Manuale d’uso / di manutenzione del prodotto 654080-S01 del fabbricante HP (Hewlett-Packard)
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HP Pr oL ian t DL/ML3 7 0 G6 S erv er Maint enance and S er v i ce Guide Abstract This guide is for an experienced s ervice technician. HP assumes you are qualified in the serv icing of computer equip.
© Copyright 2009, 2012 He wlett- Packard Development Company, L.P. The information contained herei n is subject to change without notice. The only warranties for HP products and services are set for th in the express warranty statements accompanyin g such products and services.
Contents 3 Con tents Customer self repair ...................................................................................................................... 6 Parts only warranty service ............................................................
Contents 4 HP NC524SFP Dual Port 10GbE Module ................................................................................................... 65 Systems Insight Display ..............................................................................
Contents 5 Server specifications .............................................................................................................................. 113 Power supply specificat ions ..........................................................
Customer self repair 6 C u st omer s elf r epair HP p roducts are designe d with many Customer Self Re pair (CSR) parts to mini mize repair time and allow for greater flex ibility in per forming def ective parts rep lacement.
Customer self repair 7 Obligatoire - P ièces pour lesquelles la ré paration par le client est obligatoire. Si vous demandez à HP de remplacer c es pièces, les c oûts de déplacemen t et main d'œuv re du service vo us seront facturé s. Facultatif - Piè ces pour lesquell es la réparati on par le client est facultative.
Customer self repair 8 In base alla disponibi lità e alla località geograf ica, le parti CSR vengono sp edite con consegna entro il giorno lavorat ivo seguente. La conse gna nel giorno stesso o entro quattro o re è o fferta con un supplemento di costo solo in a lcune zone.
Customer self repair 9 defekte Teil nicht zurückschicken, kann HP Ihnen das Er satzteil in Rechnung stellen. Im Falle von Customer Self Repair ko mmt HP für alle Kost en für die Liefer ung und Rücksend ung auf und best immt den Kurier- /Frachtdienst.
Customer se lf repair 10 enviara el componente defectuoso requerido, HP po drá cobrarle por el de sustitución. En el c aso de todas sustitucion es que lleve a ca bo el cliente, H P se hará cargo de todos l os gastos de env ío y devolución d e c omponentes y escogerá l a empresa de transporte que se utilice para dic ho servicio.
Customer self repair 11 Neem contact op met e en Service Partner voo r meer informatie o ver het Customer Self Re pair programma van HP. Informatie o ver Service Partners vindt u op de HP website ( http://www.
Customer self repair 12 No caso desse ser viço, a substituição de peç as CSR é obrigatória. S e desejar que a HP su bstitua essas peças, serão cobradas as despesas de transporte e mão - de - obra do serviço.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 I llus tr ated parts catalog M echanical co mponents Item Description Spare part number Customer self repair (on page 6 ) 1 Access panel 519557 - 001 Mandatory 1 2 Front b.
Illustrated parts catalog 17 Item Description Spare part number Customer self repair (on page 6 ) 5 Miscellaneous hardware kit 519560 - 001 Mandatory 1 a) Fan blank — — b) Power su pply blank — .
Illustrated parts catalog 18 sustitución, pue de o no conllev ar costes adici onales, depe ndiendo del tipo de servicio de ga rantía corresp ondiente al producto. 3 No: No — Algunos componentes no están dise ñados para que puedan ser reparados por el usuario.
Illustrated parts catalog 19 S ystem components Item Description Spare part number Customer self repair (on page 6 ) System components 9 Power supply — — a) Hot - plug power supply, 460 -W 511777 .
Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 6 ) c) 2.00 - GHz Intel Xeon processor E5504, 80W* ** 490074 - 001 Optional 2 d) 2.13 - GHz Intel Xeon processor E5506, 80W* ** 50601 3 - 001 Optiona l 2 e) 2.
Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 6 ) X5677, 130W * ** cc) 3.33 - GHz Intel Xeon processor X5680, 95W* ** 59488 0 - 001 Optiona l 2 dd) 3.60 - GHz I ntel Xeon proce ssor X5687, 130W * ** 63813 7 - 001 Optional 2 ee) 3.
Illustrated parts catalog 22 Item Description Spare part number Customer self repair (on page 6 ) e) Systems Insight Display sideband cable — — 27 Mini - SAS cable* 498426 - 0 01 Mandatory 1 Optio.
Illustrated parts catalog 23 Item Description Spare part number Customer self repair (on page 6 ) 40 FBWC capaci tor pack* 587324 - 001 Mandatory 1 41 FBWC cache module, 512 - MB* 578882 - 0 01 Mandat.
Illustrated parts catalog 24 3 No: No — Algunos componentes no están dise ñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP p one como condic ión que un proveedor de s ervicios autoriz ado realice la sustitución de estos componentes.
Removal an d replacement procedures 25 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following it ems for some procedur es: • T- 10/T - 15 Torx screwdriver (included w ith t.
Removal an d replacement procedures 26 This symbol on an RJ - 45 receptacle indicates a network inte rface connection. WARNING: To reduce the risk of el ectric shock, fire, or damage to the equipm ent, do not plug telephone or telecommunicatio ns connectors into this receptacle.
Removal an d replacement procedures 27 • Extend the server from the rack (o n page 28 ). If you are performing service procedures in an HP, Compaq br anded, telco, or third - party rack c abinet, you can use the locking feature of the rack rai ls to support the server and gain access to internal components.
Removal an d replacement procedures 28 4. Press the server rail - relea se latches and remo ve the server from the rack. 5. Place the serv er on a sturdy, level surface. E xtend the server from the rack IMPORTANT: If the server is inst alled in a telco rack, rem ove the server from t he rack to access internal components.
Remo val and replacemen t procedures 29 2. After performing the installation or maintenance procedure, slide the server into the r ack by pressing the server rail - release la tches. A ccess the product rear panel C able management arm with left - hand swing To access the se rver rear panel, open the cable management arm.
Removal an d replacement procedures 30 2. Swing open the cable management arm. 3. Remove the c ables from the cab le trough. 4. Remove the cable manage ment arm. T ower bezel This server has a re movable bezel that mu st be unlock ed and opened before a ccessing the ha rd drives or removing t he access panel.
Removal an d replacement procedures 31 2. Remove the t ower bezel. To replace th e component, rev erse the remova l procedure. A ccess panel WARNING: To reduce the risk o f personal inj ury from hot surfa ces, allow the d rives and the internal system components to cool before touchi ng them.
Removal an d replacement procedures 32 IMPORTANT: When replacing one failed fa n only in a redundant configurat ion, powering down the server is n ot required. To remove the component: 1. Power down the serv er (on page 27 ). 2. Do one of the followin g: o Open or rem ove the tower bezel, as needed (" Tower bezel " on page 30 ).
Removal an d replacement procedures 33 4. Remove the c ache module. To replace the component, reverse the removal procedure. B BWC batte ry pack or F BWC ca pacitor pac k CAUTION: To preve nt a server.
Removal an d replacement procedures 34 5. Remove the battery pac k. To replace the component, reverse the removal procedu re. A ir baffle To remove the component: 1. Power down the serv er (on page 27 ). 2. Do one of the followin g: o Open or remove the tower bezel, a s needed (" Tower bezel " on pa ge 30 ).
Removal an d replacement procedures 35 6. Remove the a ir baffle. To replace th e component, rev erse the remova l procedure. F an cage IMPORTANT: When installing or repl acing server components, one or more fans might need to be removed.
Removal and replacement procedures 36 7. Remove the fa n cage. To replace th e component, rev erse the remova l procedure. F an blank CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all bays are popul ated with either a co mponent or a blank.
Removal an d replacement procedures 37 7. Remove the fan blank. To replace th e component, rev erse the removal procedure. F ans 1 -4 CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all bays are popul ated with either a co mponent or a blank.
