Manuale d’uso / di manutenzione del prodotto 2394F1U del fabbricante Lenovo
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Har dwar e Maint enance Manual ThinkP ad T530, T530i, and W530.
Note Before using this information and the pr oduct it supports, be sur e to read the gener al information under Appendix A “Notices” on page 115. Third Edition (Mar ch 2013) © Copyright Lenovo 2012, 2013.
Contents About this manual . . . . . . . . . . . iii Chapter 1. Safety information . . . . . . 1 General safety . . . . . . . . . . . . . . . . 1 Electrical safety . . . . . . . . . . . . . . . 2 Safety inspection guide . . . . . . . . . . . . 3 Handling devices that ar e sensitive t o electr ostatic discharge .
Reading or writing the ECA information . . . 65 Chapter 10. Removing or replacing a FRU . . . . . . . . . . . . . . . . . . 67 General guidelines . . . . . . . . . . . . . 67 Before servicing ThinkP ad T530, T530i, and W530 . . . . . . . . . . . . . .
About this manual This manual contains service and r eference information for the following ThinkPad ® pr oducts. ThinkP ad T530 and T530i Machine type (MT) 2359, 2392, 2393, 2394, 2429, 2430, and 2434 ThinkP ad W530 MT 2436, 2438, 2439, 2441, 2447, 2449, and 2463 Use this manual along with the advanced diagnostic tests to tr oubleshoot pr oblems.
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Chapter 1. Safety information This chapter pr esents the following safety information that you need to be familiar with before you service a ThinkP ad notebook comput er .
Electrical safety Observe the following rules when working on electrical equipment. Important: • Use only appr oved tools and t est equipment. Some hand tools have handles cover ed with a soft material that does not insulat e you when working with live electrical curr ents.
• If an electrical accident occurs: – Use caution; do not become a victim yourself. – Switch off power . – Send another person t o get medical aid. Safety inspection guide The purpose of this inspection guide is t o assist you in identifying potentially unsafe conditions.
Notes: 1. Use pr oduct-specic ESD pr ocedures when they ex ceed the r equirements noted her e. 2. Make sure that the ESD protective devices you use have been certied (ISO 9000) as fully effective. When handling ESD-sensitive parts: • K eep the parts in prot ective packages until they ar e insert ed into the product.
DANGER DANGER DANGER DANGER DANGER DANGER Chapter 1 . Safety information 5.
DANGER 6 Hardwar e Maintenance Manual.
PERIGO PERIGO PERIGO Chapter 1 . Safety information 7.
PERIGO PERIGO PERIGO PERIGO PERIGO 8 Hardwar e Maintenance Manual.
DANGER DANGER DANGER DANGER DANGER Chapter 1 . Safety information 9.
DANGER DANGER DANGER VORSICHT VORSICHT 10 Hardwar e Maintenance Manual.
VORSICHT VORSICHT VORSICHT VORSICHT VORSICHT VORSICHT Chapter 1 . Safety information 11.
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Chapter 1 . Safety information 13.
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Chapter 1 . Safety information 15.
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Laser compliance statements (multilingual tr anslations) The laser compliance stat ements in this section are pr ovided in the following languages: • English • Ar abic • Br azilian P ortuguese • F r ench • German • Hebr ew • Japanese • K orean • Spanish • T r aditional Chinese Chapter 1 .
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Chapter 1 . Safety information 19.
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Chapter 1 . Safety information 21.
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Chapter 1 . Safety information 23.
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Chapter 2. Important ser vice information This chapt er presents the following important service information that applies to all machine types supported by this manual: • “Str ategy for r eplacing.
Attention: The drive startup sequence in the comput er you are servicing might have been changed. Be extr emely car eful during writ e oper ations such as copying, saving, or formatting. If you select an incorrect drive, data or progr ams can be overwritt en.
General Announce V ariant (GA V) This is a standard model (x ed conguration). GA Vs ar e announced and offer ed to all customers. The MTM portion of the machine label is a 4-digit MT and 3-digit model, wher e model = a “xed part number ”, not “CT O” (Example: 1829-F1U).
