Manuale d’uso / di manutenzione del prodotto DBS1200V3RPS del fabbricante Intel
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Document Number: 3249 73-001 Intel ® Xeon ® Processor E3-1200 Product Family and LGA 1155 Socket Thermal/Mechanical Specificat ions and Design Guidelines April 2011.
2 Thermal/Mechanical Specifications and Design Guidelines Legal Lines and Disclaime rs NFORMA TION IN THIS DOCUMENT IS PROV IDED IN CONNECTION WITH IN TEL® PROD UCTS. NO LICENS E, EXPRESS OR IMPLIE D, BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT .
Thermal/Mechanical Specificat ions and Design Guideline 3 Contents 1I n t r o d u c t i o n ....... ........... .......... ......... .......... ......... .......... ......... .......... ........... ........ ...... 9 1.1 References .... ........... ...
4 Thermal/Mechanical Specificat ions and Design Guideline 6.1.4 I ntel ® Xeon ® Processor E3-1220L (20W) Thermal Profile.... ............ .............. 47 6.1.5 I ntel ® Xeon ® Processor E3-1200 (95W) with Integrated Graphics Thermal Prof ile ...
Thermal/Mechanical Specificat ions and Design Guideline 5 11 Thermal Solution Quality and Reliability Requirements ................. ........ ........... ........ 89 11.1 Reference Heatsink Thermal V erification . .......... .......... ........... ...
6 Thermal/Mechanical Specificat ions and Design Guideline 10-1 Mechanical Representation of the Solution...... ........... ........ ........... .......... ......... ...... 83 10-2 Physical Space Requirements for the Solution (side view) ..............
Thermal/Mechanical Specificat ions and Design Guideline 7 Tables 1-1 Referen ce Documents .... ........ ........... ........ ........... ........ ........... .......... ......... ........ 10 1-2 Terms and Descrip tions ................... .......... .
8 Thermal/Mechanical Specificat ions and Design Guideline Revision History § Document Number Description Date 324973-001 • Initial release of the document.
Thermal/Mechanical Specificat ions and Design Guidelines 9 Introduction 1 Introduction This document is intended to provide guide lines for design of thermal and mechanical solution. Meanwhile therm al and mechanical specifications for the processor and associated socket are included.
Introduction 10 Thermal/Mechanical Specifications and Design Guidelines 1.1 References Material and concepts av ailable in the following documents may be beneficial when reading this document. 1.2 Definition of Terms Table 1-1. Reference Documents Document Location Notes Intel® Xeon® Processor E3-1200 Family Data Sheet Volume One http:// www.
Thermal/Mechanical Specificat ions and Design Guidelines 11 Introduction § T CASE _ MAX The maximum case temper ature as specified in a component specification.
Introduction 12 Thermal/Mechanical Specifications and Design Guidelines.
Thermal/Mechanical Specificat ions and Design Guidelines 13 Package Mechanical & Storage Specifications 2 Package Mechanical & Storage Specifications 2.1 Package Mechanical Specifications The processor is packaged in a Flip-Chip Land Grid Arr ay package that interfaces with the motherboard via the LGA1155 socket.
Package Mechanical & S torage Specifications 14 Thermal/Mechanical Specifications and Design Guidelines 2.1.1 Package Mechanical Drawing Figure 2-2 shows the basic package layout and dimensions. The detailed package mechanical drawings are in Appendix D .
Thermal/Mechanical Specificat ions and Design Guidelines 15 Package Mechanical & Storage Specifications 2.1.3 Package Loading Specifications Ta b l e 2 - 1 provides dynamic and static load spec ifications for the processor package.
Package Mechanical & S torage Specifications 16 Thermal/Mechanical Specifications and Design Guidelines 2.1.7 Processor Materials Ta b l e 2 - 3 lists some of the package components and associated materials. 2.1.8 Processor Markings Figure 2-3 shows the topside markings on the proc essor .
Thermal/Mechanical Specificat ions and Design Guidelines 17 Package Mechanical & Storage Specifications 2.1.9 Processor Land Coordinates Figure 2-4 shows the bottom view of the processor package.
Package Mechanical & S torage Specifications 18 Thermal/Mechanical Specifications and Design Guidelines 2.2 Processor Storage Specifications Ta b l e 2 - 4 includes a list of the specifications for device storage in terms of maximum and minimum temperatures and relative humidity .
