Manuale d’uso / di manutenzione del prodotto COMPAQ NC4200 del fabbricante HP
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Main tenan ce and Ser vice Gu id e HP C ompaq nc4 200 Notebook P C Doc ument P art Number: 444 6 2 4 -00 2 Apr il 200 7 This guide is a troubleshooting reference used for maintaining and servicing the notebook.
© Copyright 2006, 2007 He wlett-P ackard Dev elopment Company , L.P . Microsoft and W indo ws are U.S. re gistered trademarks of Microsoft Corporation. Intel, Pentium, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
Saf e t y w ar ning not ice Å WA R N I N G : T o reduce the po ssibility of heat-r elated inj uri es or of o ve rheating the comput er , do not plac e the computer dir ectly on y our lap or obstru ct the computer air ve nt s. Use the com puter only on a har d , flat surface .
Maintenance and S ervi ce Guide v Cont e nt s 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Power Management .
v i Maintenance and S ervi ce Guide Cont en ts 3 Software Update and Recovery Downloading a BIOS Update . . . . . . . . . . . . . . . . . . 3–3 Installing a BIOS Update . . . . . . . . . . . . . . . . . . . . . 3–4 Recovering the BIOS . . . . . . .
Cont en ts Maintenance and S ervi ce Guide v ii 6 Removal and Replacement Procedures 6.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2 6.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 6–3 6.3 Preparing the Notebook for Di sassembly .
v iii Maintenance and S ervi ce Guide Cont en ts 7 Specifications A Connector Pin Assignments B Power Cord Set Requirements C S c r e w L i s t i n g Index.
Maintenance and S ervi ce Guide 1–1 1 Pr oduct Descript ion The HP Compaq nc4200 Notebook PC of fers adv anced modularity , Intel® Pentium® M and Celeron® M processors, and extensi ve multimedia support.
1–2 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1. 1 F e a t u r e s ■ Intel Pentium M 2.13-, 2.00-, 1.86-, 1.73-, or 1.60-GHz processors, or Intel Celeron M 1.50-GHz processor , varying by notebook model ■ 12.1-inch, XGA, TFT (1024 × 768) display with ov er 16.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–3 ■ External 65-watt A C adapter with 3-wire po wer cord ■ 6-cell Li-Ion battery pack, v arying by notebook model ■ Audio speaker ■.
1–4 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1 .2 Reset ting t h e Notebook If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the notebook for disassembly (refer to Section 4.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–5 1. 3 P o w e r M a n a g e m e n t The notebook comes with po wer management features that extend battery operating time and conserv e po wer .
1–6 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1 .4 Exter nal C om ponents The external components on the front of the notebook are sho wn belo w and described in T able 1-1.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–7 3B a t t e r y l i g h t ■ Amber : A batter y pack is charging. ■ Green: A batter y pack is close to full charge capacity . ■ Blinking amber : A batter y pack that is the only a vailab le po wer source has reached a low-battery condition.
1–8 Maintenance and Serv ice Gui de Pr oduct Desc r iption The external components on the right side of the notebook are sho wn belo w and described in T able 1-2.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–9 Ta b l e 1 - 2 Right-Side Components Item Component Function 1A u d i o - o u t (headphone) jack Connects an optional headphone or pow ered stereo speakers . Also connects the audio function of an audio/video de vice , such as a tele vision or VCR.
1–1 0 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the left side of the notebook are sho wn belo w and described in T able 1-3. Lef t -S ide Com po ne nt s Ta b l e 1 - 3 Left-Side Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the notebook.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 1 3 Wireless button (select models only) T urns the wireless functionality of the WLAN or Bluetooth de vice on or off , b ut does not establish a connection. ✎ To establish a wireless connection, a wireless network must already be set up.
1–1 2 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the rear panel of the notebook are sho wn belo w and described in T able 1-4.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 3 Ta b l e 1 - 4 Rear P anel Components Item Component Function 1 USB por t Connects USB 1.1- and 2.0-compliant de vices to the notebook using a standard USB cable . 2 RJ-11 (modem) jack Connects a modem cab le.
1–1 4 Maintenance and S ervi ce Guide Pr oduct Desc r iption The standard ke yboard components of the notebook are sho wn belo w and described in T able 1-5.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 5 T able 1-5 Standar d Ke yboar d Components Item Component Function 1 Function ke ys (12) P erform system and application tasks. When combined with the fn key , th e function ke ys f3 , f4 , and f8 through f11 perf or m additional tasks as hotk eys .
