Manuale d’uso / di manutenzione del prodotto DC7900 del fabbricante HP
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Te c h n i c a l R e f e r e n c e G u i d e HP Co mpaq dc7 9 00 Ser ie s Business Desk top Computers Doc ument P art Number: 5 066 6 5-00 1 September 2008 This document provides information on the design, archite cture, function, and capabilities of the HP Compaq dc7900 Series Business Desktop Computers.
© Copyright 2008 He wlett-Packard Dev elopment Company , L.P . The information contained herein is subject to change without notice. Microsoft, MS-DOS, W indows, and W i ndows NT are trademar ks of Microsoft Corporation in the U.S. and other countries.
T echnical R efe rence Guide www .hp .com iii Cont ent s 1I n t r o d u c t i o n 1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1 1.1.1 Online Viewing .
i v www .hp .com T echnical R ef er ence Guide Cont en ts 3 Processor /Memory Subsyste m 3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1 3.2 Intel Processors .
T echnical R efe rence Guide www .hp .com v Cont ent s 5.6.2 Pointing Device Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10 5.6.3 Keyboard/Pointing Device Interface Connector . . . . . . . . .
v i www .hp .com T echnical R ef er ence Guide Cont en ts 8S Y S T E M B I O S 8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1 8.2 ROM Flashing . .
T echnical R efe re nce Guide www .hp .com 1-1 1 Introduction 1. 1 A b o u t t h i s G u i d e This guide provides technical information ab out HP Compaq dc7900 Business PC personal computers that feature Intel processors and th e Intel Q45 Express chip set.
1-2 www .hp.com T echnical R efer ence Guide Intr oducti on 1. 3 S e r i a l N u m b e r The serial number is located on a sticker placed on the exterior cabi net. The serial number is al so written into firmw are and may be read with HP Diagnostics or Insi ght Manager utilities.
T echnical R efe re nce Guide www .hp .com 1-3 Intr oducti on 1 .5 Common Ac ron yms and Abbre viations T able 1-1 lists the acronyms and ab bre viations used in this guide.
1-4 www .hp.com T echnical R efer ence Guide Intr oducti on CDS compact disk sy stem CG A color graphics adapter Ch Channel, chap ter cm centimeter CMC cache/me mory controlle r CMOS complimentary metal-ox ide semiconduc tor (confi gur ation memory) Cntlr contr oller Cntrl con tr ol codec 1 .
T echnical R efe re nce Guide www .hp .com 1-5 Intr oducti on EIS A extended IS A EPP e nhanced parallel port EIDE enhanced IDE E S CD Extended S ys tem Co nfig urati on Data (f ormat) EV Env ironmen .
1-6 www .hp.com T echnical R efer ence Guide Intr oducti on IrD A Infrar ed Data Assoc iatio n IR Q interrupt reque st IS A industry standard ar chitec ture Kb/KB kilobits/kilobytes (x 1 02 4 bits/x 1.
T echnical R efe re nce Guide www .hp .com 1-7 Intr oducti on ODD optical di sk dr iv e OS op erating s ys tem P AL 1 . pr ogrammable ar ra y logic 2 .
1-8 www .hp.com T echnical R efer ence Guide Intr oducti on SD V O Ser ial digital v ideo o utput SE C Single Edge-Connector SE CAM s equential colo ur av ec memoir e (sequential co lor w ith memory) .
T echnical R efe re nce Guide www .hp .com 1-9 Intr oducti on URL Unifor m res our ce locator us/ µ s mic r osecond USB Univers al Se rial Bus UTP unsh ielded twis ted pair Vv o l t V AC V olt s a lt.
1-10 www .hp.com T echnical R efer ence Guide Intr oducti on.
T echnical R efe re nce Guide www .hp .com 2-1 2 Sys t e m O ve r v i ew 2. 1 Introduction The HP Compaq dc7900 Business PC personal co mputers (Figure 2-1) de liv er an outstanding combination of manageability , serviceability , an d compatibility for enterprise en vironments.
2-2 www .hp.com T echnical R efer ence Guide Sys t e m O ve r vi ew 2.2 Fea tures The follo wing standard features are included on all models unless otherwise indicated: ■ Intel processor in LGA775 .