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Chapter 3. General check out This chapter pr esents following information: • “What t o do rst” on page 29 • “Checkout guide” on page 30 • “P ower system check out” on page 32 Before you go to the check out guide, be sure to r ead the following important not es.
• Dist ortion, deformation, or discolor ation of the cosmetic parts • Plastic parts, latches, pins, or connectors that have been cr acked or broken by e xcessive for ce • Damage caused by liquid.
• Micr osoft Windows Server ® 2003 • Micr osoft Windows Server 2008 T o download and install a quick test pr ogram, go t o http://ww w .lenovo.com/diags and follow the instructions on the W eb site. T o run a t est using a quick t est progr am, do the following: 1.
3. F ollow the instructions on the W eb site to cr eate a bootable diagnostic medium on a USB device or CD . T o use the diagnostic medium you have cr eated, do one of the following: • If you have creat ed the bootable diagnostic medium on a USB device, do the following: 1.
• If the comput er does not charge during operation, go t o “Checking operational char ging” on page 33. T o check the ac adapter , do the following: 1. Unplug the ac adapter cable from the computer . 2. Measure the output voltage at the plug of the ac adapter cable.
T erminal V oltage (V dc) 1 + 0 to + 12.6 7 Ground (-) 1(+) 2(+) 3 4 5 6(-) 7(-) 3. Measure the resistance between battery terminals 5 and 7. The resistance must be 4 to 30 K Ω. If the resistance is not correct, replace the batt ery pack. 4. Depending on the voltage that you measure, do one of the following: • If the voltage is less than +11.
Chapter 4. Related service information This chapter pr esents following information: • “Restoring the factory contents by using the product Recovery Disc Set” on page 35 • “P asswords” on .
9. When the recovery process completes, the W elcome t o Microsoft Windows scr een is displayed. F ollow the instructions on the screen to complet e the Windows setup. 10. After you have completed the Windows setup, you might want t o r estore the original startup sequence.
• T o perform a complete format, click F ully clean the drive to start the pr ocess. The process will take sever al hours. 4. F ollow the instructions on the scr een to reset your comput er t o the fact ory default settings.
1. Move your cursor t o the top-right or bottom-right corner of the screen to display the charms, and click Search . 2. T ype recovery in the Search eld and click Settings . Then click Cr eate a recovery drive . 3. Click Y es in the User Account Control window t o allow the Recovery Media Cr eator progr am to start.
P ower-on password A power-on passwor d (POP) prot ects the system fr om being power ed on by an unauthorized person. The password must be enter ed befor e an operating system can be booted. F or how to r emove the POP , see “How to remove the power-on password” on page 39.
4. Select Security . 5. Select P assword . 6. Select P ower-On P assword . 7. T ype the current supervisor passwor d in the Enter Current Passwor d eld. Then leave the Enter New P assword eld blank, and pr ess Enter twice. 8. In the Changes have been saved window , press Enter .
In certain circumstances, the computer goes into sleep mode aut omatically: • Aft er a period of inactivity specied in power plan settings • When the battery indicator blinks or ange, indicatin.
Note: Do the FRU replacement or other actions in the sequence shown in the column headed “FRU or action, in sequence. ” If r eplacing a FRU does not solve the pr oblem, put the original part back in the computer . Do not replace a nondefective FRU .
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 2000: ThinkV antage ® Active Prot ection sensor diagnostics failed. System board 2100: Detection error on HDD0 (Main HDD) 1. Reseat the har d disk drive. 2. Main hard disk drive 3.
T able 4. Beep symptoms (continued) Symptom or error FRU or action, in sequence Five short beeps System board One long and two short beeps System board No-beep symptoms T able 5. No-beep sympt oms Symptom or error FRU or action, in sequence No beep, power-on indicat or on, L CD blank, and no POST .
Intermittent pr oblems Intermittent system hang pr oblems can be due to a variety of causes that have nothing to do with a hardwar e defect, such as cosmic r adiation, electrostatic discharge, or software errors. FRU replacement should be considered only when a pr oblem recurs.
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Chapter 5. Installing and conguring RAID This chapter contains the following t opics: • “Supported RAID levels” on page 47 • “Conguring the system UEFI BIOS t o enable embedded SA T A .