Thermal/Mechanical Specificat ions and Design Guidelines 19 LGA1155 Socket 3 LGA1155 Socket This chapter describes a surface mount, LGA (L and Grid Arra y) socket intended for the processors.
LGA1155 Socket 20 Thermal/Mechanical Specifications and Design Guidelines 3.1 Board Layout The land pattern for the LGA1155 socket is 36 mi ls X 36 mils (X by Y) within each of the two L -shaped sections. Note that there is no round-off (conversion) error between socket pitch (0.
Thermal/Mechanical Specificat ions and Design Guidelines 21 LGA1155 Socket Figure 3-3. LGA1155 S ocke t Land Pattern (Top View of Board) A C E G J L N R U W AA AC AE AG AJ A L AN AR AU AW B D F H K M .
LGA1155 Socket 22 Thermal/Mechanical Specifications and Design Guidelines 3.1.1 Suggested Silkscreen Mark ing for Socket Identification Intel is recommending that customers mark the socket name approximately where shown in Figure 3-4 . 3.2 Attachment to Motherboard The socket is attached to the motherboard by 1155 solder balls.
Thermal/Mechanical Specificat ions and Design Guidelines 23 LGA1155 Socket 3.3 Socket Components The socket has two main components, the sock et body and Pick and Place (PnP) cover , and is delivered as a single integr al assembly . R efer to Appendix C for detailed drawings.
LGA1155 Socket 24 Thermal/Mechanical Specifications and Design Guidelines Cover retention must be su fficient to support the sock et weight during lifting, translation, and placement (board manufa cturing), an d during board and system shipping and handling.
Thermal/Mechanical Specificat ions and Design Guidelines 25 LGA1155 Socket . 3.4.1 Socket Standoffs an d Package Seating Plane Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C .
LGA1155 Socket 26 Thermal/Mechanical Specifications and Design Guidelines All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) without degradin g, and must be visible after the socket is mounted on th e motherboard. LGA1155 and the manufacturer's insignia are molded or laser marked on the side wall.
Thermal/Mechanical Specificat ions and Design Guidelines 27 Independent Loading Mechanism (ILM ) 4 Independent Loading Mechanism (ILM) The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints.
Independent Loading Mechanism (I LM) 28 Thermal/Mechanical Specifications and Design Guidelines 4.1.2 ILM Back Plate Design Overview The back plate is a flat steel back plate with pierced and extruded features for ILM attach. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors if required.
Thermal/Mechanical Specificat ions and Design Guidelines 29 Independent Loading Mechanism (ILM ) 4.1.3 Shoulder Screw and Fa steners Design Overview The shoulder screw is fabricated from carbonized steel rod. The shoulder height and diameter are integral to the mechanical perf ormance of the ILM.
Independent Loading Mechanism (I LM) 30 Thermal/Mechanical Specifications and Design Guidelines 4.2 Assembly of ILM to a Motherboard The ILM design allows a bottoms up assemb ly of the components to th e board. See Figure 4-4 for step by step assembly sequence.
Thermal/Mechanical Specificat ions and Design Guidelines 31 Independent Loading Mechanism (ILM ) . Note: Here ILM assembly shown in figure is without ILM co ver preinstalled. As indicated in Figure 4-5 , the shoulder screw , socket protrusion and ILM key features prevent 180 degree rotation of ILM cover assemb ly with respect to socket.
Independent Loading Mechanism (I LM) 32 Thermal/Mechanical Specifications and Design Guidelines 4.3 ILM Interchangeability ILM assembly and ILM back plate built from the Intel controlled dra wings are intended to be interchangeable.
Thermal/Mechanical Specificat ions and Design Guidelines 33 Independent Loading Mechanism (ILM ) 4.5 ILM Cover Intel has developed an ILM Cover that will snap onto the ILM for the LGA115x socket family .
Independent Loading Mechanism (I LM) 34 Thermal/Mechanical Specifications and Design Guidelines As indicated in Figure 4-6 , the pick and place cover should remain installed during ILM assembly to the motherboard.
Thermal/Mechanical Specificat ions and Design Guidelines 35 Independent Loading Mechanism (ILM ) As indicated in Figure 4-7 , the pick and place cover cannot remain in place and used in conjunction with the ILM Co ver . The ILM Cove r is designed to interfere and pop off if the pick and place cover is unintentionally left in place.