T echnical R efe re nce Guide www .hp .com 2-3 S ystem Ov ervie w T able 2-1 sho ws the dif ferences in feature s betwee n the dif ferent PC series based on form factor: NO TES: [1] 2nd ser ial port r equires opti onal cable/br ack et assembl y . [2] PCIe M ini Car d slot .
2-4 www .hp.com T echnical R efer ence Guide Sys t e m O ve r vi ew 2.3 S y ste m Arc h itec ture The systems cov ered in this guide feature an ar chitecture based on the In tel Q45 Express chipset (Figure 2-2).
T echnical R efe re nce Guide www .hp .com 2-5 S ystem Ov ervie w F igure 2 - 2 . HP Compaq dc7 900 Bu siness P C Arc hitectur e , Block diagr am Parallel I/F [2] Intel Processor Q45 82801 GMCH SDRAM Cntlr PCI Express ICH10 SATA SATA USB I/F Ch A DDR2 SDRAM Ch B DDR2 SDRAM SIO Controller Cntlr.
2-6 www .hp.com T echnical R efer ence Guide Sys t e m O ve r vi ew 2.3. 1 In tel Processo r Sup por t The models cov ered in this guide are design ed to support the follo wing processor types: ■ In.
T echnical R efe re nce Guide www .hp .com 2-7 S ystem Ov ervie w 2.3.2 C hips et The Intel Q45 Express chipset consists of a Gr aphics Memory Controller Hub (GMCH) and an enhanced I/O controller hub (ICH1 0-DO). T able 2-3 compares the functions provided by the chipsets.
2-8 www .hp.com T echnical R efer ence Guide Sys t e m O ve r vi ew 2.3. 3 Suppor t Com ponents Input/output functions not pro vided by the chip set are handled b y other support components. Some of these components also provide “house k eeping” and v arious other function s as well.
T echnical R efe re nce Guide www .hp .com 2-9 S ystem Ov ervie w 2.3.5 Ma ss Stora g e All models support at least two mass storage de vices, with one being externally accessible for remo v able media.
2-10 www .hp.com T echnical R efer ence Guide Sys t e m O ve r vi ew 2.3.9 Grap hic s Subsy s tem These systems use the Q45 GMCH component, which includes an inte grated graphics c ontroller that can dri ve both an external V GA monitor a nd a DisplayPort digital display .
T echnical R efe rence Guide www .hp .com 2-11 S ystem Ov ervie w 2.4 S pec if i ca tion s This section includes the en vironmental, electrica l, and physical specific ations for the systems cov ered in this guide. Where pro vided, metric statistics are gi ven in parenthesis.
2-12 www .hp.com T echnical R efer ence Guide Sys t e m O ve r vi ew NO TES: [1] S y stem confi gured w ith 1 hard dri ve , 1 disk ette dri ve (SFF an d CMT onl y) , and no P CI cards . [2] Deskto p (hori z ontal) configur ation. [3] Minitow er configur ation.
T echnical R efe rence Guide www .hp .com 2-13 S ystem Ov ervie w NO TE [1] USD T models use “ slim” dr ive . [2] R equir es s peci al lab el-etc hable media . Ta b l e 2 - 9 Opti cal Drive Specif ica tions P arameter D VD-ROM CD-RW/D VD-ROM C ombo HP SuperMulti Li ghtSc ribe Combo Interf ace T ype S A T A [1] SA T A [1 ] S A T A [1] Max .
2-14 www .hp.com T echnical R efer ence Guide Sys t e m O ve r vi ew NO TE S: [1] USD T supports 2 .5-in . dri ves only . [2] USD T supports 1 .5 Gb/s dri ves onl y . [3] USD T support s up to 7 200 -RPM dr i ves onl y . [4] Suppor ted by SFF and CMT form factors onl y .
T echnical R efe re nce Guide www .hp .com 3-1 3 Pr ocessor/Memor y Subs y stem 3. 1 In troduction This systems support the Intel Pentium and Core processor f amilies and use the Q45 chipset (Figure 3-1). These sy stems support PC2-6400 and PC2-53 00 DDR2 memory modu les.