1–1 6 Maintenance and S ervi ce Guide Pr oduct Desc r iption The notebook top components are sho wn belo w and described in T able 1-6. To p C o m p o n e n t s.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 7 T able 1-6 T op Components Item Component Function 1 Left and right T ouchP ad bu tt o n s (2 ) Function lik e the left and ri ght b uttons on an e xternal mouse. 2 T ouchP ad Mov es the pointer .
1–1 8 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the bottom of the notebook are sho wn belo w and described in T able 1-7.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 9 Ta b l e 1 - 7 Bottom Components Item Component Function 1 Base enclosure cov er Cov ers the display cab le and connector . 2 Doc king connector Connects the notebook to an optional doc king de vice.
1–20 Maintenance and S ervi ce Guide Pr oduct Desc r iption 1. 5 D e s i g n O v e r v i e w This section presents a design ov ervie w of k ey parts and features of the notebook. Refer to Chapter 4, “Illustrated P arts Catalog, ” to identify replacement parts, and Chapter 6, “Remo v al and Replacement Procedures, ” for disassembly steps.
Maintenance and S ervi ce Guide 2–1 2 T r oubl eshooting Å WA R N I N G : Only au thori z ed tec hnic ians tr ained by HP should r epair this equipmen t . All tr ouble shooting and r epair pr ocedur es ar e det ailed to allo w onl y subass embl y-/module -lev el r epair .
2–2 Maintenance and Serv ice Gui de T roubleshooting Acce ssing Computer Se tup The information and settings in Computer Setup are accessed from the File , Security , To o l s , and Advanced menus. 1. Open Computer Setup by turning on or restarting the notebook.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–3 4. T o confirm the restoration, press f10 . 5. Select File > Sa ve changes and exit , and then follo w the instructions on the screen. When the computer restarts, the factory settings are restored, and any identif ication information you ha v e entered is sa ved.
2–4 Maintenance and Serv ice Gui de T roubleshooting Selec ting from th e Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Administrator pass w ord Enter , change , or delete an HP Administrator pass word. P ower-on pass w ord Enter , change, or delete a power-on pass word.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–5 Selec ting from th e T ools Menu Ta b l e 2 - 3 To o l s M e n u Select T o Do This HDD Self T est options Run a quick or comprehensiv e self-test on an y hard drive in the system. Batter y Inf or mation Vie w inf or matio n about any battery packs in the notebook.
2–6 Maintenance and Serv ice Gui de T roubleshooting Selec ting from th e Ad v anced Menu Ta b l e 2 - 4 Adv anced Menu Select T o Do This Language (or press f2 ) Change the Computer Setup language. Boot options ■ Enable/Disab le MultiBoot, which sets a star tup sequence that can include most bootable de vices and media in the system.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–7 2.2 T roubl eshooting Flo wc h arts Ta b l e 2 - 5 T roubleshooting Flo wc har ts Overview Flowchart Description 2.1 “Flowchar t 2.1—Initial T roubleshooting” 2.2 “Flowchar t 2.
2–8 Maintenance and Serv ice Gui de T roubleshooting Flowchart Description 2.14 “Flowchar t 2.14—No OS Loading, Optical Drive” 2.15 “Flowchar t 2.15—No A udio , P ar t 1” 2.16 “Flowchar t 2.16—No A udio , P ar t 2” 2.17 “Flowchar t 2.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–9 Flo wc h art 2. 1—Initial T roubleshootin g Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device work- ing? Go to “Flowchart 2.
2–1 0 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.2—No P o w er , P art 1 1. Reseat the power cables in the docking device and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 1 Flo w c har t 2.3—No P o w er , P art 2 Continued from “Flowchar t 2.2—No P ower , Pa r t 1 . ” Visually check for debris in batter y socket and cl ean if necessary . Done N Y Po we r on ? Check batter y by recharging it, moving it to another notebook, or replacing it.
2–1 2 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.4—No P o w er , P art 3 Continued from “Flowchart 2.3—No P ower , Pa r t 2 . ” Reseat AC adapter in notebook and at po wer sou rc e. Internal or external AC adapter? Done Done Done Done Po we r on ? Po we r on ? Po we r on ? Plug directly into AC outlet.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 3 Flowc h ar t 2. 5—N o P o w er , P ar t 4 Y N Continued from “Flowchar t 2.4—No P ower , Pa r t 3 . ” Reseat loose components and boards and replace damaged items. Open notebook.
2–1 4 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.6—No Video, P art 1 A N Stand-alone or docking device? No video. Replace the following one at a time . T est after each replacement. 1. Cable between notebook and not ebook display (if applicable) 2.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 5 Flo wc h ar t 2.7—No Video, P art 2 Y N Continued from “Flowchart 2.6—No Video , Pa r t 1 .