Removal an d replacement procedures 38 5. Remove the fa n. To replace th e component, rev erse the remova l procedure. T ower side panels To remove the component: 1. Power down the serv er (on page 27 ). 2. Do one of the followin g: o Open or rem ove the tower bezel, as needed (" Tower bezel " on page 30 ).
Removal an d replacement procedures 39 o Rear (1) o Front (2) 4. Remove the c hassis from th e tower side panels:.
Removal an d replacement procedures 40 a. Disengage the chassis from the tower side panel s by pushing the bottom s ide panel back and by pulling the chassi s forward. b. Lift the cha ssis up and out of t he tower side pa nels. To replace th e component, rev erse the remova l proced ure.
Removal an d replacement procedures 41 3. Remove the fe et. To replace the compon ent, slide it back into the lockin g slot. Be sure that the foot clicks securely into the chassis.
Removal an d replacement procedures 42 2. Back up all server data o n the hard drive. 3. Remove the hard drive. To replace th e component, rev erse the remova l procedure. M edia bay blan k CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all bays are popul ated with either a co mponent or a blank.
Removal an d repla cement procedures 43 To remove the component: 1. Power down the serv er (on page 27 ). 2. Do one of the followin g: o Open or rem ove the tower bezel, as needed (" Tower bezel " on page 30 ). o Extend the server from the rack (on pag e 28 ).
Removal an d replacement procedures 44 6. Remove the a ir baffle (" Air baffle " on page 34 ). 7. Remove the fa n cage (" Fan cage " on page 35 ). 8. Disconnect the data and p ower cable from the re ar of the optical drive . 9. Remove the optical dri ve.
Removal an d replacement procedures 45 Remove the compone nt as indicated. To replace th e component, rev erse the remova l procedure. H ard drive cages and backp lanes The server supports the followi.
Removal an d replacement procedures 46 8. Disconnect the data and p ower cables from the tw o - bay LFF drive cage. 9. Remove all LFF driv es installed in the drive cage (" SAS/SATA hard drive " on page 41 ). 10. Remove the l ocking bracket s.
Removal an d replacement procedures 47 12. Using a T - 15 Torx sc rewdriver, remove the back plane from the drive cage. CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all bays are popul ated with either a co mponent or a bla nk.
Removal an d replacement procedures 48 10. Using a T - 15 Torx screwdri ver, remove the si x - bay LFF backplane . CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all bays are popul ated with either a co mponent or a blank.
Removal an d replacement procedures 49 9. Using a T - 10 Torx screwdriver, remov e the eight - bay SFF drive cage fr om drive cage bay 1. 10. Using a T - 15 Torx sc rewdriver, remove the back plane from the drive cage. The outer sleeve is not shown for clarity.
Removal an d replacement procedures 50 o Extend the server from the rack (on pag e 28 ). 3. Remove the a ccess panel (" Acce ss panel " on page 31 ).
Removal an d replacement procedures 51 CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all bays are popul ated with either a co mponent or a blank. To replace th e component, rev erse the remova l procedure. E ight - bay SFF drive cage ba ckplane (bay 3) To remove the component: 1.
Removal an d replacement procedures 52 11. Remove the ei ght - bay SFF drive cage f rom bay 3. 12. Using a T - 15 Torx sc rewdriver, remove the back plane from the drive cage. CAUTION: To preve nt improper cooling and thermal damage, do not operate the server unless all bays are popul ated with either a co mponent or a blank.
Removal an d replacement procedures 53 o If only one hot - plug power supply is install ed, power down and remove the power cord fro m the server (" Power down the server " on page 27 ). o If more than one hot - plug power supply is installed, continue with the ne xt step.
Removal an d replacement procedures 54 9. Remove the h eatsink. To replace th e heatsink: 1. Use the alcoh ol swab to remove all th e existing therma l grease from the pro cessor. Allow the alco hol to evaporate before con tinuing. 2. Apply new gr ease to the top of t he processor using a five - dot pattern to ensure even distribution.