3-2 www .hp.com T echnical R efer ence Guide Proces sor/Memory Subsy stem 3.2 Intel Pr ocessors These systems each feature an Intel processor in a FC-LGA775 package mounted with a heat sink in a zero-insertion force socket. The moun ting socket allo ws the processor to be easily changed for upgrading.
T echnical R efe re nce Guide www .hp .com 3-3 Processo r/ Mem or y S ubsystem 3.2.2 Pr ocessor Ch an ging/U pgradin g All models use the LGA775 ZIF (Sock et T) m ounting socket. These systems require that the processor use an integrated heatsink/f an assemb ly .
3-4 www .hp.com T echnical R efer ence Guide Proces sor/Memory Subsy stem 3.3 M em or y Sub sy st em All models support no n-ECC PC2-5300 and PC2-6400 DD R2 memory . The USDT form factor supports up to eight gigabytes of memory while the SFF and CMT form factors support up to 16 gigabytes of memory .
T echnical R efe re nce Guide www .hp .com 3-5 Processo r/ Mem or y S ubsystem 3.3. 1 M e m or y Up g ra d i n g T able 3-2 shows suggested memory conf igurations for these systems. Note that the USDT form factor p rovides only two memory sock ets. ✎ T able 3-2 does not list all possible configurations.
3-6 www .hp.com T echnical R efer ence Guide Proces sor/Memory Subsy stem F igure 3- 2 . Sy stem Memory Map (for max imum of 8 giga byt es) ✎ All locations in memory are cacheable. Base memo ry is always mapp ed to DRAM. The next 128 KB fi xed memory area can, through the north bridge, be mapped to DRAM or to PCI space.
T echnical R efe re nce Guide www .hp .com 4-1 4 Sys t e m S u p p o r t 4. 1 Introduction This chapter cov ers subjects dealing ICH10 w ith basic system architecture and cov ers the follo wing topics: ■ PCI b us ov erview (4.2) ■ System resources (4.
4-2 www .hp.com T echnical R efer ence Guide Sys t e m S u p p o r t T ab le 4-1 shows the standard configuration of de vice numbers and IDSEL connections for components and slots residing on a PCI 2.3 bus. NO TES: [1] F uncti on not u sed in thes e sy stems.
T echnical R efe re nce Guide www .hp .com 4-3 Sys t e m S u p p o r t The PCI b us supports a b us master/target arbitra tion scheme. A bus master is a de vice that has been granted control of the bus for the purpose of initiating a transaction. A tar get is a de vice that is the recipient of a transaction.
4-4 www .hp.com T echnical R efer ence Guide Sys t e m S u p p o r t Link La y er The link layer provides data inte grity by adding a sequence information pref ix and a CRC suff ix to the packet created b y the transaction layer .
T echnical R efe re nce Guide www .hp .com 4-5 Sys t e m S u p p o r t 4.2.6 P CI Conn ectors PCI 2. 3 Connec tor F i gu r e 4- 2 . 3 2 - b i t , 5 . 0-v o lt P C I 2 .
4-6 www .hp.com T echnical R efer ence Guide Sys t e m S u p p o r t PCI Expre ss Connec tors Fig u re 4 - 3. PC I E x p re s s B us Co n n e ct o r s T able 4 - 4.
T echnical R efe re nce Guide www .hp .com 4-7 Sys t e m S u p p o r t 4.3 S ystem Re sources This section describes the a vailability and basic control of major subsystems, otherwise kno wn as resource allocation or simply “s ystem resources.
4-8 www .hp.com T echnical R efer ence Guide Sys t e m S u p p o r t NO TE S: [1] SFF and CMT only [2] CMT onl y The PCI interrupts can be conf igured b y PCI Configuration Re gisters 60h.
T echnical R efe re nce Guide www .hp .com 4-9 Sys t e m S u p p o r t 4.4 Real- Time C l oc k and C onfiguration Mem or y The Real-time clock (R TC) and configuration me mory (also referred to as “CMOS”) functions are provided b y the 82801 component and is MC 146818-co mpatible.
4-10 www .hp.com T echnical R efer ence Guide Sys t e m S u p p o r t 4.4.2 Standard CMOS Locations T able 4-6 describes standard configuration me mory locations 0Ah-3Fh. Thes e locations are accessible through using OUT/IN as sembly language instructions using p ort 70/71h or BIOS function INT15, AX=E823h.
