Manuale d’uso / di manutenzione del prodotto 1207 del fabbricante AMD
Vai alla pagina of 62
Advanced Micro Devices Thermal Design Guide for Socket F (1207) Processors 32800 Publicat ion # 3.00 Revision: August 200 6 Issue Date:.
© 2005 Advanced Micr o Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products.
Contents 3 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Chapter 1 Introduction .
4 Content s 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.3.5 Fans . . . . . . . . . . . .
List of Figures 5 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 List of Figur es Figure 1. The 1207-Pin Socket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 2.
6 List of Figures 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 26. Socket F (1207) 2U-4P Socket Outline and So cket Window . . . . . . . . . . . . . . . . . . . . . 56 Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restri ction Zone .
List of T ables 7 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 List of T ables Table 1. Mechanical and Thermal Specifications for Socket F (1207) Processors . . . . . . . . . . . . 13 Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors .
8 List of T ables 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Revision History 9 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Revision History Date Revision Descript ion July 2006 3.
10 Revision History 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Chapter 1 Introduction 1 1 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 1 Intr oduction This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, uti lizing AMD 64-bit technology .
12 Introduction Chapter 1 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Chapter 2 Processor Thermal Solutions 13 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Chapter 2 Pr ocessor Thermal Solutions This chapter describes the thermal solutions fo r systems based on socket F (1207) processors.
14 Processor Thermal Solutions Chapter 2 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors 2.2 Socket Description Figure 1 shows a three-dimensional view of th e 1207-pin socket used with socket F (1207) processors. This socket is base d on LGA (land-grid array) technology .
Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 15 Thermal Design Guide for Socket F (1207) Processors 32800 Rev .
16 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 2 on pa ge 15.
Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 17 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 T a ble 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for socket F (1207) processors.
18 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 3. Exploded V iew of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors 3.
Chapter 3 Thermal Design of Platfo rms Using the AMD Processor-In-a- Box (PIB) Thermal Solution 19 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Note: Do not cut entir ely thr ough the center rib. Doin g so will compr omise the stiffness of the backplate.
20 Thermal Design of Platforms Using the AMD Processor-In-a- Box (PIB) Thermal Solution Chapter 3 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Chapter 4 Thermal Design of Custom 1U-2P Systems 21 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Chapter 4 Thermal Design of Custom 1U-2P Systems This chapter .
22 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 4 on pa ge 21.
Chapter 4 Thermal Design of Custom 1U-2P Systems 23 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Figure 5 on page 24 shows an explode d view of the components used in the thermal reference design solution for custom 1U-2P systems ba sed on socket F (1207) processors.
24 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 5. Exploded V iew of Thermal Solution for Custom 1U-2P Systems The following sections describe the mechanical requirements of the components shown in Figure 5.
Chapter 4 Thermal Design of Custom 1U-2P Systems 25 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 Lifting the heat sink away from the processor can re sult in damage to the processor contact pads, the socket contacts, or the socket solder-ball joints .
26 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Other fan and heat sink co mbinations may yield adequate ther mal performance.
Chapter 4 Thermal Design of Custom 1U-2P Systems 27 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 3.00 August 2006 4.3.5 Thermal Interface Material The heat sink contacts the top surface of the processor package and utilizes the thermal interface material between the processor lid and the heat sink.
28 Thermal Design of Custom 1U-2P Systems Chapter 4 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Chapter 5 Thermal Design of Custom 2U-4P Systems 29 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Chapter 5 Thermal Design of Custom 2U-4P Systems This chapter descr.
30 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Depending on the system features and layout, more space around the socket ma y be available for the thermal solution than is shown in Figure 8 on pa ge 29.
Chapter 5 Thermal Design of Custom 2U-4P Systems 31 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 Figure 9 on page 32 shows an explode d view of the components used in the thermal reference design solution for custom 2U-4P systems ba sed on socket F (1207) processors.
