Manuale d’uso / di manutenzione del prodotto E8501 del fabbricante Intel
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Intel ® E8500/E8501 Chip set North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Guide May 2006 Document Number 306749-002.
2 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHER WISE, T O ANY INTELLECTUAL PROPERTY RI GH TS IS GRANTED BY THIS DOCUMENT .
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 3 Bridge (XMB) Thermal/Mechani cal Desig n Guide Contents 1 Introduction... ................ ................ ............. ................ ................ ................. ......
4 Intel ® E8500/8501 Chipset North Bridge (NB) and eXtern al Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5 XMB Heatsink Thermal Solution Assembly ....... ......... .............. .............. .............. ............. 38 8.5.1 Heatsink Orientation .
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 5 Bridge (XMB) Thermal/Mechani cal Desig n Guide Tables 3-1 Intel ® E8500 Chipset NB Thermal Specifications ... ...................... .............. .............. .........15 3-2 Intel ® E8501 Chipset NB Thermal Specifications .
6 Intel ® E8500/8501 Chipset North Bridge (NB) and eXtern al Memory Bridge (XMB) Thermal/Me chanical Design Guide Revision History § Document Number Revision Number Description Date 306749 001 • I.
Intel ® E8500 /E8501Chipset North Bridg e (NB) an d eXternal Memory 7 Bridge (XMB) Thermal/Mechani cal Desig n Guide 1 Introduction As the complexity of computer systems increases, so do the power dissi patio n requirements. Care must be taken to ensure that the additional power is properl y dissipat ed.
Introduction 8 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001239 1.2 Definition of T erms BGA Ball grid array . A package type, defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in m old ing com pound.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 9 Bridge (XMB) Thermal/Mechani cal Desig n Guide Introduction XMB Intel ® E8500/E8501 chipset eXternal Mem ory Bridge Component. The chipset component that bridges th e IMI and DDR interfaces.
Introduction 10 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 11 Bridge (XMB) Thermal/Mechani cal Desig n Guide 2 Packaging T echnology The E8500/E8501 chi psets consist of four i ndi vidual components: the NB, the XMB, the Intel ® 6700PXH 64-bit PCI Hub and the I/O control l er hu b (ICH5R).
Packaging T e chnology 12 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTES: 1. All dimensions are in millimeter s. 2. All dimensions and tolerances confor m to ANSI Y14.5M-1994. Figure 2-3.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 13 Bridge (XMB) Thermal/Mechani cal Desig n Guide Packaging T e ch no lo gy Figure 2-4. XMB Package Dimensions (T op View) Figure 2- 5. XMB Package Dimensions ( Side View) XMB Die Die Keepout Area Handling Exclusion Area 37.
Packaging T e chnology 14 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 2.1 Package Mechanical Requirement s The E8500/E8501c chipset NB package has an IHS and the XMB package has an exposed bare die which is capable of sustaining a maximum static no rm al load of 15-lbf.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 15 Bridge (XMB) Thermal/Mechani cal Desig n Guide 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely t o cause the E8500/E8501 ch ipset NB/XMB components to co nsume maximum power dissipation for sustained time periods.
Thermal Specifications 16 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide NOTE: 1. These specifications are based on si lico n characterization, however, they may be updated as further data becomes available.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 17 Bridge (XMB) Thermal/Mechani cal Desig n Guide 4 Thermal Simulation Intel provides thermal simulatio n mod els of the E8500/E850.
Thermal Simulation 18 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 19 Bridge (XMB) Thermal/Mechani cal Desig n Guide 5 Thermal Metrology The system designer must make temperature measurements to accura tely determine the thermal performance of the system.
Thermal Metrolo gy 20 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 001240 NOTE: Not to scale. 001321 NOTE: Not to scale. Figure 5-1. Thermal Solution De cision Flowchart Figure 5-2. Zero Degree Angle Att ach Heatsink Modifications Figure 5-3.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 21 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Metrology 5.2 Power Simulation Sof tware The power simulation software is.