2–1 6 Maintenance and S ervi ce Guide T roubleshooting F l o wch a rt 2 . 8 — No nf u n ct i on in g D ock i n g De v ice (if a pp licab le) Y N Reseat power cord in docking device and power outlet. N Check voltage setting on docking device. Reset monitor cable connector at docking device.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 7 Flo wc h ar t 2.9—No O peratin g S y s tem (OS) Loadin g No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive , P ar t 1. ” Reseat power cord in docking device and power outlet.
2–1 8 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 0—N o OS Loadin g , Hard Driv e, Pa r t 1 Go to “Flowchart 2.17—Nonfunction- ing De vice. ” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchar t 2.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 9 Flo wc h ar t 2. 1 1—No OS Loa ding , H ard Driv e, Pa r t 2 Load OS using Oper- ating System disc (if applicable). Continued from “Flowchar t 2.10—No OS Loading, Hard Drive, P ar t 1.
2–20 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 2—No OS Loa ding , H ard Dri v e, Pa r t 3 Y System files on hard drive? Continued from “Flowchar t 2.11—No OS Load- ing, Hard Drive, Pa r t 2 . ” Clean virus. Done N Install OS and reboot.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 1 Flo wc h ar t 2. 1 3—No OS Loa ding , Disk et te Driv e Replace the following components individually , retesting after each replacement: ■ Diskette drive ■ System board Done Y N Reseat diskette drive.
2–2 2 Maintenance and S ervi ce Guide T roubleshooting Flo wc h art 2. 1 4—No OS Loa ding , O ptical Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot notebook. Go to “Flowchar t 2.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 3 Flo wc h ar t 2. 1 5 —No Audio, P art 1 No audio. N Notebook in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally .
2–2 4 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 6—N o Audio, P ar t 2 YN Continued from “Flowchart 2.15—No A udio , Pa r t 1 . ” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker .
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 5 Flo wc h art 2. 1 7—Nonfunc tionin g De v ice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage.
2–2 6 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 8—N onfunc tionin g K e yboard Y N Keyboard operating properly? Keyboard not operating prop- erly . External device works? Replace system board. Replace system board. Connect notebook to good external key- board.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 7 Flo wc h art 2. 1 9—N onfunc tioning P ointin g De vice Y N Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device.
2–2 8 Maintenance and S ervi ce Guide T roubleshooting Flo wc h art 2.20—N o Net w ork/Modem Conn ectio n Y Disconnect all power from the notebook and open. No network or modem connec- tion. N Done Digital line? Network or modem jack active? Replace jack or have jack acti- vated.
Maintenance and S ervi ce Guide 3–1 3 Soft w ar e Upd a te an d Rec o ver y Soft w are Upd ates T o stay current with the newest technolog y and maintain optimal performance, install the latest versions of HP softw are on your computer as they become a v ailable.
3–2 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery Accessin g Com pu ter Inf orma tion Before you access the updates for your computer , collect the follo wing information: ■ The product cate gory is Notebook. ■ The product family name and series number are printed on the display bezel.
Softwar e Update and Reco v ery Maintenance and S ervi ce Guide 3–3 Obtainin g t h e Suppor t Sof t w are Disc The Support Softwar e disc provides HP softw are updates and installation instructions. The disc includes de vice dri vers, BIOS updates, and utilities.
3–4 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery T o download a BIOS update: 1. Access the page on the HP W eb site that provides software for your computer: ❏ Select Start > Help and Support , and then click a software update link.
Softwar e Update and Reco v ery Maintenance and S ervi ce Guide 3–5 BIOS installation procedures v a ry . Follo w any instructions that are displayed on the screen after the do wnload is complete. If no instructions are displayed: 1. Open W indows Explorer b y selecting Start > All Pr ograms > Accessories > Windo ws Explor er .
3–6 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery BIOS recov ery can be forced on a non-functioning notebook b y turning on the notebook while pressing and holding the W indows logo ke y + B on the nonfunctioning notebook ke yboard until the caps lock light blinks.
Maintenance and S ervi ce Guide 4–1 4 I llus trated P ar ts C a tal og This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 4. 1 Seri al Number Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook.
4–2 Maintenance and Serv ice Gui de Illustrated P a rts Catalog 4.2 Notebook Major C om ponents Noteboo k Major C omponents.
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–3 Ta b l e 4 - 1 Spare P arts: Notebook Major Components Item Description Spare P art Number 1 12.