Removal an d replacement procedures 55 3. Install the heatsink. and close the heatsink retaining latc hes. 4. Install the air baffle. 5. If removed, install the BBWC battery pack or the FBWC capacitor pac k. 6. Install fan 5. 7. Install the access panel.
Removal an d replacement procedures 56 Locate and download th e latest ROM version from t he HP website ( http://www.hp.com/support ). Follow the instructions on the website to update the system ROM.
Remo val and replacemen t procedures 57 c. Release the tabs, and then carefully lift the processo r and tool straight up. 12. Carefully rotate the tool, and then push in and releas e the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area.
Removal an d replacement procedures 58 To replace a pr ocessor: 1. Carefully inse rt the processor into the proce ssor installation tool. Handle the processor by th e edges only, and do not touch the bottom of the processor, especially the contact area.
Removal an d replacement procedures 59 2. Be sure the to ol is oriented correct ly. Align the proce ssor installation tool with the socket, and then install the processo r. THE PINS ON THE SYST EM BOARD ARE VERY F RAGILE AND EASILY DAM AGED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGIL E AND EASILY DAMAGED.
Removal an d replacement procedures 60 3. Press and hold the tabs on the processor insta llation tool to separate it from the processor, and then remove the tool.
Removal an d replacement procedures 61 5. Install t he heatsink, and then close the heatsink retaining latches. 6. Install the air b affle. 7. If removed, install the BBWC battery pack or the FBWC capacitor pac k. 8. Install fan 5. 9. Install the access panel.
Removal an d replacement procedures 62 8. Remove the D IMM. To replace th e component, rev erse the remova l procedure. For DIMM config uration information, se e the server user guide. P CIe expansio n board To remove the component: 1. Power down the serv er (on page 27 ).
Removal an d replacement procedures 63 5. Open the expansion board retainer. 6. Remove the expansion bo ard. To replace th e component, rev erse the remova l procedure. HP NC375i adapter To remove the component: 1. Power down the serv er (on page 27 ).
Removal and replacement procedures 64 5. If installed, remove the BBWC battery pack or t he FBWC capacitor pack (" BBWC battery pack or FBWC capaci tor pac k " on page 33 ). 6. Remove the a ir baffle (" Air baffle " on page 34 ). 7.
Removal an d replacement procedures 65 11. Remove the mini - DIMM, if inst alled. 12. Remove the HP N C524SFP Dual Port 10GbE Module (" HP NC524SFP Dual Port 10GbE Mod ule " on page 65 ), if installed. To replace th e component, rev erse the removal procedure.
Removal an d replacement procedures 66 Save the retaining screw. 9. Open the expansion board slot retainer. 10. Remove the HP NC375i adapter (" HP NC375i adapter " on page 63 ) from expansion sl ot 10. 11. Remove the HP NC524SFP modu le from the HP NC375i adapte r.
Removal an d replacement procedures 67 3. Remove the a ccess panel (" Acce ss panel " on page 31 ). 4. Remove fan 5 (" Fan 5 " on page 31 ). 5. If installed, remove the BBWC battery pack or t he FBWC capacitor pack (" BBWC battery pack or FBWC capaci tor pac k " on page 33 ).
Removal an d replacement procedures 68 9. Remove the S ystems Insight Display cables fr om the system bo ard. To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 69 o Open or rem ove the tower bezel, as needed (" Tower bezel " on page 30 ). o Extend the server from the rack (on pag e 28 ). 3. Remove the a ccess panel (" Acce ss panel " on page 31 ). 4. Remove fan 5 (" Fan 5 " on page 31 ).
Removal an d replacement procedures 70 7. Remove the battery. IMPORTANT: Replacing the syst em board batter y resets the system RO M to its default configuration. After replacing the battery, reconfigure the sys tem through RBSU. To replace th e component, rev erse the remova l procedure.