Creating RAID volumes This t opic describes how to use the Intel ® Rapid Stor age T echnology option ROM congur ation utility to creat e RAID volumes. T o cr eate RAID volumes, do the following: 1. T urn on the computer . 2. When a message Pre ss <Ct rl-I> t o en t er Con gura t ion Ut il it y is displayed, pr ess Ctr+I.
Chapter 6. Status indicators This chapter presents the system status indicators that show the status of the comput er . 1 2 3 4 5 6 7 9 8 1 0 © Copyright Lenovo 2012, 2013 49.
T able 7. Status indicators Indicator Meaning 1 Speaker mut e indicator Orange: The speaker is on mute. T o mute or unmute the speakers, pr ess the speaker mute button. 2 Microphone mute indicator Orange: The micr ophone is on mute. By default, when the microphone is on mute, none of the r ecording devices is available.
T able 7. Status indicators (continued) Indicator Meaning Note: If the computer is operating on battery power , the battery status indicator does not work while the comput er is turned off or is in sleep mode or hibernation mode. 10 Sleep status indicator Green: The computer is in sleep mode.
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Chapter 7. Fn key combinations The following table describes the functions of Fn key combinations. T able 8. Fn key combinations Key combination Description Fn+F3 Locks the computer . Fn+F4 Puts the computer into sleep mode. T o resume normal operation, pr ess the Fn key .
T able 8. Fn key combinations (continued) Key combination Description Fn+P Has the same function as the P ause key on a conventional keyboard. Fn+S Has the same function as the SysRq key on a conventional keyboar d. Fn+K Has the same function as the ScrLK key on a conventional keyboard.
Chapter 8. L ocations This chapt er intr oduces the locations of the computer hardwar e components. Locating computer controls, connectors, and indicators This topic introduces the locations of the comput er contr ols, connect ors, and indicat ors.
Rear view 1 9 2 3 4 5 7 6 8 1 0 1 Status indicat ors (see Chapter 6 “Status indicators” on page 49 ) 6 USB 3.0 connectors 2 Smart card slot (on some models) 7 Video graphics array (VGA) connect or 3 Wireless r adio switch 8 Mini DisplayP ort connect or 4 IEEE 1394 connector 9 ac power connector 5 USB 2.
• “L CD FRUs and CRUs” on page 60 • “Miscellaneous kits and other FRUs” on page 61 Notes: • Each FRU is available for all types or models, unless otherwise specied.
Major FRUs and CRUs 1 25 24 23 22 21 20 19 18 17 16 15 14 13 2 4 5 6 7 8 9 10 11 12 9 3 T able 9. Major FRUs and CRUs No. FRU description Self-service CRU Optional-service CRU 1 L CD unit (See “L CD FRUs and CRUs” on page 60.
T able 9. Major FRUs and CRUs (continued) No. FRU description Self-service CRU Optional-service CRU 3 Expr essCard blank bez el or Expr essCard Y es No 4 Speaker assembly No No 5 mSA T A solid state d.
L CD FRUs and CRUs 1 2 3 4 5 6 7 8 9 10 T able 10. L CD FRUs and CRUs No. FRU description Self-service CRU Optional-service CRU 1 liquid crystal display (L CD) bezel assembly No No 2 Integr ated camer.
T able 10. L CD FRUs and CRUs (continued) No. FRU description Self-service CRU Optional-service CRU 6 L CD r ear cover assembly No No 7 L CD cable No No 8 LED sub car d No No 9 L CD panel No No 10 Clear plate No No Important: F or color sensor models, if the L CD panel needs a replacement, order a special L CD panel FRU kit from L enovo.
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Chapter 9. FRU r eplacement notices This chapt er pr esents notices relat ed t o r emoving and replacing parts. Read this chapter carefully befor e replacing any FRU .
• T orque driver If you have a tor que driver , refer t o the T or que column in the screw information table for each st ep. – Make sur e that you use the corr ect scr ew.
If the MTM and P roduct ID numbers differ from each other on the rear label, use what is shown for the Pr oduct ID eld. See the following e xample: MTM on the rear label: TTTT -CT O S/N SSSSSSS Product ID on the r ear label: TTTT -MMM (Use this number when setting Serial Number .