4–4 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents.
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–5 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 4 Rear keyboar d co ver 383522.
4–6 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents.
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–7 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 10 Mini PCI comm unications cards (Continued) 802.11a/b/g DynaStar WLAN card, f or use in Ja pan 802.
4–8 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents.
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–9 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number Miscellaneous Plastics/Hard wa.
4–1 0 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.3 Miscell an eous P la sti c s/ Har dw ar e Ki t T able 4-2 Spare P art Number 383549-001 Item Description 1 Hard drive co v er 2 .
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 1 4.4 Miscell an eous Ca bl e Kit Ta b l e 4 - 3 Spare P art Number 383516-001 Item Description 1 LED board cable 2 RJ-11 cable 3 T o.
4–1 2 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.5 Miscell an eous (Not I llus trated) Ta b l e 4 - 4 Miscellaneous Spare P art Information Description Spare P art Number Label Ki.
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 3 Po w e r c o r d s (continued) Fo r u s e i n : Hong K ong and the United Kingdom 350188-031 Israel 350188-BB1 Italy 350188-061 Jap.
4–1 4 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.6 Sequ enti al P ar t N umber Listin g Ta b l e 4 - 5 Sequential P art Number Listing Spare P art Number Description 337407-001 802.11a/b/g DynaStar WLAN Mini PCI comm unications card, f or use in most of the world 337407-002 802.
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 5 350188-AA1 P ow er cord f or use in P eople’ s Republic of China 350188-B71 P ower cord f or use in Sw eden/Finland 350188-BB1 P ow er cord f or use in Israel 370429-001 Bluetooth wireless module (includes Bluetooth module cab le) 373888-001 802.
4–1 6 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 381302-001 802.11g Silv er ton WLAN Mini PCI communications card, f or use in most of the world 381303-001 802.
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 7 383458-211 K eyboard with pointi ng stic k f or use in Hungary 383458-221 K eyboard with pointing stic k f or use in Czech Repub li.
4–1 8 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 383518-001 LCD center hinge cap 383519-001 K eyboard co v er 383520-001 Base enclosure co v er 383522-001 Rear k e yboard cov er 383.
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 9 383542-001 PC24200 512-MB memory module 383543-001 Microphone 383545-001 TPM security module 383546-001 LCD rubber pad kit with scre ws 383548-001 12.
4–20 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 405839-001 80-GB hard driv e (5400 r pm; includes cov er , frame, and connector) 411337-001 Smar t card reader 417947-001 LCD board 4.
Maintenance and S ervi ce Guide 5–1 5 Remo v al and Repl a cemen t Preliminaries This chapter provides essential information for proper and safe remov al and replacement service.
5–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .2 Ser vice C onsid erations The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures.
Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–3 5. 3 P r eve n t i n g D a m a g e t o R emo v able Dri v es Remov able driv es are fragile components that must be handled with care.
5–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .4 Pr e v enting Elec trosta tic D ama g e Many electronic components are sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity .
Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–5 5 .5 P a c k a ging an d T rans por ting Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes.
5–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with appro v ed static-shielding material (refer to T able 5-2, “Static-Shielding Materials” ).
Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–7 5 .7 G rounding E quip men t and Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system.
5–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies T able 5-1 shows ho w humidity affects the electrostatic v oltage le ve ls generated by dif f erent acti vities. T able 5-2 lists the shielding protection provided b y antistatic bags and floor mats.
Maintenance and S ervi ce Guide 6–1 6 Remo v al and Repl a cemen t Pr ocedure s This chapter provides remo v al and replacement procedures. There are 56 scre ws, in 10 dif feren t sizes, that may ha v e to be remov ed, replaced, or loosened when servicing the notebook.
6–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 Seri al Number Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 6 .2 Di sassembl y Seque nce Chart Use the chart belo w to determine the section number to be referenced when removing notebook components. Disassembl y Sequence Char t Section Description # of Screws Remo ved 6.
6–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es Section Description # of Screws Remo ved 6.13 Processor 1 loosened 6.14 Inter nal memor y module 0 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 6. 3 Preparin g th e Notebook for Di sassem bl y Before you begin an y remo v al or installation procedures: 1.
6–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.4 Hard Driv e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the two PM2.0×5.0 scre ws 1 that secure the hard dri v e cov er to the notebook. 3. Lift the right side of the hard dri ve co v er and swing it to the left 2 to remov e it.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–7 4. Loosen the PM2.5×13.0 hard dri v e retention scre w 1 . 5. Grasp the mylar tab 2 on the hard dri v e and slide the hard dri v e to the left 3 to disconnect it from the system board.
