Manuale d’uso / di manutenzione del prodotto DL365 del fabbricante HP (Hewlett-Packard)
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HP Pr oL iant DL3 6 5 S er v er Maintenance and S e r v i ce Gui de Part Number 418289- 005 March 2008 (Fifth Edition).
© Copyright 2006, 2008 Hewlett-Pa ckard Development Company, L.P. The in format ion c onta ined h erein is su bject to chan ge withou t not ice. The onl y war ranti es for HP product s an d servi ces ar e s et fort h in the expr ess warrant y st atements accom pany ing such produ cts an d ser vices.
Contents 3 Con t e n t s Custom er self re pair ........................................................................................................... ........... 5 Parts only war ranty s erv ice ..................................................
Contents 4 PCI Sma rt Array c o ntr oller ca bl ing ............................................................................................. ........ 59 Battery pa ck ca blin g......................................................................
Customer self repair 5 C ust omer self r epair HP products are designed with many Customer Self Repair (CSR) parts to minimize r epair time and allow for greater flexibility in performing defective parts re placement.
Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vou s demandez à HP de remplacer ces pièces, les coûts de déplacement et main d' œuv re du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste par ti siano sostituit e da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR- Ersatzteil geliefert werden, k önnen Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss.
Customer self repair 9 Centro de asistencia técnica de HP y recibirá ay uda telefónica por parte de un técni co. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectu osos deberán devolverse a HP.
Customer self repair 10 periode, gewoonlijk vijf (5) we rkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen.
Customer self repair 11 Para obter mais informações sobre o programa de re paro feito pelo cliente da HP, entre em contato com o fornecedor de serv iços local. Para o pr og rama norte-americano, visite o site da H P ( http://www.h p.com/go/s elfrepair ).
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 Illus tr ated par ts cata log Mechanical components Item Description Spare part number Customer se lf repai r ( on page 5 ) 1 Access panel 431360-001 Mandatory 1 2 Miscell.
Illustrated parts catalog 17 Item Description Spare part number Customer se lf repai r ( on page 5 ) Rack mo unting hardwa re 5 Rack mo unting ha rdwar e kit* 360104-001 Mandatory 1 6 Cabl e management ar m* 360105-001 Mandatory 1 *Not shown 1 Mandatory—Parts f or which customer self repai r is mandator y.
Illustrated parts catalog 18 sustitución de esto s componente s. Dichos compone ntes se id entifican con la palabra “No” en el catálogo il ustrado de componentes.
Illustrated parts catalog 19 System components Item Description Spare part number Customer self repa ir (on page 5 ) 7 System fan m odule 412212-001 Mandatory 1 8 Hot-plug power suppl y, 700-W 412211-001 Mandatory 1 9 PCIe riser board assembly 412200-001 Mandatory 1 10 Processor — — a) 1.
Illustrated parts catalog 20 Item Description Spare part number Customer self repa ir (on page 5 ) k) 3.0-GHz, 95- W AMD Opter on™* 451810-00 1 Optional 2 11 Heatsink wi th grease and alcohol swab 4.
Illustrated parts catalog 21 Item Description Spare part number Customer self repa ir (on page 5 ) Miscellaneous 27 SAS cable* 408763-001 Mandatory 1 28 Smart Array batter y cable* 409124-001 Mandatory 1 29 AC power cord* 142258-001 Mandatory 1 30 Battery, 3.
Illustrated parts catalog 22 3 No: No—Algun os componentes no están diseñados para qu e puedan ser reparad os por el usuario. Par a que el usuario haga valer su garantía, HP pone como c ondición que un prov eedor de servicios aut orizado realice la sustitución de esto s componente s.
Removal and replac ement procedures 23 R emo val and r epla cement pr ocedur es Required tools You need the following items for some pro cedures: • T-10 Torx screwdriver • T-15 Torx screwdriver • Diagnostics Utility Safety considerations Before performing service procedures, review all the safety information.
Removal and replac ement procedures 24 This symbol indicates the presence of elec tric shock hazards. The area contains no user or field serviceable parts . Do not open for any reason. WARNING: To reduce the r isk of injury fr om electric shock haz ards, do not open t his enclosure.
Removal and replac ement procedures 25 Preparation procedures To access some components and perf orm certain service procedures , you must perfo rm one or more of the following procedures: • Extend the server from the rack (on page 25 ).