If the system board is being r eplaced, try t o r ead the EC A information from the old system boar d and transfer the information to the new system. If the syst em boar d is inoper able, this will not be possible.
Chapter 10. Removing or replacing a FRU This chapt er provides instructions on how to remove or r eplace a FRU. CRU statement for cust omers: Y ou can resolve some problems with your product with a r eplacement part you can install yourself, called a “Cust omer Replaceable Unit” or “CRU .
• The system board is sensitive t o, and can be damaged by, electr ostatic dischar ge. Befor e t ouching it, establish personal gr ounding by t ouching a gr ound point with one hand or by using an electr ostatic discharge (ESD) strap.
2 1 When installing: Install the batt ery pack in the slot, and then make sur e that the battery latch is in the locked position. 1020 Serial Ultrabay Enhanced device or blank be zel F or access, r em.
Step Screw (quantity) Color T orque NA M3 × 5 mm, at-head (1) Black 0.392 Nm (4 kgf-cm) 1030 Memory module slot cover F or access, r emove this FRU: • “1010 Battery pack” on page 68 Removal steps of memory module slot cover Note: Loosen the scr ews 1 , but do not r emove them.
1 2 1040 Memory module (bottom slot) F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “1030 Memory module slot cover ” on page 70 Removal steps of memory module (bottom slot) Attention: F or ThinkP ad W530 models that come with two dummy car ds installed, do not r eplace the dummy cards with memory modules.
1 1 2 When installing: Insert the notched end of the memory module into the slot. P ress the memory module rmly, and pivot it until it snaps into place.
2 1 3 F or hard disk drive and rubber rails: 4 4 F or solid stat e drive and spacers: 4 4 Chapter 10 . Removing or replacing a FRU 73.
When installing: Make sur e that the solid state drive connect or or hard disk drive connector is attached rmly . 1060 K eyboard F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “1030 Memory module slot cover ” on page 70 Removal st eps of keyboard 1.
3. Lift the keyboar d in the direction shown by the arrow 3 , and then detach the connect or 4 . 3 4 Installation st eps of keyboar d When installing the keyboar d, do the following: 1.
1 2. Attach the keyboar d and ensur e that the keyboard edges a are under the frame. 3. When the fr ont side of the keyboard is housed rmly, gently press the keys with your thumbs and slide the keyboar d towar d you until the keyboard is in place.
Note: Make sure that the fr ont side of the keyboard b is housed rmly . b b 4. Secure the keyboard by tightening the screws fr om the bott om side of the computer .
When installing: Insert the notched end of the memory module into the socket. Pr ess the memory module rmly, and pivot it until it snaps into place.
Step Screw (quantity) Color T orque 2 M2 × 3 mm, wafer-head, nylon-coated (1) Silver 0.181 Nm (1.85 kgf-cm) Chapter 10 . Removing or replacing a FRU 79.
When installing: • In models with a wir eless LAN car d that has two antenna connectors, plug the gr ay cable int o the main connector , and the black cable into the auxiliary connector on the card. If the computer you are servicing has three cables, put the white cable in the cable prot ection tube as shown in the following illustr ation.
2 3 Step Screw (quantity) Color T orque 2 M2 × 3 mm, wafer-head, nylon-coated (1) Silver 0.181 Nm (1.85 kgf-cm) Chapter 10 . Removing or replacing a FRU 81.
4 When installing: Plug the r ed cable into the main connector and the blue cable into the auxiliary connect or . Removal steps of PCI Express Mini Card for wireless W AN (half-siz e WW AN card) In st.
2 3 Step Screw (quantity) Color T orque 2 M2 × 3 mm, wafer-head, nylon-coated (1) Silver 0.181 Nm (1.85 kgf-cm) 4 5 5 Removal steps of mSA T A solid state drive The computer comes with either a PCI Express Mini Car d for wireless W AN or an mSA T A solid-state drive.
• Ensur e that you partition the mSA T A solid-stat e drive after installing it on the computer you are servicing. Otherwise, the mSA T A solid-stat e drive will not function corr ectly . F or instructions on on how to partition an mSA T A solid-state drive, go t o http://www.