Thermal Metrolo gy 22 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 23 Bridge (XMB) Thermal/Mechani cal Desig n Guide 6 NB Reference Thermal Solution #1 Intel has developed two different reference th.
NB Reference Thermal Solution #1 24 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 25 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.4 Board-Level Component s Keepout Dimensions The location of hole pattern and keepout zones fo r the reference thermal solution are shown in Figure 6-3 .
NB Reference Thermal Solution #1 26 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 6.5 First NB Heat sink Thermal Solution Assembly The reference thermal solution for the chipset NB component is a passive extruded heatsink with thermal interface.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 27 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.5.1 Heat s ink Orientation Since this solution is based on a unidirectional heatsin k, mean airflo w direction must be aligned with the direction of the heatsink fins.
NB Reference Thermal Solution #1 28 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide the thermal resistance of the Chomeric s THERMFLOW T710 TIM is shown in Ta b l e 6 - 1 The heatsink clip provides enough pressu re for the TIM to achieve a thermal conductivity of 0.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 29 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #1 6.6 Reliability Guidelines Each motherboard, heatsink a nd attach combination may vary the mechanical loading of the component.
NB Reference Thermal Solution #1 30 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 31 Bridge (XMB) Thermal/Mechani cal Desig n Guide 7 NB Reference Thermal Solution #2 Intel has developed two different reference th.
NB Reference Thermal Solution #2 32 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 33 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.
NB Reference Thermal Solution #2 34 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 7.5.1 Heat sink Orient ation Since this solution is based on a unidirectional heatsink , mean airflow direction must be align ed with the direction of the heatsink fins.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 35 Bridge (XMB) Thermal/Mechani cal Desig n Guide NB Reference Thermal Solution #2 7.
NB Reference Thermal Solution #2 36 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500 /E8501 Chipset North Bridge (NB) and eXternal Memo ry 37 Bridge (XMB) Thermal/Mechani cal Desig n Guide 8 XMB Reference Thermal Solution Intel has developed one different reference ther.
XMB Reference Thermal Solution 38 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.3 Mechanical Design Envelope While each design may .
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 39 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution Full mechanical drawings of the therm al soluti on assembly and the heatsink are provided in Appendix B .
XMB Reference Thermal Solution 40 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide 8.5.2 Extruded Heat sink Profiles The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 41 Bridge (XMB) Thermal/Mechani cal Desig n Guide XMB Reference Thermal Solution 8.
XMB Reference Thermal Solution 42 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 43 Bridge (XMB) Thermal/Mechani cal Desig n Guide A Thermal Solution Component Suppliers T able A-1.
Thermal Solution Compone nt Suppliers 44 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide T able A-2.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 45 Bridge (XMB) Thermal/Mechani cal Desig n Guide Thermal Solution Component Suppliers NOTE: The enabled components may not be currently available from all suppl iers. Contact the supplier directly to verify time of component availability .
Thermal Solution Compone nt Suppliers 46 Intel ® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Me chanical Design Guide.
Intel ® E8500/E8501 Chipset North Bridge (NB) and eX te rnal Memory 47 Bridge (XMB) Thermal/Mechani cal Desig n Guide B Mechanical Drawings T able B-1.
Mechanical Drawings 48 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-1. NB Heatsink #1 Assembl y Drawing.
Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 49 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-2. NB Heat sink #1 Drawing.
Mechanical Drawings 50 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-3. NB Heatsink #2 Assembl y Drawing.
Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 51 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-4. NB Heat sink #2 Drawing.
Mechanical Drawings 52 Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Gu ide Figure B-5. XMB Heatsink Assembly Drawing.
Intel ® E8500/E8501 Ch ipset North Bridge (NB) and eXternal Memory 53 Bridge (XMB) Thermal/Me chanical Design Guide Mechanical Drawings Figure B-6. XMB Heat sink Drawing.
Mechanical Drawings 54 Intel ® E8500/E8501 Chi pset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mech anical Design Guide §.
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Se non hai ancora comprato il Intel E8501 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Intel E8501 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Intel E8501 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Intel E8501 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Intel E8501, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Intel E8501.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Intel E8501. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Intel E8501 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