Removal and replac ement procedures 26 IMPORTA NT: If installing a hot-plug device, it is not nec essary to power down the server. 1. Back up the server data. 2. Shut down the operating system as directed by the operating system documentation. 3. If the server is installed in a rack, press the UID LED button on the front panel.
Removal and replac ement procedures 27 Hot-plug SAS or SATA hard drives CAUTION: To prevent improper cooling and therm al damage, do not operate the server unless all bays are populated with either a component or a bla nk. Remove the component as indicated.
Removal and replac ement procedures 28 6. Remove the T-10 Torx screw s located on the sides o f the bezel. 7. Gently push on the two tabs located at the top of the be zel 8. Rotate the bezel away from the server and remove the bezel. To replace the component, reve rse the removal procedure.
Removal and replac ement procedures 29 2. Remove the hard drive bezel blank. To replace the component, reve rse the removal procedure. Hot-plug power supply WARNING: To reduce the r isk of electric s hock, do not disassemble the power supply or attempt to repair it.
Removal and replac ement procedures 30 3. Remove the power supply. To replace the component, reve rse the removal procedure. Power supply blank Remove the component as indicated.
Removal and replac ement procedures 31 CAUTION: Do not operate the server for lo ng periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper coolin g that can lead to thermal damage. To remove the component: 1.
Removal and replac ement procedures 32 To remove the component: 1. Power down the server (on page 25 ). 2. Extend or remove the server from the rack (" Extend the server from the rack " on page 25 , " Remove the server from the rack " on page 26 ).
Removal and replac ement procedures 33 o HP Smart Array E200i battery tray o HP Smart Array P400i battery tray To replace the component, reve rse the removal procedure.
Removal and replac ement procedures 34 3. Remove the access panel (" Access panel " on page 30 ). 4. Remove the air baffle (" Air baffle " on page 31 ). 5. Remove fan module 2 (" Fan module " on page 31 ). 6. Remove the battery tray (" Battery tray " on page 32 ).
Removal and replac ement procedures 35 NOTE: Access to the ejector button is intentionally restri cted. To eject the opti cal device, push the ejector button with a small flat object such as a key or pen.
Removal and replac ement procedures 36 9. Remove the multibay backplane assembly. 10. Remove the multibay backplane board from the assembly. To replace the component, reve rse the removal procedure. SAS backplane To remove the component: 1. Power down the server (on page 25 ).
Removal and replac ement procedures 37 10. Disconnect the power and data cables from the SAS backplane. 11. Remove the three T-15 Torx screws from the backplane.
Removal and replac ement procedures 38 4. Remove the front bezel (" Front bezel " on page 27 ). 5. Remove the air baffle (" Air baffle " on page 31 ). 6. Remove fan module 3 (" Fan module " on page 31 ). 7. Remove the multibay backplane assembly (" Multibay backplane assembly " on page 35 ).
Removal and replac ement procedures 39 CAUTION: To prevent dam age to the server or ex pansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly. 1. Power down the server (on page 25 ).
Removal and replac ement procedures 40 6. Remove any expansion board installed in the assembly. To replace the component, reve rse the removal procedure. CAUTION: To prevent improper cooling and therm al damage, do not operate the server unless all PCI slots have either an ex pansion slot cover or an expansion board installed.
Removal and replac ement procedures 41 8. Remove the full-length PCI Express rise r board from the riser board assembly . To replace the component, reve rse the removal procedure. Integrated HP Smart Arra y E200i Controller or HP Smart Array P400i Controller To remove the component: 1.
Removal and replac ement procedures 42 6. Disconnect the backplane power c able from the system board. 7. Turn the quarter-turn fasteners an d lift the integrated array controller away from the sy stem board. To replace the component, reve rse the removal procedure.
Removal and replac ement procedures 43 6. Remove the DIMM. To replace the component, reve rse the removal procedure. Heatsink To remove the component: 1. Power down the server (on page 25 ). 2. Extend the server from the rack (on page 25 ). 3. Remove the access panel (" Access panel " on page 30 ).
Removal and replac ement procedures 44 1. Use the alcohol swab to remove all the ex isting ther mal grease from the processor. Allow the alcohol to evaporate before continuing. 2. Apply new grease to the top of the processor in one of the following patterns to ensure even distribution.
Removal and replac ement procedures 45 The server uses embedded PPMs as DC-to-DC converter s to provide the proper power to eac h processor. WARNING: To reduce the risk of personal injury from hot surfaces, allow the dr ives and the internal system components to cool before touch ing them.