1 2 When installing: Make sure that the Expr essCard blank bezel or ExpressC ard is correctly orient ed as shown in the following illustr ation. 1110 K eyboard bezel assembly F or access, remove these.
Important: Read the following instructions rst before replacing the k eyboard be zel assembly for ThinkP ad W530 models with a color sensor . • If the hard disk drive is not defective, and only the k eyboard bezel assembly needs a r eplacement: 1.
4 3 7 6 6 5 5 Chapter 10 . Removing or replacing a FRU 87.
F or ThinkP ad W530 models with a color sensor , if you need to remove the color sensor from the failing k eyboard bez el assembly and install the color sensor to the new k eyboard be zel assembly, do the following: 3 3 1 2 4 Step Screw (quantity) Color T orque 3 M2 × L7 mm, bind-head, (2) Silver 0.
• “1100 ExpressC ard blank bezel or Expr essCard” on page 84 Removal steps of Bluetooth daught er car d Step Screw (quantity) Color T orque 1 M2 × 3 mm, wafer-head, nylon-coated (1) Silver 0.181 Nm (1.85 kgf-cm) When installing: Make sure that the connect or is attached rmly .
When installing: Mak e sure that the batt ery connector is attached rmly . 1140 Smart card, dummy smart card and spacer F or access, remove these FRUs in or der: • “1010 Battery pack” on page.
Step Screw (quantity) Color T orque 3 M2 × 3 mm, wafer-head, nylon-coated (3) Silver 0.181 Nm (1.85 kgf-cm) 6 5 5 Removal steps of dummy smart card and spacer 1 1 1 2 3 Step Screw (quantity) Color T orque 1 M2 × 3 mm, wafer-head, nylon-coated (3) Silver 0.
Removal steps of speaker assembly Step Screw (quantity) Color T orque 1 M2 × 3 mm, wafer-head, nylon-coated (4) Silver 0.181 Nm (1.85 kgf-cm) 4 5 5 5 5 4 5 4 4 When installing: Make sur e that the speaker connect or is attached rmly . Then r oute the cables and secur e them properly as shown in the illustr ation above.
• “1060 K eyboard” on page 74 • “1100 ExpressC ard blank bezel or Expr essCard” on page 84 • “1150 Speaker assembly” on page 91 Removal steps of thermal fan assembly 1 When installing: Make sure that the connect or is attached rmly .
5 When installing: Befor e you attach the thermal fan assembly to the computer , apply thermal gr ease, at an amount of 0.2 grams, on the parts marked a as in the following illustrations. Either too much or too less application of grease can cause a thermal fan pr oblem due t o imperfect contact with a component.
a a F or W orkstation models: a a 1170 Microprocessor F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “1030 Memory module slot cover ” on page 70 • “1060 K.
1 a 2 When installing: Place the micropr ocessor in the micropr ocessor socket, and then rotate the head of the screw in the dir ection shown by the arrow a to secure the micr oprocessor .
Removal st eps of L CD unit 2 2 1 1 Step Screw cap Screw (quantity) Color T orque 1 M2.5 × 6 mm, wafer -head, nylon-coated (2) Black 0.392 Nm (4.0 kgf-cm) 2 — M2.5 × 6 mm, wafer -head, nylon-coated (2) Black 0.392 Nm (4.0 kgf-cm) 3 3 Step Screw (quantity) Color T orque 3 M2.
9 9 9 9 9 8 9 8 8 8 5 4 4 6 7 Step Screw (quantity) Color T orque 4 M2 × 4 mm, wafer-head, nylon-coated (2) Black 0.181 Nm (1.85 kgf-cm) When installing: • Make sure that you attach the L CD connect or rmly . • Make sur e that you r oute the cables rmly and tape up in the pr oper positions as shown in the following illustration.
10 10 1190 Base cover assembly F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “1020 Serial Ultr abay Enhanced device or blank bezel” on page 69 • “1030 Me.