Independent Loading Mechanism (I LM) 36 Thermal/Mechanical Specifications and Design Guidelines.
Thermal/Mechanical Specificat ions and Design Guidelines 37 LGA1155 Socket and ILM Electrica l, Mech anical and Environmental Specifications 5 LGA1155 Socket and ILM Electrical, Mechanical and Environ.
LGA1155 Socket and ILM Electrical, Mec hanical and Environmental Specifications 38 Thermal/Mechanical Specifications and Design Guidelines 5.3 Loading Specifications The socket will be tested against the conditions listed in Chapter 11 with heatsink and the ILM attached, under the loading conditions outlined in this section.
Thermal/Mechanical Specificat ions and Design Guidelines 39 LGA1155 Socket and ILM Electrica l, Mech anical and Environmental Specifications 5.5 Environmental Requirements Design, including materials, shall be consiste nt with the manufacture of units that meet the following environmental reference points.
LGA1155 Socket and ILM Electrical, Mec hanical and Environmental Specifications 40 Thermal/Mechanical Specifications and Design Guidelines A detailed description of this methodology can be found at: ftp://download.intel.com/ technology/itj/q32000/pdf/reliability .
Thermal/Mechanical Specificat ions and Design Guidelines 41 Thermal Specifications 6 Thermal Specifications The processor requires a thermal solution to maintain temper atures within its oper ating limits.
Thermal Specifications 42 Thermal/Mechanical Specifications and Design Guidelines Section 6.2 . T o ensure maximum flexibility for future processors, systems should be designed to the Thermal Solution Capability guidelines, even if a processor with lower power dissipation is currently planned.
Thermal/Mechanical Specificat ions and Design Guidelines 43 Thermal Specifications 6.1.1 Intel ® Xeon ® Processor E3-1280 (95W)Thermal Profile Notes: 1. Please refer to Ta b l e 6 - 2 for discrete points that constitute the thermal profile. 2. Refer to Chapter 9 and Chapter 11 for system and environmental implementation details.
Thermal Specifications 44 Thermal/Mechanical Specifications and Design Guidelines 6.1.2 Intel ® Xeon ® Processor E3-1200 (8 0W) Thermal Profile Notes: 1. Please refer to Ta b l e 6 - 3 for discrete points that constitute the thermal profile. 2. Refer to Chapter 9 and Chapter 11 for system and environmental implementation details.
Thermal/Mechanical Specificat ions and Design Guidelines 45 Thermal Specifications Table 6-3. Thermal Te st Vehicle Thermal Profile for Intel ® Xeon ® Processor E3-1200 (80W) Power (W) T CASE_M AX ( ° C) Power (W) T CASE_MA X ( ° C) 0 45.1 42 57.7 2 45.
Thermal Specifications 46 Thermal/Mechanical Specifications and Design Guidelines 6.1.3 Intel ® Xeon ® Processor E3-1260L (45W) Thermal Profile Notes: 1. Please refer to Ta b l e 6 - 4 for discrete points that constitute the thermal profile. 2. Refer to Chapter 9 and Chapter 11 for system and environmental implementation details.
Thermal/Mechanical Specificat ions and Design Guidelines 47 Thermal Specifications 6.1.4 Intel ® Xeon ® Processor E3-1220L ( 20W) Thermal Profile Notes: 1. Please refer to Ta b l e 6 - 5 for discrete points that constitute the thermal profile. 2. Refer to Chapter 9 and Chapter 11 for system and environmental implementation details.
Thermal Specifications 48 Thermal/Mechanical Specifications and Design Guidelines 6.1.5 Intel ® Xeon ® Processor E3-1200 (95W ) with Integrated Graphics Ther mal Profile Notes: 1. Please refer to Ta b l e 6 - 6 for discrete points that constitute the thermal profile.
Thermal/Mechanical Specificat ions and Design Guidelines 49 Thermal Specifications 6.1.6 Processor Specification for Operation Where Digital Thermal Sensor Exceeds T CONTROL During operation, when the.
Thermal Specifications 50 Thermal/Mechanical Specifications and Design Guidelines Notes: 1. The ambient temperature is measured at th e inlet to the processor thermal solution. 2. This column can be expressed as a function of T AMBIENT by the following equation: Y CA = 0.