T echnical R efe rence Guide www .hp .com 4-11 Sys t e m S u p p o r t Po we r - O n / S e t u p Pa s s wo r d These systems inclu de a power - on and setup pass words, which may be enabled o r disabled (cleared) through a jumper on the system board. The jumper controls a GPIO input to the 82 801 ICH10 that is checked during POST .
4-12 www .hp.com T echnical R efer ence Guide Sys t e m S u p p o r t Level 0— Co ver remo v al indication is essentially disabled at this lev el. During POST , status bit is cleared and no oth er action is taken b y BIOS.
T echnical R efe rence Guide www .hp .com 4-13 Sys t e m S u p p o r t 4.5 .3 S y stem Status These systems provide a visual indication of sy stem boot, R OM flash, and operational status through the power LED and internal speaker , as described in T able 4-8.
4-14 www .hp.com T echnical R efer ence Guide Sys t e m S u p p o r t The RPM (speed) of all fans is the result of th e temperature of the CPU as sensed by speed control circuitry . The fans are co ntrolled to run at the slowest (qui etest ) speed that will maintain proper cooling.
T echnical R efe rence Guide www .hp .com 4-15 Sys t e m S u p p o r t NO TE: Assume unmark ed gaps are un used , r eserved , or used by f unctions that emplo y vari able I/O addres s mapp ing. S ome range s may inc lude r eserved addr esses . Ta b l e 4 - 9 Sys t e m I / O M a p I/O P ort Function 0000.
4-16 www .hp.com T echnical R efer ence Guide Sys t e m S u p p o r t 4.6.2 GPIO F unc tions ICH 1 0 Fu nctio ns The ICH10 pro vides v arious functions through the use of programmable general purpose input/output (GPIO) ports.
T echnical R efe rence Guide www .hp.com 5-1 5 Inp ut/O u tpu t Inter faces 5 . 1 Introduction This chapter describes the standard interfaces that provide input and output (I/O) porting of data and that are c ontrolled throug h I/O-mapped re gist ers.
5-2 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5.2 SA T A / e SA TA In t e r fa c e s These systems provide two, three, or four serial A T A (SA T A) interfaces that support tranfer rates up to 3.0 Gb/s an d RAID data protection functionality .
T echnical R efe re nce Guide www .hp .com 5-3 Input/Output Int erfaces 5 .2.2 e S A T A inter face The SFF and CMT form factors provide a SA T A/e SA T A port (connector P64 on the system board) that can support an external SA T A (eSA T A) stora ge de vice.
5-4 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5 .3 Disk et te Driv e Interface The SFF and CMT form factors supp ort a diskette driv e through a standard 34-pin diskette drive connector . The diskette dri ve interface function is inte grated into the super I/O co mponent.
T echnical R efe re nce Guide www .hp .com 5-5 Input/Output Int erfaces The SFF and CMT form factors use a standard 34- pin connector for diske tte dri ves (refer to Figure 5-3 and T able 5-3 for the pinout). Dri ve po wer is supplied through a separate connector .
5-6 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5. 4 S e r i a l I n t e r f a c e Systems cov ered in this guide ma y include one RS-232-C type seri al interface to transmit and receiv e asynchronous serial data with external de vices.
T echnical R efe re nce Guide www .hp .com 5-7 Input/Output Int erfaces 5 .5 P arallel In ter face Suppor t The SFF and CMT form factors include a system bo ard header (J50) that supports an optional parallel bracket/cable asse mbly that pro vides a parallel interf ace for a peripheral device such as a printer .
5-8 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5 .5 .4 P arallel Inter face Connec tor Figure 5-5 and T able 5-5 show the connector and pino ut of the paralle l connector p rovided on the optional parallel bracket/cable assembly .
T echnical R efe re nce Guide www .hp .com 5-9 Input/Output Int erfaces 5 .6 K e yboard/P ointin g De vice Inter face The keyboard/pointing device interface function is provided by the SI O controller.
5-10 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5 .6.2 P ointin g De vice Interface O peration The pointing de vice (typically a mouse) connects to a 6-pin DIN-type connector that is identical to the ke yboard connector bo th p hysically and electrically .