Removal an d repla cement procedures 71 3. Remove the a ccess panel (" Acce ss panel " on page 31 ). 4. Remove all expansion bo ards (" PCIe expansion board " on page 62 ). 5. Remove the HP NC375i adapter (" HP NC375i adapter " on page 63 ).
Removal an d replacement procedures 72 c. Release the tabs, and then carefully lift the processo r and tool straight up. 15. Carefully rotate the tool, and then push in and releas e the tabs to secure the processor in the tool. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contac t area.
Removal an d replacement procedures 73 17. Using the system board tray h andles, slide the tray f orward and remove the fai led system board. To replace the compon ent: 1. Install the spare system board in the server before inst alling the proce ssor.
Removal an d replacement procedures 74 2. Open the pro cessor lockin g lever and the p rocessor socket reta ining bracket. Do not remov e the processor sock et cover . IMPORTANT: Be sure the processor rema ins inside the processor in stallation tool. 3.
Removal an d replacement procedures 75 4. Align the processor installation tool with the socke t, and then install the processor. THE PINS ON TH E SYSTEM BOARD AR E VERY FRAGILE AND E ASILY DAMAGED . CAUTION: THE PINS ON THE SYSTEM B OARD ARE VERY FRAGIL E AND EASILY DAMAGED.
Removal an d replacement procedures 76 5. Press the tabs on the processor ins tallation tool to separate it from the processor, and then re move the tool. 6. Close the pro cessor socket retaining bra cket and the proce ssor locking l ever. The processor sock et cover is automatically ejected .
Removal an d replacement procedures 77 9. Apply all the grease to the top of the processor in the foll owing pattern to ensure even distribution. 10. Install the heatsink. 11. Close the hea tsink locking lev ers. IMPORTANT: Install all components with the s ame configuration that was used on the failed system board.
Removal an d repl acement procedure s 78 19. Power up the server. After you repl ace the system b oard, you must re - enter the server serial number and the product ID. 1. During the ser ver startup se quence, press the F9 key to access RBSU. 2. Select the Advanced Options menu.
Removal an d replacement procedures 79 The cables are not shown for clarity. To replace th e component, rev erse t he removal procedure..
Diagnostic tool s 80 D i agno sti c tools T roubleshooting resources The HP ProLiant Serv ers Troubleshooting Guid e provides procedure s for resolving common prob lems and comprehensiv e courses of a.
Diagnostic tool s 81 Survey functionality is installed with every SmartStart - assisted HP Insight Diagnostics installation, or it can be installed through the HP PSP. NOTE: The current version of SmartSta rt provide s the memory spare part numbers for the server.
Diagnostic tool s 82 U SB support HP provides both stan dard USB 2.0 support and leg acy USB 2.0 support. Standard s upport is provided by the OS through the appr opriate USB devic e drivers. Before the OS loads, HP provides suppo rt for USB devices thro ugh legacy USB support, which is enabled by def ault in the system RO M.
Component ident ification 83 C om ponen t i dentif i cati on F ront panel comp onents Item Description 1 USB connect ors (2) 2 Drive cag e blank 3 SAS/SATA drives (8) 4 Front video conne ctor (rack mo.
Component ident ification 84 F ront panel LEDs and b uttons Item Description Status 1 Power On/Standb y button and system power LED Green = N ormal (system on) Amber = System in standby, but power sti.
Component ident ification 85 S ystems Insight Disp lay LEDs The HP Systems Insight Display LEDs represent the sys tem board layout. Item Description Status 1 Power cap To determine Power cap status, see " Systems Insig ht Display LED combination s (on page 85 ).
Component ident ification 86 Systems Insi ght Display LED and color Health LED System power LED Status Processor (ambe r) Red Amber One or more of the following conditions ma y exist: • Processor in so cket X has failed. • Processor X is not installed in the socket.