32 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 9. Exploded V iew of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors The following sections describe the mechanical requirements of the components shown in Figure 9.
Chapter 5 Thermal Design of Custom 2U-4P Systems 33 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 5.3.2 Spring Clip The spring clip is designed to apply 75 lbs of for ce to the center of the heat sink.
34 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors the center to 2.5 mm at the edges. The heat sink al so has three heat pipes soldered to the base and connected to the top of the fin stack to improve fin ef ficiency .
Chapter 5 Thermal Design of Custom 2U-4P Systems 35 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.02 August 2006 on flow simulations of an AMD reference 2U system, the flow-through of the heat sink is approximately 18 CFM. Figure 1 1 sh ows that this flow rate corres ponds to a case-to-ambient thermal resistance of 0.
36 Thermal Design of Custom 2U-4P Systems Chapter 5 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 37 Thermal Design Guide for Socket F (1207) Processors 32800 Rev .
38 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 12. Socket F (1207) PIB Boar d Component Height Restrictions 7 3 .
Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 39 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 13. Socket F (1207) PIB Mounting Ho les, Contact Pads, and No-Routing Zone x 2 0 5 4 .
40 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 14. Socket F (1207) PIB So cket Outline and Socket Window 0.
Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 41 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone x 2 4 1 .
42 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out 7 9 4 .
Appendix A Keep-Out Drawings for Platforms Us ing the PIB Thermal Solution for Socket F (1207) Processors 43 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out x 2 0 7 5 .
44 Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors Appendix A 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 45 Thermal Design Guide for Socket F (1207) Processors 32800 Rev .
46 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 18. Socket F (1207) 1U-2P B oard Component Height Restrictions 0 0 .
Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 47 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 19. Socket F (1207) 1U-2P Mounting Ho les, Contact Pads, and No-Routing Zone x 2 2 3 .
48 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 20. Socket F (1207) 1U-2P So cket Outline and Socket Window 19.9 1 0.
Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 49 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 21. Socket F (1207) 1U-2P He at Sink Height Restriction Zone 7 2 8 .
50 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out 6 7 5 . 0 3 6 .
Appendix B Keep-Out Drawings for Cu stom 1U-2P Systems Based on the Socket F (1207) Processor 51 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 23. Socket F (1207) 1U -2P Backplate Contact Zone 5. 9 1 2 x 0. 233 0.
52 Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F (1207) Processor Appendix B 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 53 Thermal Design Guide for Socket F (1207) Processors 32800 Rev .
54 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 24. Socket F (1207) 2U-4P B oard Component Height Restrictions 0 0 .
Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 55 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 25. Socket F (1207) 2U-4P Mounting Ho les, Contact Pads, and No-Routing Zone 3 2 .
56 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 26. Socket F (1207) 2U-4P So cket Outline and Socket Window 1 9 .9 1 0 .
Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 57 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 27. Socket F (1207) 2U-4P He at Sink Height Restriction Zone 1.266 0.
58 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out 7 9 4 . 0 3 6 .
Appendix C Keep-Out Drawings for Cu stom 2U-4P Systems Based on the Socket F (1207) Processor 59 Thermal Design Guide for Socket F (1207) Processors 32800 Rev . 3.00 August 2006 Figure 29. Socket F (1207) 2U -4P Backplate Contact Zone 3 2 1 . 0 0.000 0.
60 Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F (1207) Processor Appendix C 32800 Rev . 3.02 August 2006 Thermal Design Guide for Socket F (1207) Processors.
Appendix D Flow Simulation Result s for Custom 2U-4P Systems Based on Socket F (1207) Processors 61 Thermal Design Guide for Socket F (1207) Processors 32800 Rev .
62 Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors Appendix D 32800 Rev . 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors Figure 31.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il AMD 1207 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del AMD 1207 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso AMD 1207 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul AMD 1207 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il AMD 1207, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del AMD 1207.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il AMD 1207. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo AMD 1207 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