T echnical R efe rence Guide www .hp .com 5-11 Input/Output Int erfaces 5 .7 Univ ersal Seri al Bus In ter face The Univ ersal Serial Bus (USB) interface provides asynchronous/isochrono us data transfers w ith compatible pe ripherals such as ke yboards, pr inters, or modems.
5-12 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5 .7 .2 U SB C abl e Da ta The recommended cable length between the host an d the USB device should be no longer than sixteen feet for full-channel (12 MB/s) opera tion, depend ing on cable specification (see follo wing table).
T echnical R efe rence Guide www .hp .com 5-13 Input/Output Int erfaces 5. 8 A u d i o S u b sys t e m These systems use the HD audio controller of the 82801 component to access and control an Analog De vices AD1884A HD Audio Codec, which provides 2-channel high def inition analog-to-digital (ADC) and digital-to-analo g (D A C) con versions.
5-14 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5 .8. 1 HD Audio Controller The HD Audio Controller is a PC I Express devi ce that is inte grated into the 82801 ICH component an.
T echnical R efe rence Guide www .hp .com 5-15 Input/Output Int erfaces 5 .8.4 Audio Spec if ica tions The specifications for the HD Audio subsystem are listed in T able 5-11. Ta b l e 5 - 1 1 . HD Audio Subsy s tem Specifications P aramete r Measu remen t Sampl ing Rates: DAC ADC 44.
5-16 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5 .9 N et w ork Interfac e Con troller These systems pro vide 10/100/1000 Mbps n etwork support th rough an Intel 82567V netw ork interface controller (NIC), a PHY componen t, and a RJ-45 jack with integral status LEDs (Figure 5-11).
T echnical R efe rence Guide www .hp .com 5-17 Input/Output Int erfaces 5. 9 . 1 W a ke - O n - L A N S u p p o r t The NIC supports the W ired-for -Management (WfM) standard of W ake-On-LAN (WOL) that allo ws the system to be booted up from a po wered-do wn or lo w-po wer condition upon the detection of special packets recei ved o ver a netw ork.
5-18 www .hp.com T echnical R efer ence Guide Input/Output In terfaces 5 .9 .4 NI C Connec tor Figure 5-12 shows the RJ-45 connector used for the NIC interface. This connector includes the two status LEDs as part of the connector assembly . F igur e 5-12 .
T echnical R efe re nce Guide www .hp .com 6-1 6 Integrated G rap hic s Su bsy s tem 6. 1 In troduction This chapter describes the graphi cs subsystem that is integrated into the Q45 GMCH component. This graphics subsystem employs the use of syst em memory to pro vide eff icient, economi cal 2D and 3D performance.
6-2 www .hp.com T echnical R efer ence Guide Integrated Gr aphics Subs ys tem 6.2 F unc tion al Desc ription The Intel Q45 GMCH component includes an Intel integrated Graphics Media Accelerator (GMA) 4500 controller (Figure 6-1).
T echnical R efe re nce Guide www .hp .com 6-3 Integrated Gr aphics Su bs ystem The GMA 4500 uses a portion of sy stem memory for instructions, textures, and frame (display) buf fering.
6-4 www .hp.com T echnical R efer ence Guide Integrated Gr aphics Subs ys tem 6.3 Di s p l ay Mo d es The GMA supports the following standard display modes for 2D vide o displays: The highest resoluti.
T echnical R efe re nce Guide www .hp .com 6-5 Integrated Gr aphics Su bs ystem 6.4 U p g ra d in g All systems provide direct, dual -monitor support; a VGA montor and a DisplayPort monitor can be connected and dri ven simu ltaneously .
6-6 www .hp.com T echnical R efer ence Guide Integrated Gr aphics Subs ys tem 6.5 Monitor C onnec tors All form factors provide an analog V GA conne c tor and a DisplayPort connector , and can dri ve both types of monitors simultaneously .
T echnical R efe re nce Guide www .hp .com 6-7 Integrated Gr aphics Su bs ystem 6.5 .2 Dis pl ayP or t C onnec tor All systems include a DisplayPort connector (Figur e 6-3) for attaching a digital monitor . This interface also supports the use of an optional ad apter for con verting the DisplayPort output to a D VI or analog VGA output.