Component ident ification 87 R ear panel comp onents Item Description 1 Mouse conne ctor 2 Keyboard co nnector 3 Serial connecto r 4 iLO 2 connector 5 USB connect ors (2) 6 NIC connecto rs (4) 7 PCI e.
Component identi fication 88 R ear panel LEDs Item Description Status 1 UID LED Blue = Activated Flashing blue = System is being managed rem otely. Off = Deacti vated 2 iLO 2 activity L ED Green or fl.
Component ident ification 89 S ystem board c omponents Item Description 1 SD card slot 2 Power backp lane connect or 3 Processor 1 D IMM slots 4 Power supply conne ctor 5 SAS connector B 6 SAS connect.
Component ident ification 90 Item Description 26 Slot 10 PC Ie2 x8 (8, 4, 2, 1) 27 Internal USB connector 28 Processor socket 2 29 Processor 2 DIMM slots 30 Power suppl y connector 31 Processor socket 1 (populated) D IMM slots DIMM slots are num bered sequentially (1 through 9) for each pro cessor.
Component ident ification 91 The memory subsystem may be populated with eithe r RDIMMs or UDIMMs, but mixing the two types is not supporte d. To determine DI MM characte ristics, use the label attached t o the DIMM and the foll owing illustration an d table.
Component ident ification 92 Position Descript ion Function S5 Password protection override Off = No function On = Clears powe r - on password and administ rator password S6 Invalidate configuration Off = Normal On = ROM treats the system configuration a s invalid.
Component ident ification 93 • SFF hard drives • LFF hard drives.
Component ident ification 94 S AS and SA TA hard drive LE Ds Item Description Status 1 Fault/UID LED Amber = Drive failure Flashing ambe r = Fault - process activity Blue = Unit ide ntification is act.
Component ident ification 95 Online/activity LED (green) Fault/UID LED (amber/blue) Interpretat ion Flashing regularly (1 Hz) Off Do not remove the drive. Rem oving a drive may terminate th e current operation and ca use data loss. The drive is re building, or it is part of an a rray that is und ergoing capacity exp ansion or stripe m igration.
Component ident ification 96 B attery pac k LEDs Item Color Description 1 Green System Power LED. This LED i s on when the system is powered up an d 12 V system power is available. Thi s power supply i s used to maintai n the battery charg e and provide suppl ementary power to the cache microcontrol ler.
Component ident ification 97 LED3 pattern LED4 pat tern Interpretation Off Flashing (1 Hz) The battery pack is below the minimum charge level and is being charged. Features that require a battery (such as write cache, capacity expansion, st ripe size migration , and RAID migr ation) are unav ailable temporarily unt il charging is co mplete.
Component ident ification 98 1 Green LED 2 Amber LED Interpretation Off Off The flash code is corrupt. P ower su pply backplan e connectors Connector Descript ion BP1 Drive bay 1 power cable BP2 Drive.
Component ident ification 99 • Six - bay LFF back plane • Eight - bay SFF backpl ane Drive cage Installation Pin setting 1 Standard No jumper 2 Optional 1- 2* 3 Optional 2-3 *Optional driv e cages ship with t he jumper set a cross pins 1 and 2.
Cabling 100 C abling S torage device ca bling guidelines CAUTION: To preve nt damage to the equipme nt, be sure that the se rver is powered down, all cables are discon nected from the back of the server, a nd the power cord is disconn ected from the grounded (ea rthed) AC outl et before install ing devices.
Cabling 101 Item Description 3 SAS connector B 4 DVD - ROM drive 5 Hard drive ca ge 1, SAS co nnector 2 6 Hard drive ca ge 1, SAS co nnector 1 S AS hard drive cabling Item Description 1 Optional SAS c.
Cabling 102 Two- bay LFF drive cage c abling • Two - bay LFF driv e cage cabling to an optional six - bay LFF bac kplane Item Description 1 Drive cag e bay 1 power cable 2 Drive cag e bay 3 power ca.