Thermal/Mechanical Specificat ions and Design Guidelines 51 Thermal Specifications Notes: 1. The ambient temperature is measured at the inlet to the processor thermal solution. 2. This column can be expre ssed as a function of T AMBI ENT by the following equation: Y CA = 0.
Thermal Specifications 52 Thermal/Mechanical Specifications and Design Guidelines Notes: 1. The ambient temperature is measured at th e inlet to the processor thermal solution. 2. This column can be expressed as a function of T AMBIENT by the following equation: Y CA = 0.
Thermal/Mechanical Specificat ions and Design Guidelines 53 Thermal Specifications Notes: 1. The ambient temperature is measured at the inlet to the processor thermal solution. 2. This column can be expre ssed as a function of T AMBI ENT by the following equation: Y CA = 0.
Thermal Specifications 54 Thermal/Mechanical Specifications and Design Guidelines 6.1.7 Thermal Metrology The maximum T TV case temperatures (T CASE-MAX ) can be derived from the data in the appropriate T TV thermal profile earlier in this chapter . The T TV T CASE is measured at the geometric top center of the T TV integrated heat spreader (IHS).
Thermal/Mechanical Specificat ions and Design Guidelines 55 Thermal Specifications control, similar to Thermal Monitor 2 (TM2) in previous gene ration processors) inv olves the processor reducing its operating frequenc y (via the core ratio multiplier) and input voltage (via the VID signals).
Thermal Specifications 56 Thermal/Mechanical Specifications and Design Guidelines take place. This sequence of temperatur e checking and Frequency/VID reduction will continue until either the minimum frequency has been reached or the processor temperature has dropped below the TC C activation point.
Thermal/Mechanical Specificat ions and Design Guidelines 57 Thermal Specifications A small amount of hysteresis has been included to prevent rapid activ e/inactive transitions of the T CC when the processor temperature is near its maximum operating temperature.
Thermal Specifications 58 Thermal/Mechanical Specifications and Design Guidelines transitioning to the minimum frequency an d corresponding voltage (using Freq/VID control). Clock modulation is not activ ated in this case. The T CC will remain active until the system de-asserts PROCHOT#.
Thermal/Mechanical Specificat ions and Design Guidelines 59 Thermal Specifications • The number of cores operating in the C0 state. • The estimated current consumption. • The estimated power consumption. •T h e t e m p e r a t u r e . Any of these factors can affect the maximum frequency for a given workload.
Thermal Specifications 60 Thermal/Mechanical Specifications and Design Guidelines 6.4.1 Intel ® Turbo Boost Technology Power Contro l and Reporting When operating in the turbo mode, the processor will monitor its own power and adjust the turbo frequency to maintain the aver age power within limits over a thermally significant time period.
Thermal/Mechanical Specificat ions and Design Guidelines 61 Thermal Specifications 6.4.2 Package Power Control The package power control allows for custom ization to implement optimal turbo within platform power delivery and package thermal solution limitations.
Thermal Specifications 62 Thermal/Mechanical Specifications and Design Guidelines.
Thermal/Mechanical Specificat ions and Design Guidelines 63 PECI Interf ace 7 PECI Interface 7.1 Platform Environment Control Interface (PECI) 7.1.1 Introduction PECI uses a single wire for self-clockin g and data transfer . The bus requires no additional control lines.
PECI Inte rface 64 Thermal/Mechanical Specifications and Design Guidelines.
Thermal/Mechanical Specificat ions and Design Guidelines 65 Sensor Based Thermal Specification Design Guidanc e 8 Sensor Based Thermal Specification Design Guidance The sensor based thermal specification presen ts opportunities for the system designer to optimize the acoustics and simplify thermal validation.
Sensor Based Thermal Specification Design Guidance 66 Thermal/Mechanical Specifications and Design Guidelines Figure 8-1. Comparison of Case Temper ature vs. Sensor Based Specification Power Sensor Base d Specification (DTS Tem p) TDP Tco ntr ol Ta = 30 C Ψ -ca = 0.
Thermal/Mechanical Specificat ions and Design Guidelines 67 Sensor Based Thermal Specification Design Guidanc e 8.2 Sensor Based Thermal Specification The sensor based thermal specification consists of two parts. The first is a thermal profile that defines the maximum T TV T CASE as a function of T TV power dissipation.