6–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 7. Remov e the four PM3.0×4.0 scre ws 1 that secure the hard dri v e frame to the hard dri ve. 8. Lift the frame straight up 2 to remov e if from the hard dri v e. 9. Remov e the hard dri v e connector 3 .
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–9 6.5 Notebook F eet The notebook feet are adhesi v e-backed rubber pads. The feet are included in the Miscellaneous Plastics/Hardware Kit, spare part number 383549-001.
6–1 0 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.6 Bluetooth Modul e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the hard dri v e ( Section 6.4 ). 3. Position the notebook with the front to ward you.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 1 6. Slide the Bluetooth module out of the notebook 1 . 7. Disconnect the Bluetooth module cable 2 from the board. R emo v ing the Bluet ooth Module Re verse the abo v e procedure to install the Bluetooth module.
6–1 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.7 Exter nal Me mor y Module 1. Prepare the notebook for disassembly (refer to Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 3 3. Remov e the two PM2.0×5.0 scre ws 1 that secure the memory module compartment cov er to the notebook. 4. Lift the left side of the cov er and swing it to the right 2 to remov e the memory module compartment co ver .
6–1 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The side of the module opposite the socket rises a way from the notebook.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 5 6.8 TP M S ec u ri t y C a rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module compartment co ver ( Section 6.7 ). 3. Remov e the PM1.
6–1 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.9 K e yboar d C o v er 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Position the notebook with the front to ward you. 3. Remov e the two T8M2.0×18.0 scre ws that secure the ke yboard co ver to the notebook.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 7 4. T urn the notebook right-side up with the front to ward you. 5. Open the notebook as far as possible. 6. Lift the front edge of the ke yboard cov er until it detaches from the notebook.
6–1 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 0 K e ybo ard 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. T urn the notebook upside do wn with the front to ward you.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 9 4. Remov e the follo wing: 1 Three T8M2.0×9.0 scre ws 2 One T8M2.0×5.
6–20 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. T urn the notebook right-side up with the front to ward you. 6. Open the notebook as far as possible. 7. Slide the ke yboard back 1 until the pointing stick cable is accessible.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 1 9. Lift the rear edge of the ke yboard 1 until it disengages from the notebook.
6–2 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 1 Fan 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). 4. Disconnect the fan cable 1 from the system board.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 3 6. 1 2 H ea t S in k 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). 4.
6–2 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. Lift the right side of the heat sink 1 to disengage it from the processor .
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 5 ✎ The thermal paste should be thoroughly cleaned from the surfaces of the heat sink 1 and processor 2 each time the heat sink is remov ed. Thermal paste is included with all heat sink and processor spare part kits.
6–2 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 3 Pro ces s or ✎ All processor spare part kits include thermal paste. 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 7 6. Use a flat-blade scre wdri v er to turn the processor locking scre w one-quarter turn counterclockwise 1 until you hear a click. 7. Lift the processor straight up and remov e it 2 .
6–2 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 4 Inter nal Mem or y Module 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –2 9 4. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The side of the memory module opposite the socket rises a way from the notebook.
6–30 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 5 M i ni PCI C o mm u n ic a t io ns C a rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 1 ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables. 4. Disconnect the auxiliary and main antenna cables 1 from the Mini PCI communications card.
6–3 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6 . 1 6 Displa y Assembl y 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Remov e the ke yboard ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –3 3 6. Remov e the two T8M2.0×18.0 scre ws 1 that secure the display cable cov er to the notebook. 7. Remov e the two T8M2.0×9.0 scre ws 2 that secure the display assembly to the notebook.
6–3 4 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 8. Remov e the base enclosure co ver . R emo v ing the Bas e Enclo sur e C o v er 9.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–35 10. Route the display cable through the opening between the base enclosure and the top cov er .
6–3 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 11. T urn the notebook right-side up with the front to ward you. 12. Open the notebook as far as possible. 13. Disconnect the wireless antenna cables from the Mini PCI communications card 1 .
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 7 16. Route the display cable through the opening in the notebook 1 . 17. Remov e the two PM2.0×18.0 scre ws 2 that secure the display assembly to the notebook. 18. Remov e the display assembly 3 .
6–3 8 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6 . 1 7 But to n Boa r d 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. K eyboard co v er ( Section 6.9 ) b . K e yboard ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 9 2. Remov e the two T8M2.0×18.0 scre ws 1 that secure the rear ke yboard co ver to the notebook.