Removal and replac ement procedures 46 6. Remove the heatsink. 7. Open the processor retaining latch and th e processor socket retaining bracket..
Removal and replac ement procedures 47 8. Using your fingers, remove the failed proc essor. IMPORTA NT: Be sure the replacement processor remains inside the processor installation tool. 9. If the processor has separated from the installation to ol, carefully re-insert the processor in the tool.
Removal and replac ement procedures 48 11. Press down firmly until the processor installation t ool clicks and separates from the processor, and then remove the processor installation tool.
Removal and replac ement procedures 49 12. Close the processor retaining latch and th e processor socket retaining bracket. 13. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 14.
Removal and replac ement procedures 50 15. Install the heatsink. 16. Install the air baffle (" Air baffle " on page 31 ). 17. Install the access panel (" Access panel " on page 30 ). 18. Slide the server into the rack. 19. Power up the server.
Removal and replac ement procedures 51 5. Remove the battery. IMPORTA NT: Replacing the system board battery re sets the system ROM to its default configuration. After replacing the battery, reconfigure th e system through RBSU. To replace the component, reve rse the removal procedure.
Removal and replac ement procedures 52 CAUTION: To help avoid damage to the processor and system board, do not install the processor without using the processor installation tool. CAUTION: Removal of the processor or heatsink renders the thermal layer between the processor and heatsink useless.
Removal and replac ement procedures 53 12. For each installed processor, open the processor re taini ng latch and the processor socket retaining bracket on the failed system board. 13. For each installed processor, use your fingers to re move the processor from th e failed sy stem board.
Removal and replac ement procedures 54 14. Remove the failed system b oard. To replace the system board: 1. Install the spare system board in the se rver before installing the processor. 2. Prepare the processor socket o n the spare system board. a. Remove the processor socket protective cover.
Removal and replac ement procedures 55 b. Open the processor retaining latch and th e processor socket retaining bracket. 3. Install the processor socket cover onto the proc essor socket of the failed sy stem board. 4. Install the processor on th e spare system board.
Removal and replac ement procedures 56 5. Close the processor retaining latch and th e processor socket retaining bracket. 6. Clean the old thermal grease from the proc essor and heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.
Removal and replac ement procedures 57 10. Install all power supplies (" Hot-plug power supply " on page 29 ). 11. Install the access panel (" Access panel " on page 30 ). 12. Power up the server. After you replace the system board, you must re-enter the server serial number and the product ID.
Cabling 58 Cabl in g Cabling overview This section provides guidelines that help you make info rmed decisions about cabling the serv er and hardware options to optimize performance. For information on cabling peripheral components, refe r to the white paper on high- density deployment at the HP website ( http://www.
Cabling 59 HP Smart Array P4 00i Controll er cabling CAUTION: When routing cables, use the cable trou gh between fan modules 1 and 2. Be sure the cables do not interfere with fan module installation. Be sure to route the cables around the DIMM connectors so as not to in terfere with DIMM installation.
Cabling 60 Battery pack cabli ng • HP Smart Array E200i Controller battery pack c abling.
Cabling 61 • HP Smart Array P400i Controller battery pack cabling.
Diagnostic tools 62 Di agno st i c t ool s Troubleshooting resources The HP ProLiant Serve rs Troubleshooting Guide provides procedures for resolv ing common problems and comprehensive courses of acti.
Diagnostic tools 63 HP Insight Diagnostics su rvey functionality HP Insight Diagnostics (on page 64 ) provides survey functionality that gathers critical hardware and software information on ProLiant serv ers. This functionality suppo rts operating systems that may no t be supported by the server.
Diagnostic tools 64 For more information, refer t o th e Management CD in the HP ProL iant Essentials Foundation Pack. Automatic Server Recovery ASR is a feature that causes the system to restart wh en a catastro phic operating system error oc curs, such as a blue screen, ABEND, or panic.
Diagnostic tools 65 Open Services Event Manager OSEM is a standalone tool that perf orms real-time reactive and proactiv e service event filtering, analysis, and notification. The tool gathers ev ent data from SNMP traps or information provided ov er an HTTP interface and notifies an administrator or HP through S MTP and ISEE.
Component identification 66 C ompo nent identif i catio n Front panel components Item Description 1 Hard drive bay 5 (optional) * 2 Hard drive bay 6 (optional) * 3 Multibay drive bay 4 HP Systems Insi.