Sensor Based Thermal Specification Design Guidance 68 Thermal/Mechanical Specifications and Design Guidelines Note: This graph is pro vided as a reference, the complete thermal specification is in Chapter 6 .
Thermal/Mechanical Specificat ions and Design Guidelines 69 Sensor Based Thermal Specification Design Guidanc e 8.3.2 Thermal Desi gn and Modelling Based on the boundary conditions, the designer can now make the design selection of the thermal solution components.
Sensor Based Thermal Specification Design Guidance 70 Thermal/Mechanical Specifications and Design Guidelines • When the DTS v alue is at or below T CONTROL , the fans can be slowed down - just as with prior processors. • When DTS is abov e T CONTROL , FSC algorithms will use knowle dge of T AMBIENT and Ψ CA vs.
Thermal/Mechanical Specificat ions and Design Guidelines 71 Sensor Based Thermal Specification Design Guidanc e 8.4.1 DTS 1.1 A New Fan Speed Control Algorithm without T AMBIENT Data In most system de.
Sensor Based Thermal Specification Design Guidance 72 Thermal/Mechanical Specifications and Design Guidelines Notes: 1. Ψ CA at “DT S = T control ” is applicable to systems that has Intern al T ris e (T room temperature to Processor cooling fan inlet) of less than 10 °C .
Thermal/Mechanical Specificat ions and Design Guidelines 73 Sensor Based Thermal Specification Design Guidanc e 8.5 System Validation System v alidation should focus on ensuri ng the fan speed control algorithm is responding appropriately to the DTS v alues and T AMBI ENT data in the case of D TS 1.
Sensor Based Thermal Specification Design Guidance 74 Thermal/Mechanical Specifications and Design Guidelines.
75 1U Thermal Solution 9 1U Thermal Solution Note: The thermal mechanical solution informatio n shown in this document represents th e current state of the data and m ay be subject to modification.The information represents design targets, not commitments by Intel.
1U Thermal Solution 76 Collaboration thermal solution Ψ ca (mean+3sigma) is computed to 0.319°C/W at the airflow of 15 CFM. As the Ta b l e 9 - 1 shown when T LA is 40 °C, equation representing thermal solution of this heatsink is calculated as: Y=0.
77 1U Thermal Solution Figure 9-2. 1U Collaboration He atsink Performan c e Cu rves Table 9-2. Comparison between TTV Th ermal Profile and Thermal Solution Performance for Intel ® Xeon ® Processor E.
1U Thermal Solution 78 9.2.2 Thermal Solution The collaboration thermal solution consists of two assemblies: heatsink assembly & back plate. Heatsink is designed with the Aluminum base and Aluminum stack fin, which volumetrically is 95x95x24.85 mm.
79 1U Thermal Solution 9.2.3 Assembly The assembly process for the 1U collaboration heatsink with application of thermal interface material begins with placing back plate in a fixture. The motherboard is aligned with fixture. Next is to place the heatsink such that the heatsink fins are par allel to system airflow .
1U Thermal Solution 80 9.3 1U Reference Heatsink 9.3.1 Heatsink Performance For 1U reference heatsink, see Appendix B for detailed drawings. Fi gure 9- 4 shows Ψ CA and pressure drop for the 1U reference he atsink versus the airflow provided. Best - fit equations are provided to prevent errors associated with reading the graph.
81 1U Thermal Solution 9.3.3 Assembly The assembly process is same as the way described in Section 9.2. 3 , please refer to it for more details. 9.4 Geometric Envelope for 1U Thermal Mechanical Design 9.5 Thermal Interface Material A thermal interface material (TIM) provides conductivity between the IHS and heatsink.
1U Thermal Solution 82 § Figure 9-6. TTV D ie Size and Orientation Die Centerline Package Centerline Drawing Not to Scale All Dimensions in mm 37.5 37.
Thermal/Mechanical Specificat ions and Design Guidelines 83 Active Tower Thermal Solution 10 Active Tower Thermal Solution 10.1 Introduction This active tower thermal solution is intend ed for system integrators who build systems from baseboards and standard components.
Active Tower Thermal Solution 84 Thermal/Mechanical Specifications and Design Guidelines 10.2 Mechanical Specifications 10.2.1 Cooling Solution Dimensions This section documents the mechanical specifications. Figure 10 -1 shows a mechanical representation of the solution.
Thermal/Mechanical Specificat ions and Design Guidelines 85 Active Tower Thermal Solution Note: Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation.