6-8 www .hp.com T echnical R efer ence Guide Integrated Gr aphics Subs ys tem.
T echnical R efe re nce Guide www .hp .com 7-1 7 P o w er and Si gn al Distrib ution 7 . 1 Introduc tion This chapter describes the po wer supplies and discusses the method s of general po wer and signal distrib ution. T opics cov ere d in this chapter include: ■ Po wer distrib ution (7.
7-2 www .hp.com T echnical R efer ence Guide P ow er and Signal Distribution T able 7-1 lists the specifications of the external supply . NO TES: T otal continuous power should not exceed 1 35 watts. T ota l surg e pow er ( <1 0 seconds w/dut y cyc le < 5 %) should not ex ceed 17 0 w a t t s .
T echnical R efe re nce Guide www .hp .com 7-3 P ow er and Si gnal Distr ibuti on NO TE S: T otal continuous power should not e xceed 2 40 watts. T otal surge pow er (<1 0 seconds w/d uty cyc le < 5 %) should not exceed 26 0 w a t t s . [1] The minimum c urr ent loading figure s apply to a P S On start up only .
7-4 www .hp.com T echnical R efer ence Guide P ow er and Signal Distribution T able 7-3 lists the specifications for the 365-wa tt po wer supply used in the CMT form factor . NO TES: T otal continuous output pow er s hould not ex ceed 36 5 watts. Maximum sur ge pow er should not e xceed 3 8 5 watts.
T echnical R efe re nce Guide www .hp .com 7-5 P ow er and Si gnal Distr ibuti on Figure 7-4 sho ws the power su pply cabling for CMT systems. NO TES: Conn ector s not s ho wn t o scale .
7-6 www .hp.com T echnical R efer ence Guide P ow er and Signal Distribution 7. 3 P o w e r C o n t r o l The generation of +3 , +5, and + 12 VDC is controlled digitally wi th the PS On signal. When the PS On signal is asserted, all DC v oltages ar e produced.
T echnical R efe re nce Guide www .hp .com 7-7 P ow er and Si gnal Distr ibuti on A dual-color LED lo cated on the front panel (bezel) is used to indic ate system power status.
7-8 www .hp.com T echnical R efer ence Guide P ow er and Signal Distribution 7. 3 . 2 W a k e U p E v e n t s The PS On signal can be acti vated with a po wer “wake-up” of the system due to the occurrence of a magic packet, serial port ring, or PCI po we r management ev ent (PME).
T echnical R efe re nce Guide www .hp .com 7-9 P ow er and Si gnal Distr ibuti on 7 .3 . 3 P o w er Manage ment These systems include po wer management func tions designed to conserve ener gy . These functions are provided b y a combination of hardware, fir mware (BIOS) and software.
7-10 www .hp.com T echnical R efer ence Guide P ow er and Signal Distribution 7 .4 Si gnal Distrib ution T able 7-7 lists the reference designators for LEDs , connectors, headers, an d switches used on the system boards for systems cov ered in this guid e.
T echnical R efe rence Guide www .hp .com 7-11 P ow er and Si gnal Distr ibuti on Figure 7-5 shows pinouts of headers used on the syte m boards. NO TE: No polar ity considerati on r equir ed for connec tion t o speake r header P6. NC = Not connect ed F igure 7 -5.
7-12 www .hp.com T echnical R efer ence Guide P ow er and Signal Distribution.
T echnical R efe re nce Guide www .hp .com 8-1 8 SY S T E M B I O S 8. 1 Introduction The System Basic Input/Output System (BIOS) of the computer is a collection of machine language programs stored as f irmware in read -only memory (R OM).
8-2 www .hp.com T echnical R efer ence Guide SYST E M B I O S 8.2 ROM Fla shing The system BIOS f irmware is contained in a fl ash R OM device that can be re-written wi th new BIOS code using a flash utility locally (with F10 setup), with the HP QFlash program in a W indows en vironment, or with the FLASHBIN.
T echnical R efe re nce Guide www .hp .com 8-3 SYS T E M B I O S 8.3 Boot Functions The BIOS supports v arious functions related to the boot process, including those that occu r during the Po wer On Self-T est (POST) routine. 8.3. 1 B oot Dev ice Order The default boot de vice order is as follows: 1.