Component identification 67 Front panel LEDs and buttons Item Description Status 1 Power On/ Standby button and system power LED Green = System is on. Amber = System is sh ut down, but power is still applied.
Component identification 68 Item Description Status 6 NIC 2 lin k/activity LED Green = Network lin k exists. Flashing green = Network li nk and activi ty exist.
Component identification 69 Rear panel LEDs and buttons Item Description Status 1 iLO 2 NIC activity LED Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. 2 iLO 2 NIC link LED Green = Link exists. Off = N o link exists.
Component identification 70 System board components Item Description 1 System battery 2 NMI jumper 3 System maintenance switc h (SW1) 4 Internal U SB connector 5 Multiba y connector 6 Power switch co .
Component identification 71 System maintenance switch Position Defau lt F unction S1 Off Off = iLO 2 secur ity is enab led. On = iLO 2 secur ity is disab led. S2 Off Off = System co nfigur ation can be mod ified. On = System conf igura tion is lo cked and cannot be modified.
Component identification 72 To view the LEDs, acc ess the HP System s Insight Display. LED Sta tus Off Normal Amber Fai lure For additional information about these LE Ds, see "HP Sy stems Insight Displa y LEDs and internal health LED combinations (on page 72 ).
Component identification 73 HP Systems Insight Display LE D and color Internal health LED c olor Status PPM failu re (amber) Red In tegrated PPM has failed. DIMM failure, slot X (amber) Red One or more o f the follow ing co nditions may exist: • DIMM in slot X has failed.
Component identification 74 • Six hard drive configuration SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amb er/blue) 2 Online L ED (gree n).
Component identification 75 SAS and SATA hard drive LED combinations Online/activity LED (gr een) Fault/UID LE D (amber/blue) Interpretation On, off, o r flash ing Alternating amber and blue The drive has failed, or a pred ictive failure alert has been received for this d rive; it also has been selected by a managem ent application .
Component identification 76 Fan locations Item Description 1 Fan module 1 2 Fan module 2 3 Fan module 3.
Specifications 77 Sp e cific a t io n s Environmental specifications Specification Value Tempera ture ra nge* Operat ing 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping -40 ° C to 70 ° C (-40 ° F to 158 ° F) Maximu m wet bu lb tempera ture 28 ° C (82.
Specifications 78 Specification Value Rated steady-state power 700 W Hot-plug power supply calculations For hot-plug power supply spec ifications and calculators to determin e electrical and heat loading for the server, refer to the HP Enterprise Configurator website ( http://h30099.
Specifications 79 Specification Value Track -to-track (high/low ) 3 ms/6 ms Average (h igh/low) 169 ms/94 ms Setting time 15 ms Latency averag e 100 ms Cylinders (high/low) 80/80 Read/write h eads 2 C.
Specifications 80 Specification Value Operatin g conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% DVD-ROM drive specific ations Specification Value Disk formats DVD (single an.
Specifications 81 Specification Value Operatin g conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90% SAS hard drive specifications Item 36-GB SAS drive 72-GB SAS drive 146-GB SAS d rive Capacity 36,420 MB 73,408 MB 146,815 MB Height 25.
Acronyms an d abbreviations 82 A c r on y ms and abbr e v i ati ons ABEND abnormal end ASR Automatic Server Recovery BBWC battery-backed write cache DDR double data rate IML Integrated Management Log .
Acronyms an d abbreviations 83 RBSU ROM-Based S etup Utility SAS serial attached SCSI SATA serial ATA SFF small form-factor SIM Systems Insight Mana ger UID unit identification USB universal serial bu.
Index 84 A access panel 30 additional information 62 ADU (Array Diagnostic Utility) 62 air baffle 25, 31 array controller, cabling 5 8, 59 array controller, removing 41 Array Diagnostic Utility (ADU) .
Index 85 LEDs 66, 75 LEDs, hard driv e 74, 75 LEDs, NIC 67, 69 LEDs, power button/LED board 67 LEDs, unit identificati on (UID) 6 7 M management tools 62 mechanical components 16 multibay backplane as.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il HP (Hewlett-Packard) DL365 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del HP (Hewlett-Packard) DL365 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso HP (Hewlett-Packard) DL365 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul HP (Hewlett-Packard) DL365 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il HP (Hewlett-Packard) DL365, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del HP (Hewlett-Packard) DL365.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il HP (Hewlett-Packard) DL365. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo HP (Hewlett-Packard) DL365 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