6–40 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 4. Disconnect the b utton board cable 1 from the system board. 5. Remov e the silv er PM2.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 1 6. Lift the left side of the b utton board 1 . 7. Slide the b utton board to the left 2 and remov e it. R emo v ing the Button Boar d Re verse the abo v e procedure to install the b utton board.
6–4 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 8 T o p C ov e r 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–43 2. T urn the notebook upside do wn with the front to ward you. 3. Remov e the se v en T8M2.
6–44 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 4. T urn the notebook right-side up with the front to ward you. 5. Remov e the silv er PM2.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –4 5 6. Disconnect the T ouchPad cable from the system board 1 . 7. Lift the rear edge of the top cov er 2 until it disengages from the base enclosure. 8. Lift the top cov er straight up 3 and remo ve it.
6–4 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 9 T o uc h P a d 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 7 3. Remov e the four PM2.0×4.0 scre ws that secure the T ouchPad bracket to the top co ver .
6–4 8 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. Lift the right side of the T ouchPad bracket 1 until it rests at an angle.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 9 6. Lift the right side of the T ouchPad 1 until it rests at an angle. 7. Slide the T ouchPad to the right and remov e it 2 . R emo v ing the T ouchP ad Re verse the abo v e procedure to install the T ouchPad.
6–5 0 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 0 S pe a k e r 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 1 2. Disconnect the speaker cable 1 from the system board and route the cable under the infrared board cable 2 . 3. Remov e the two T8M2.0×5.0 scre ws 3 that secure the speaker to the notebook.
6–5 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 1 Infrar ed Board 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 3 2. Release the ZIF connector to which the infrared board cable is connected and disconnect the cable 1 from the system board. 3. Remov e the T8M2.0×5.0 scre w 2 that secures the infrared board to the system board.
6–5 4 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.22 S y s t em B oa rd ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defecti v e system board and installed on the replacement system board: ■ Memory modules ( Section 6.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 5 2. Remov e the four T8M2.0×5.0 scre ws 1 that secure the system board to the notebook. 3. Remov e the T8M2.0×7.5 scre w 2 that secures the system board spacer to the notebook.
6–5 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 5. Lift the left side of the system board 1 until the hard dri v e connector 2 is clear of the base enclosure. 6. Slide the system board to the left 3 to remov e it. R emo v ing the S ys tem Boar d Re verse the abo v e procedure to install the system board.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 7 6.2 3 Mod em B oard 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth module ( Section 6.
6–5 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 3. Disconnect the modem cable from the two connectors 1 on the system board. 4. Remov e the two PM2.0×4.0 scre ws 2 that secure the modem board to the system board. 5. Lift the right side of the modem board 3 to disconnect it from the system board.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 9 6.24 RT C B a t t er y 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth module ( Section 6.
6–60 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 3. Remov e the R TC battery from the system board socket. R emo v ing the R T C Bat tery Re verse the abo v e procedure to install the R TC battery .
Maintenance and S ervi ce Guide 7–1 7 Spec ifi ca tions This chapter provides physical and performance specif ications. Ta b l e 7 - 1 Notebook Dimensions Metric U .S. Height (front to back) Width Depth 30.2 to 31.5 mm 285 mm 235 mm 1.19 to 1.24 in 11.
7–2 Maintenance and Serv ice Gui de Spe cifica tio ns Relative humidity (noncondensing) Operating Nonoperating 10% to 90% 5% to 95% 10% to 90% 5% to 95% Maximum altitude (unpressurized) Operating (14.
Spe cificat ion s Maintenance and S ervi ce Guide 7–3 Ta b l e 7 - 2 12.1-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 20.7 cm 33.1 cm 39.1 cm 8.1 in 13.0 in 15.4 in Number of colors Up to 16.8 million Contrast ratio 150:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.
7–4 Maintenance and Serv ice Gui de Spe cifica tio ns Ta b l e 7 - 3 Har d Drives 80-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.
Spe cificat ion s Maintenance and S ervi ce Guide 7–5 Ta b l e 7 - 4 Primary 6-cell, Li-Ion Batter y P ac k Dimensions Height Width Depth We i g h t 2.00 cm 9.40 cm 13.40 cm 0.34 kg 0.79 in 3.70 in 5.28 in 0.75 lb Energ y V oltage Amp-hour capacity W att-hour capacity 10.
7–6 Maintenance and Serv ice Gui de Spe cifica tio ns Ta b l e 7 - 5 System DMA Hard ware DMA System Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 Not applicable DMA4 Direct memor y access controller DMA5* A vailab le f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller ca n use DMA 1, 2, or 5.