Active Tower Thermal Solution 86 Thermal/Mechanical Specifications and Design Guidelines The power header on the baseboard must be positioned to allow the fan power cable to reach it. The power header identification an d location should be documented in the platform documentation, or on the system board itself .
Thermal/Mechanical Specificat ions and Design Guidelines 87 Active Tower Thermal Solution 10.4 Cooling Requirements The processor may be directly cooled with a fan heatsink.
Active Tower Thermal Solution 88 Thermal/Mechanical Specifications and Design Guidelines.
Thermal/Mechanical Specificat ions and Design Guidelines 89 Thermal Solution Quality and Reliability Requirements 11 Thermal Solution Quality and Reliability Requirements 11.1 Reference Heatsink Thermal Verification Each motherboard, heatsink and attach combination may v ary the mechanical loading of the component.
Thermal Solution Quality and Reliability Requirements 90 Thermal/Mechanical Specifications and Design Guidelines 11.2.1 Recommended Test Sequence Each test sequence should start with components (that is, baseboard, heatsink assembly , and so on) that have not been prev iously submitted to any reliability testing.
Thermal/Mechanical Specificat ions and Design Guidelines 91 Thermal Solution Quality and Reliability Requirements 11.3 Material and Recycling Requirements Material shall be resistant to fungal gr owth. Examples of non-resistant materials include cellulose materials, animal and ve getab le based adhesiv es, grease, oils, and many h ydrocarbons.
Thermal Solution Quality and Reliability Requirements 92 Thermal/Mechanical Specifications and Design Guidelines.
Thermal/Mechanical Specificat ions and Design Guidelines 93 Component Suppliers A Component Suppliers Note: The part numbers listed below identifies the reference components. End-users are responsible for the verification o f the Intel enabled component offerings with the supplier .
Component Suppliers 94 Thermal/Mechanical Specifications and Design Guidelines The enabled components may not b e currently available from all suppliers.
Thermal/Mechanical Specificat ions and Design Guidelines 95 Mechanical Drawings B Mechanical Drawings Ta b l e B - 1 lists the mechanical drawings included in this appendix.
Mech an ical D rawing s 96 Thermal/Mechanical Specifications and Design Guidelines Figure B-1. Socket / Heatsink / IL M Keepout Zone Primary Side f or 1U (Top).
Thermal/Mechanical Specificat ions and Design Guidelines 97 Mechanical Drawings Figure B-2. S o ck et / Heatsink / ILM Keep out Zone Secondary Side for 1U (Bottom).
Mech an ical D rawing s 98 Thermal/Mechanical Specifications and Design Guidelines Figure B-3. Socket / Processor / ILM Ke epout Z one Primary Side for 1U (Top) A A B B DEPARTMENT R 2200 MISSION COLLEGE BLVD.
Thermal/Mechanical Specificat ions and Design Guidelines 99 Mechanical Drawings Figure B-4. S o ck et / Processor / ILM Keepou t Zone Secondary Side f or 1U (Bottom) SIZE DRAWING NUMBER REV A1 E21320 J SCALE: NONE DO NOT SCALE DRAWING SHEET 2 OF 2 0.1 B C 25.
Mech an ical D rawing s 100 Thermal/Mechanical Specifications and Design Guidelines Figure B-5. 1U Collabora tion Heatsink Assembly A 4 B 3 C D 43 21 A 2 C 1 D A A E49069 1 B DWG. NO SHT. REV THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Thermal/Mechanical Specificat ions and Design Guidelines 101 Mechanical Drawings ( Figure B-6. 1U Collaboration Heatsink A 4 B 3 C D 43 21 A 2 C 1 D E49059 1 C DWG.
Mech an ical D rawing s 102 Thermal/Mechanical Specifications and Design Guidelines Figure B-7. 1U Reference Heatsink Assembl y.
Thermal/Mechanical Specificat ions and Design Guidelines 103 Mechanical Drawings Figure B-8. 1 U R eference Heatsin k.
Mech an ical D rawing s 104 Thermal/Mechanical Specifications and Design Guidelines Figure B-9. 1U Heatsink Scre w A 4 B 3 C D 43 21 A 2 C 1 D A A E50686 1 B DWG.
Thermal/Mechanical Specificat ions and Design Guidelines 105 Mechanical Drawings Figure B-10. Heatsink Com pression Spring.