8-4 www .hp.com T echnical R efer ence Guide SYST E M B I O S The BIOS performs memory de tection and configuration with t he follo wing steps: 1. Program the buf fer strength control registers based o n SPD data and th e DIMM slots that are populated.
T echnical R efe re nce Guide www .hp .com 8-5 SYS T E M B I O S 8. 4 Client Ma nageme nt F unction s T able 8-2 provides a partial list of the client management BIOS functions support ed by the systems cov e red in this guide. These functions , designed to support intelligent manageability applications, are HP-specific unless otherwise indicated.
8-6 www .hp.com T echnical R efer ence Guide SYST E M B I O S 8.4. 1 Sy s tem ID an d ROM T ype Diagnostic applications can use the INT 15, AX =E800h BIOS function to identify the type of system. This function will return the system ID in the BX re gist er .
T echnical R efe re nce Guide www .hp .com 8-7 SYS T E M B I O S 8.5 SMB IOS In support of the DMI specification, PnP functions 50h and 51h are used to retrie ve the SMBIOS data. Function 50h retrie v es the number of structur es, size of the lar gest structure, and SMBIOS version.
8-8 www .hp.com T echnical R efer ence Guide SYST E M B I O S 8.6 USB Leg acy Suppor t The system BIOS ROM checks the USB port, during POST , for the presence of a USB ke yboard. This allo ws a system with only a USB keyboard to be used du ring R OM-based setup and also on a system with an OS that do es not include a USB dri ver .
T echnical R efe re nce Guide www .hp .com A-1 A Err or Mess a ges an d Cod es A . 1 Introduc tion This appendix lists the error co des and a brief d escription of the probable cause of the error . ✎ Errors listed in this appendix are applicable only for systems running HP/Compaq BIOS .
A-2 www .hp.com T echnical R efer ence Guide Err or Messages and Codes A.3 P o we r- On S elf T est (POS T ) Messa ges Ta b l e A -2 . P ow er- On Self T est (POS T) Messages Error Message Probable Cause Inv alid Electroni c Serial Number Chassis serial number is corrupt .
T echnical R efe re nce Guide www .hp .com A-3 Err or Messages and C odes 5 1 4 -CPU or Chassis Fan not detec ted . CPU f a n is not connect ed or may ha v e malfuncti oned . 60 1 - D i s ke t t e Co n t rol l e r E rro r D i s ke t t e d rive re m ove d s i n c e p revi ou s b o ot .
A-4 www .hp.com T echnical R efer ence Guide Err or Messages and Codes 1 80 1 -Mic r ocode P atch Er ror A pr ocessor is installed f or whi ch the BIO S ROM has no pat ch . Chec k f or R OM updat e . Inv alid Electr onic Se ri al Number Elect r oni c ser ial nu mber has becom e cor ru pted .
T echnical R efe re nce Guide www .hp .com A-5 Err or Messages and C odes A.4 S y ste m Er r or Message s ( 1xx - xx) NO TES: [1] 1 02 mess age code may be caused by one o f a vari ety of processo r-r elated problems that may be solv ed by r ep lacing the proces sor , although sy stem board r eplacement may be needed.
A-6 www .hp.com T echnical R efer ence Guide Err or Messages and Codes A.5 Memory Err or Message s (2xx - xx) Ta b l e A - 4 . Memo ry Err or Messa ges Message Prob able Cause 200 -04 Real memory siz .
T echnical R efe re nce Guide www .hp .com A-7 Err or Messages and C odes A. 6 K e yboard Er ror Messa ges ( 30x - xx) 21 1 -0 2 Erro r while sa ving memory during random memory pattern test 21 1 -03 .
A-8 www .hp.com T echnical R efer ence Guide Err or Messages and Codes A. 7 Printer Error Messag es (4xx - xx) A.8 V ideo ( Graph ics) Er ror Messages ( 5xx - xx) See T able A- 1 4 for additional v ideo (graphic s) messages .
T echnical R efe re nce Guide www .hp .com A-9 Err or Messages and C odes A .9 Disk et te Driv e Error Mes sa ges (6xx - xx) 600 -xx = Diskette dri ve ID test 609- xx = Diskette driv e re set controller test 60 1 -xx = Disk ette driv e for mat 6 1 0 -xx = Diskette dri ve change li ne test 60 2 -xx = Disk ette re ad tes t 6 1 1 -xx = Pr i.