Spe cificat ion s Maintenance and S ervi ce Guide 7–7 Ta b l e 7 - 6 System Interrupts Hard ware IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K e y or Microsoft Natural K eyboard IRQ.
7–8 Maintenance and Serv ice Gui de Spe cifica tio ns IRQ11 Intel USB EHCI controller—24CD Intel USB UHCI controller—24C4 Intel USB UHCI controller—24C7 Intel Pro/Wireless 2200BG TI OHCI 1394 .
Spe cificat ion s Maintenance and S ervi ce Guide 7–9 Ta b l e 7 - 7 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller no .
7–1 0 Maintenance and S ervi ce Guide Spe cifica tio ns I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no .
Spe cificat ion s Maintenance and S ervi ce Guide 7–1 1 I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared por t 300 - 31F Unused 320 - 36F Unused 370 - .
7–1 2 Maintenance and S ervi ce Guide Spe cifica tio ns Ta b l e 7 - 8 System Memory Map Size Memory Address System Function 640 KB 00000000-0009FFFF Base memor y 128 KB 000A0000-000BFFFF Video memo.
Maintenance and S ervi ce Guide A–1 A Co nnec tor P in A ssi gnm en ts Ta b l e A - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 A udio out, left channel 3 Ground 2 A udio out, right channel.
A–2 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 2 A udio-In (Micr ophone) Pin Signal Pin Signal 1 A udio signal in 3 Ground 2 A udio signal in Ta b l e A - 3 Universal S.
Connec tor P in Assignments Maintenance and S ervi ce Guide A–3 Ta b l e A - 4 External Monitor Pin Signal Pin Signal 1 Red analog 9 +5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4.
A–4 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 5 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused.
Connec tor P in Assignments Maintenance and S ervi ce Guide A–5 Ta b l e A - 6 RJ-45 (Netw ork) Pin Signal Pin Signal 1 T ransmit + 5 Unused 2 T ransmit – 6 Receiv e – 3 Receive + 7 Unused 4 Unu.
A–6 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 7 S-Video-Out Pin Signal Pin Signal 1 S-VHS color (C) signal 5 TV -CD 2 Composite video signal 6 S-VHS intensity ground 3.
Maintenance and S ervi ce Guide B–1 B P o w er Cord Se t Requirements 3-Con duc tor P o w er C ord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 v olts A C.
B–2 Maintenance and Se rvic e Guide P ow er Cor d Set R equirements Gen eral R equiremen ts The requirements listed belo w are applicable to all countries or regions. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.
P ow er Cor d Set Requir ements Maintenance and S ervi ce Guide B–3 Countr y/Region -Spec ific Requiremen ts 3-Conductor P ower Cor d Set Requirements Country/Region Accredited Agency Applicable Not.
B–4 Maintenance and Se rvic e Guide P ow er Cor d Set R equirements The Netherlands KEMA 1 Norwa y NEMK O 1 Sweden SEMK O 1 Switzerland SEV 1 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.
Maintenance and S ervi ce Guide C–1 C Sc r e w List ing This appendix provides specif ication and reference information for the scre ws and scre w locks used in the notebook. All scre ws and scre w locks listed in this appendix are a v ailable in the Scre w Kit, spare part number 383556-001.
C–2 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 . 0×5 . 0 Sc r ew L ocations Ta b l e C - 1 Phillips PM2.0×5.0 Screw Color Qty . Length Thread Head Width Black 6 5.0 mm 2.0 mm 4.5 mm Where used: 1 T wo screws that secure the hard driv e cov er to the notebook (documented in Section 6.
Scr e w Listi ng Maintenance and S ervi ce Guide C–3 Phillips M2 . 0×5 . 0 Sc r ew L ocations Ta b l e C - 1 Phillips PM2.0×5.0 Screw (Continued) Color Qty .
C–4 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 .5×1 3 . 0 and Phillips M3 .0×4. 0 Scr ew L ocations Ta b l e C - 2 Phillips PM2.5×13.0 Spring-Loaded Har d Drive Retention Screw Color Qty . Length Thread Head Width Black 1 13.0 mm 2.
Scr e w Listi ng Maintenance and S ervi ce Guide C–5 Phillips M1 . 5×3 . 5 Sc re w L ocation Ta b l e C - 4 Phillips PM1.5×3.5 Screw Color Qty . Length Thread Head Width Silv er 1 3.5 mm 1.5 mm 4.5 mm Where used: One screw that secures the TPM security card to the notebook (documented in Section 6.