Mech an ical D rawing s 106 Thermal/Mechanical Specifications and Design Guidelines Figure B-11. Heatsink Load Cup.
Thermal/Mechanical Specificat ions and Design Guidelines 107 Mechanical Drawings Figure B-12. Heatsink Retaining Ring.
Mech an ical D rawing s 108 Thermal/Mechanical Specifications and Design Guidelines Figure B-13. Heatsink Backplate Assembly A 4 B 3 C D 43 21 A 2 C 1 D A A E49060-001 1C DWG. NO SHT. REV THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Thermal/Mechanical Specificat ions and Design Guidelines 109 Mechanical Drawings Figure B-14. Heatsink Back plat e.
Mech an ical D rawing s 110 Thermal/Mechanical Specifications and Design Guidelines Figure B-15. Heatsink Backpl ate Insulator.
Thermal/Mechanical Specificat ions and Design Guidelines 111 Mechanical Drawings Figure B-16. Heatsink Back plat e Stud A 4 B 3 C D 43 21 A 2 C 1 D A A FOXHOLLOW_THICK_BP_STANDOFF 1C DWG. NO SHT. REV THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Mech an ical D rawing s 112 Thermal/Mechanical Specifications and Design Guidelines Figure B-17. Thermoco uple Attach Drawing A A C D PACKAGE CENTER REFERENCED FROM PACKAGE EDGES PACKAGE EDGES NOTE DIRECTION OF MILLED GROOVE RELATIVE TO ALIGNMENT NOTCHES.
Thermal/Mechanical Specificat ions and Design Guidelines 113 Mechanical Drawings Figure B-18. 1U ILM Shoulder Scre w 8 7 6 5 4 3 2 H G F E D C B A 8 7 6 5 4 3 2 1 H G F E D C B A A 3 5.75± 0.05 0.1 A 3 7.25± 0.05 1.35±0.1 3 3.25± 0.05 3 6-32 UNC CLASS 2A THREAD 3.
Mech an ical D rawing s 114 Thermal/Mechanical Specifications and Design Guidelines § Figure B-19. 1U ILM St anda rd 6-32 Thread Faste n e r 8 7 6 5 4 3 2 H G F E D C B A 8 7 6 5 4 3 2 1 H G F E D C B A 6.86 3 3 5.17± 0.2 MAX 2.41 PHYSICAL PAN HEAD HEIGHT THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION.
Thermal/Mechanical Specificat ions and Design Guidelines 115 Socket Mechanical Drawings C Socket Mechanical Drawings Ta b l e C - 1 lists the mechanical draw ings included in this appendix.
Socket Mechan ical D rawing s 116 Thermal/Mechanical Spec ifications and Design GuidelinesDocument Number: 448776 Rev. 2.0 Figure C-1. Socket Mechanic al Drawi ng (Sheet 1 of 4).
Thermal/Mechanical Specificat ions and Design Guidelines 117 Socket Mechanical Drawings Figure C-2. Socket Mechanic al Drawing (Sheet 2 of 4).
Socket Mechan ical D rawing s 118 Thermal/Mechanical Spec ifications and Design GuidelinesDocument Number: 448776 Rev. 2.0 ( Figure C-3. Socket Mechanic al Drawi ng (Sheet 3 of 4).
Thermal/Mechanical Specificat ions and Design Guidelines 119 Socket Mechanical Drawings § Figure C-4. Socket Mechanic al Drawing (Sheet 4 of 4).
Socket Mechan ical D rawing s 120 Thermal/Mechanical Spec ifications and Design GuidelinesDocument Number: 448776 Rev. 2.0.
Thermal/Mechanical Specificat ions and Design Guidelines 121 Package Mechan ica l Drawin gs D Package Mechanical Drawings Ta b l e D - 1 lists the mechanical drawings included in this appendix.
Package Mech anical Drawin gs 122 Thermal/Mechanical Specifications and Design Guidelines Figure D-1. Processor Pack age Drawing (S heet 1 of 2).
Thermal/Mechanical Specificat ions and Design Guidelines 123 Package Mechan ica l Drawin gs § Figure D-2. Processor Pack age Drawing (Sheet 2of 2) ..
Package Mech anical Drawin gs 124 Thermal/Mechanical Specifications and Design Guidelines.
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