A-10 ww w .hp.com T echnical R efer ence Guide Err or Messages and Codes A. 1 0 S erial In ter face Error Messa ges ( 1 1xx - xx) Ta b l e A - 9 . Serial Inter face Err or Messages Message Proba ble Cause Message P rob able Cause 1 1 0 1 -0 1 UAR T DLAB bit failur e 1 1 0 1 - 1 3 U A R T cntrl .
T echnical R efe rence Guide www .hp .com A-11 Err or Messages and C odes A . 1 1 Mod em Comm unica tions Error Mess ag es ( 1 2xx - xx) Ta b l e A - 1 0 .
A-12 ww w .hp.com T echnical R efer ence Guide Err or Messages and Codes NO TE S: [1] Local loopback mode [4] Modem auto ori ginate test [2] Analog loopback originate mode [5] Modem auto ans wer test [3] Analog loopback answ er mode [6] Modem direct connect tes t A.
T echnical R efe rence Guide www .hp .com A-13 Err or Messages and C odes A. 1 3 Har d D ri v e Er r o r M ess age s ( 1 7x x - xx ) Ta b l e A - 1 2 Hard Drive Error Mess ag es Message Probable Cause Message Pro bable Cause 1 7xx-0 1 Exceeded max. s oft err or lim it 1 7xx-5 1 Failed I/O r ead test 1 7xx-0 2 Exceeded max .
A-14 ww w .hp.com T echnical R efer ence Guide Err or Messages and Codes NO TE: xx = 00, Hard dr i ve ID test xx = 1 9 , Ha r d dri ve po wer mode test xx = 0 1 , Hard dr i ve f ormat t est xx = 20, S.
T echnical R efe rence Guide www .hp .com A-15 Err or Messages and C odes A . 1 4 H ard Driv e Error M es s a g es ( 1 9xx - xx) 1 900 -xx = T ape ID test failed 1 904-xx = T ape BO T/EO T test failed.
A-16 ww w .hp.com T echnical R efer ence Guide Err or Messages and Codes A. 1 5 V ideo (Gr aphics) E r r or Me ssage s (2 4xx - xx) A. 1 6 Audio Err or Mess ag es (3206- xx) Ta b l e A - 1 4 Video (Gr.
T echnical R efe rence Guide www .hp .com A-17 Err or Messages and C odes A. 1 7 D VD/ CD- ROM Er r or Message s ( 3 3x x - xx) A. 1 8 Netw or k I nte rf ace E rr or Me ssages ( 6 0xx - xx) T abl e A-.
A-18 ww w .hp.com T echnical R efer ence Guide Err or Messages and Codes A. 1 9 SC SI Interface Erro r Messa ges (6 5xx - xx, 6 6xx - xx, 6 7xx - xx) n = 5, Har d dr iv e = 6, CD-ROM dr ive = 7 , Ta p.
T echnical R efe rence Guide www .hp .com A-19 Err or Messages and C odes A.20 P ointin g De vice Interface Erro r Messa ges (8 6 0 1 - xx) Ta b l e A - 1 9 P ointing Dev ice Interface Error Messag es.
A-20 ww w .hp.com T echnical R efer ence Guide Err or Messages and Codes.
T echnical R efe re nce Guide w ww .hp.com Inde x-1 Ind e x Numerics 8259 Mode 4-7 A AMT 2-7, 2-9, 3-4, 8-8 APIC Mode 4-7, 4-8 Audio codec 2-8, 5-13, 5-14 Audio Specifications 5-15 B BIOS upgrading 8-.
Index -2 w ww .hp.com T echni cal Re fer e nce Guide Index power LED indications 7-7 processor, Intel 3-2 Processor Upgrading 3-3 R Real-time clock (RTC) 4-9 ROM flashing 8-2 S SATA/eSATA 5-2 SATA Con.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il HP DC7900 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del HP DC7900 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso HP DC7900 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul HP DC7900 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il HP DC7900, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del HP DC7900.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il HP DC7900. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo HP DC7900 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
