5625G- P324G32Mn EMEA Italy LX.PU802.01 1 AS562 5G-P32 4G32Mn W7HP64A TIT1 MC P ARK_XT5 12Cks_ 3V3 2*2G/320/6L3.0/5R/ CB_bgn_1.3C_AL_IT 1 1 AS5625G- P324G32Mn EMEA S pain LX.PU802.01 0 AS5625G-P324G32Mn W7HP64A TES1 MC P ARK_ XT512Cks_3V3 2*2G/320/ 6L3.
194 Appendix A AS5625- N332G50Mn WW WW S2.PV602.001 AS5625-N332G50Mn W7HP6 4AWW1 MC UMACks_3 1*2G/500_L/6L3.0/5R/ CB_bgn_1.3C_AL_ES62 Model CPU LCD VGA Chip VRAM 1 Memory 1 Memory 2 AS5625G- P924G50Mn APP920 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P824G50Mn APP820 NLED15.
Appendix A 195 AS5625G- P924G50Mn APP920 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P924G50Mn APP920 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P924G50Mn APP920 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P924G50Mn APP920 NLED15.
196 Appendix A AS5625G- P924G50Mn APP920 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P924G50Mn APP920 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P824G32Mn APP820 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P824G32Mi APP820 NLED15.
Appendix A 197 AS5625G- P824G32Mn APP820 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P824G32Mn APP820 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P824G32Mn APP820 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P824G32Mn APP820 NLED15.
198 Appendix A AS5625G- P924G64Mn APP920 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 SO2GBIII10 AS5625G- P822G50Mn APP820 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 N AS5625G- P922G50Mn APP920 NLED15.6W XGAGS MADISO N_PRO 1G-DDR3 (64*16*8) SO2GBIII10 N AS5625G- P924G50Mi APP920 NLED15.
Appendix A 199 AS5625G- P824G50Mn APP820 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P824G50Mn APP820 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P824G50Mn APP820 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P824G50Mn APP820 NLED15.
200 Appendix A AS5625G- P824G50Mn APP820 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P824G50Mn APP820 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P824G50Mn APP820 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P824G50Mn APP820 NLED15.
Appendix A 201 AS5625G- P322G50Mn AAP320 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 N AS5625G- P522G50Mn A T P520 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 N AS5625G- P324G32Mn AAP320 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P324G32Mi AAP320 NLED15.
202 Appendix A AS5625G- P324G32Mn AAP320 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P324G32Mn AAP320 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P324G32Mn AAP320 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P324G32Mn AAP320 NLED15.
Appendix A 203 AS5625G- P324G32Mn AAP320 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P324G32Mn AAP320 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P324G32Mn AAP320 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625G- P324G32Mn AAP320 NLED15.
204 Appendix A AS5625G- N334G32Mn AAN330 NLED15.6W XGAGS PA R K _ X T 512M- DDR3 (64*16*4) SO2GBIII10 SO2GBIII10 AS5625- P324G32Mn AAP320 NLED15.6W XGAGS UMA N SO2GBIII10 SO2GBIII10 AS5625- P323G32Mn AAP320 NLED15.6W XGAGS UMA N SO2GBIII10 SO1GBIII10 AS5625- P522G25Mn A T P520 NLED15.
Appendix A 205 AS5625G- P924G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G50Mn N500GB5.
206 Appendix A AS5625G- P924G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G50Mn N500GB5.
Appendix A 207 AS5625G- P824G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G32Mn N320GB5.
208 Appendix A AS5625G- P824G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P924G64Mn N640GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN B T 2.1 AS5625G- P822G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN B T 2.
Appendix A 209 AS5625G- P824G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G50Mn N500GB5.
210 Appendix A AS5625G- P824G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P822G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN B T 2.
Appendix A 21 1 AS5625G- P324G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P324G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P324G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P324G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P324G32Mn N320GB5.
212 Appendix A AS5625G- P324G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P324G32Mn N320GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN N AS5625G- P824G64Mn N640GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN B T 2.1 AS5625G- P824G50Mn N500GB5.4KS NSM8XS9 .5 3rd WiFi 2x2 BGN B T 2.
Appendix B 213 Test Compatible Components This computer ’s compat ibility is tested and verified by Acer ’s internal testing department. All of its system functions are tested under Windows ® 7 environment. Refer to the following lists for components, adapter ca rds, and peripherals which have passed these tests.
214 Appendix B Memory SAMSUNG SO-DIMM DDRIII 1066 2GB M471 B5 673EH1-CF8 LF 128*8 0.055um KN.2GB0B.012 Memory HYNIX SO-DIMM DDRIII 10 66 2GB HMT125S6BFR8C-G7 N0 LF 128*8 0.055um KN.2GB0G .014 Memory NANY A SO-DIMM DDRIII 1333 2GB NT2GC64B8HC0NS-C G LF 128*8 0.
Appendix B 215 HDD WD 2.5" 5400rpm 320GB WD3 200BEVT -22A23 T0,ML320S,WD SA T A 8MB LF F/W:01.01A01 KH.32008.019 HDD SEAGA TE 2.5" 5400rpm 500 GB ST9500325AS Wyatt SA T A LF F/ W:0001SDM1 KH.50001.01 1 HDD TOSHIBA 2.5" 5400rpm 500GB MK5065GSX,Capricorn BS, 320G/P SA T A 8MB LF F/W :GJ001J KH.
216 Appendix B VRAM side port VRAM SAMSUNG Graphic DDRIII 800 1G b K4W1G1646E-HC12 LF VR.1GB0B.006 VRAM HYNIX Graphic DDRIII 800 1G b H5TQ1G63BFR-12C LF VR.1GB0G .004 VRAM A TI Graphic DDRIII 80 0 1Gb 23EY2387MA12-SZ LF+HF VR.1GB0T .002 VRAM VRAM SAMSUNG Graphic DDRIII 800 1G b K4W1G1646E-HC12 LF VR.
Appendix B 217 Modem External USB Lite+LSI modem LC.MOD00.001 Part Description Part #.
218 Appendix B.
Appendix C 219 Online Support Information This section describe s online tech ni cal support servi ces available to hel p you repair your Acer Systems. If you are a distributor , dealer , ASP or TPM, please re fer your techn ical que ries to your local Acer branch office.
220.
Index 221 A Antennas Removing 102, 107 B Battery Pack Removing 54 BIOS ROM type 28 vendor 28 BIOS Utility 33–42 Advanced 37 Boot 40 Exit 41 Navigating 33 Power 40 Save and Ex it 41 Security 37 Syste.
222 Index Mainboard Removing 88 media access on indicator 9 Memory Check 150 Microphone Removing 99, 111 Model Definition 181 N No Display Issue 151 num lock on indicator 9 O ODD Failure 159 Online Su.
223 Index.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il Acer ASPIRE 5625 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Acer ASPIRE 5625 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Acer ASPIRE 5625 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Acer ASPIRE 5625 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Acer ASPIRE 5625, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Acer ASPIRE 5625.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Acer ASPIRE 5625. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Acer ASPIRE 5625 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