Removal steps of base cover assembly 2 1 1 Step Screw (quantity) Color T orque 1 M2 × 3 mm, wafer-head, nylon-coated (2) Silver 0.181 Nm (1.85 kgf-cm) 2 M2 × 14 mm, wafer -head, nylon-coated (1) Black 0.
1 2 3 4 5 6 7 8 9 10 14 13 12 11 20 21 9 18 17 16 15 19 When you replace the base cover , apply the following labels: 6 FCC label 7 Machine type and serial number label Note: If the base cover has two FCC labels, apply both to the new base cover . Other labels need to be peeled off from the old base cover , and need t o be adhered to the new one.
F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “1020 Serial Ultr abay Enhanced device or blank bezel” on page 69 • “1030 Memory module slot cover ” on p.
• “1070 Memory module (upper slot)” on page 77 • “1080 PCI Expr ess Mini C ard for wireless LAN” on page 78 • “1090 PCI Express Mini Car d for wir eless W AN or mSA T A solid state dri.
a b c F or Switchable Gr aphics models: a b d c F or W orkstation models: a b c d 104 Hardwar e Maintenance Manual.
Removal steps of syst em board and magnesium structure fr ame 1 2 2 5 3 4 4 Step Screw (quantity) Color T orque 2 He x stud, nylon-coat ed (2) Silver 0.392 Nm (4.0 kgf-cm) 3 M2 × 3 mm, wafer-head, nylon-coated (1) Silver 0.181 Nm (1.85 kgf-cm) 4 M2 × 7 mm, wafer-head, nylon-coated (2) Silver 0.
b c d a 2010 L CD bez el assembly F or access, r emove this FRU: • “1010 Battery pack” on page 68 Removal steps of L CD bez el assembly 1 1 1 Step Screw cap Screw (quantity) Color T orque 1 M2.5 × 6 mm, wafer -head, nylon-coated (3) Black 0.392 Nm (4.
3 2 2 2 2 2 2 2 2 When installing: Make sure that all the latches are attached rmly . 2020 LED sub card F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “2010 L CD bez el assembly” on page 106 Removal st eps of LED sub card Note: Some models do not have the connector 1a .
2030 Integr ated camer a F or access, remove these FRUs in or der: • “1010 Battery pack” on page 68 • “2010 L CD bez el assembly” on page 106 Removal steps of integrat ed camer a 2 1 3 Step Screw (quantity) Color T orque 1 M2 × 3 mm, wafer-head, nylon-coated (1) Silver 0.
Read this rst befor e r eplacing the L CD panel F or ThinkP ad W530 models with a color sensor: Important: If your L CD panel needs a replacement, or der a special L CD panel FRU kit for color sensor model from L enovo. The FRU kit contains a L CD panel, a CD and an instruction yer .
1 1 2 2 2 2 When installing: When attaching the L CD panel to the cover , press the left and right edges cover ed with metal gently with your ngers.
4 5 5 5 3 6 7 8 When installing: Make sur e that the L CD cable connector is attached rmly . Chapter 10 . Removing or replacing a FRU 111.
9 9 9 9 10 10 Step Screw (quantity) Color T orque 9 M2 × 3 mm, wafer-head, nylon-coated (4) Silver 0.181 Nm (1.85 kgf-cm) 2050 Antenna kit and L CD rear cover assembly F or access, remove these FRUs .
b Wireless LAN ant enna, AUX (black) c Wireless LAN ant enna, 3r d (white) d Wireless LAN ant enna, MAIN (gr ay) e Wireless W AN antenna, MAIN (red) a b c d e Chapter 10 .
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Appendix A. Notices Lenovo may not offer the pr oducts, services, or features discussed in this document in all countries. Consult your local Lenovo repr esentative for information on the pr oducts and services curr ently available in your area.
Electronic emission notices F or electr onic emission information on Class B digital devices, r efer to the corr esponding information in the User Guide .
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Part Number: 0B48474_02 Printed in (1P) P/N: 0B48474_02 *1P0B48474_02*.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il Lenovo 2394F1U è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Lenovo 2394F1U - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Lenovo 2394F1U imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Lenovo 2394F1U ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Lenovo 2394F1U, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Lenovo 2394F1U.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Lenovo 2394F1U. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Lenovo 2394F1U insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