Cabling 103 Six- bay LFF backplane cabling • Drive cage bay 1 • Drive cage bay 2.
Cabling 104 Eight- bay SFF drive cage cabling • Drive cage bay 1 • Drive cage bay 2.
Cabling 105 • Drive cage bay 3 S AS expander cabling The colors are shown for i llustration purpose s only. Item Description 1 SAS expander c ard, connecto rs C and D.
Cabling 106 Item Description 2 SAS expander c ard, connecto rs E and F 3 SAS expander c ard, connecto rs G and H 4 SAS expander card, connectors A and B 5 System board SAS connectors A and B 6 Hard dr.
Cabling 107 D VD - ROM drive cabling S limline optical drive cabling.
Cabling 108 P ower cabli ng S erver power cab ling (basic configurat ion) Item Description 1 Power suppl y backplane conn ector 2 24 - pin power connector 3 Hard drive c age 1 4 DVD - ROM drive.
Cabling 109 S erver power cab ling (maximum configura tion) The colors are shown for i llustration purpose s only. Item Description 1 Video card, sl ot 6 2 Video card, sl ot 8 3 Power connector 4 Powe.
Cabling 110 H ard drive cage power cabling Item Description 1 24 - pin power con nector 2 Power suppl y backplane conn ector 3 Hard drive bay 1 (must use BP1 power c able) 4 Hard drive bay 2 (must use.
Cabling 111 F ront panel cablin g Item Description 1 Front USB conn ector 2 Front video conne ctor 3 Systems Insight Display connecto r 4 Front panel con nector.
Cabling 112 B BWC batte ry pack and FBW C capacitor pack cabling.
Specifications 113 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping - 40 ° C to 70 ° C ( - 40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.
Specifications 114 Specification Value Input requirements Rated input voltage 100 to 120 VA C, 200 to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input cu rrent 10 A at 100 V AC 4.
Specifications 115 Rated input po wer 526 W at 100V AC input 505 W at 200V AC input BTUs per hour 1794 at 100V A C input 1725 at 200V AC input Power supply output Rated steady - state power 460 W at 1.
Acronyms and abbreviati ons 116 A c r on y ms and abbr e v iati on s AMP Advanced Memory Protec tion BBWC battery - backed write c ache CSR Customer Self Re pair FBWC flash - backed write cache iLO In.
Acronyms and abbreviation s 117 RBSU ROM - Based Setup Utility RDIMM registered dual in - line memory mod ule SAS serial attached SCSI SATA serial ATA SFF small form f actor SIM Systems In sight Manag.
Documentation feedback 118 Doc ument ati on f eedbac k HP is committed to pro viding documentation that mee ts your needs. To help us improve the docume ntation, send any erro rs, suggestion s, or comments to Documentation Feedback ( mailto:docsf eedback@hp.
Index 119 A access panel 31 additional infor mation 80 air baffle 26, 34 B battery 89 battery cablin g for BBWC 112 battery pack LEDs 96 battery pack, remo ving 33 battery - backed write cache (BBWC) .
Index 120 HP Insight Diagnostics survey functionality 80 HP Insight Remote Support softwa re 81 HP NC375i adapter 63 HP NC524SFP Dual Port 1 0GbE Module 65 I I/O bezel 68 illustrated parts catalog 16 .
Index 121 server specifica tions 113 side panels, removi ng 38 six - bay LFF backplane 47, 103 slimline optic al drive 43, 107 Smart Array P410i controller 89 specificati ons 113 specifications, envir.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il HP (Hewlett-Packard) 654080-S01 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del HP (Hewlett-Packard) 654080-S01 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso HP (Hewlett-Packard) 654080-S01 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul HP (Hewlett-Packard) 654080-S01 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il HP (Hewlett-Packard) 654080-S01, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del HP (Hewlett-Packard) 654080-S01.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il HP (Hewlett-Packard) 654080-S01. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo HP (Hewlett-Packard) 654080-S01 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