C–6 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the k e yboard co v er to the notebook (documented in Section 6.
Scr e w Listi ng Maintenance and S ervi ce Guide C–7 T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the bas e enclosure cov er to the notebook (documented in Section 6.
C–8 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 6.
Scr e w Listi ng Maintenance and S ervi ce Guide C–9 T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the rear k e yboard cov e r to the notebook (documented in Section 6.
C–1 0 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×9 . 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×9.0 Screw Color Qty . Length Thread Head Width Black 12 9.0 mm 2.0 mm 4.5 mm Where used: 1 Three screws that secure the k e yb oard to the notebook (documented in Section 6.
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 1 T or x T8M2 .0×9 . 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 12 9.0 mm 2.0 mm 4.5 mm Where used: 7 screws that secure the top co v e r to the notebook (documented in Section 6.
C–1 2 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×5 . 0 Scr ew L ocati on Ta b l e C - 7 T orx T8M2.0×5.0 Screw Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: One screw that secures the k e yboa rd to the noteboo k (documented in Section 6.
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 3 T or x T8M2 .0×5 . 0 Scr ew L ocati ons Ta b l e C - 7 T orx T8M2.0×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: 1 T wo screws that secure the speak e r to the notebook (documented in Section 6.
C–1 4 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×5 . 0 Scr ew L ocati ons Ta b l e C - 7 T orx T8M2.0×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: 4 screws that secure the system boar d to the notebook (documented in Section 6.
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 5 T or x T8M2 .0×7 .5 Sc r ew L ocations Ta b l e C - 8 T orx T8M2.0×7.5 Screw Color Qty . Length Thread Head Width Silv er 4 7.5 mm 2.0 mm 4.5 mm Where used: 3 screws that secure the f an to the notebook (documented in Section 6.
C–1 6 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×7 . 5 Sc r e w L ocation Ta b l e C - 8 T orx T8M2.0×7.5 Screw (Continued) Color Qty . Length Thread Head Width Silv er 4 7.5 mm 2.0 mm 4.5 mm Where used: One screw that secures the system boar d and system board spacer to the notebook (documented in Section 6.
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 7 Phillips M2 .5×7 .0 S cr ew L ocati ons Ta b l e C - 9 Phillips PM2.5×7.0 Screw Color Qty . Length Thread Head Width Black 4 7.0 mm 2.5 mm 5.0 mm Where used: 4 screws that secure the heat sink to the notebook (documented in Section 6.
C–1 8 Maintenance and Serv ice Gui de Scr e w Listi ng Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 1 One scre w that secures the button b oard to the notebook (documented in Section 6.
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 9 Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw ( Continued) Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 4 screws that secure the T ouchPad br a ck et to the top co v er (documented in Section 6.
C–20 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw ( Continued) Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 2 screws that secure the modem board to the system board (documented in Section 6.
Maintenance and S ervi ce Guide Inde x–1 In de x A adjustable notebook stand, spare part number 4–12 , 4–15 Advanced Docking Station, HP, spare part number 4–12 , 4–15 arrow keys 1–15 audi.
Inde x–2 Maintenance and Serv ice Gui de Inde x components bottom 1–18 front 1–6 keyboard 1–14 left-side 1–10 , 1–12 rear 1–10 , 1–12 right-side 1–8 top 1–16 Computer Setup Advance.
Inde x Maintenance and S ervi ce Guide Inde x–3 no OS loading from hard drive 2–18 , 2–19 , 2–20 no OS loading from optical drive 2–22 no power 2–10 , 2–12 , 2–13 no video 2–14 , 2.
Inde x–4 Maintenance and Serv ice Gui de Inde x L Label Kit, spare part number 4–12 , 4–19 LED board cable 4–11 left-side components 1–10 , 1–12 M memory map specifications 7–12 memory m.
Inde x Maintenance and S ervi ce Guide Inde x–5 PC Card slot eject button 1–9 PC Card slot space saver 4–10 plastic parts 5–2 pointing device, troubleshooting 2–27 pointing stick 1–17 poin.
Inde x–6 Maintenance and Serv ice Gui de Inde x notebook 7–1 system DMA 7–6 static shielding materials 5–8 S-Video-out jack location 1–13 pin assignments A–6 system board removal 6–54 sp.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il HP COMPAQ NC4200 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del HP COMPAQ NC4200 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso HP COMPAQ NC4200 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul HP COMPAQ NC4200 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il HP COMPAQ NC4200, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del HP COMPAQ NC4200.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il HP COMPAQ NC4200. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo HP COMPAQ NC4200 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
