Manuale d’uso / di manutenzione del prodotto CY7C1317CV18 del fabbricante Cypress Semiconductor
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18-Mbit DDR-II SRAM 4-W ord Burst Architecture CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Cypress Semiconductor Corpora tion • 198 Champion Court • San Jose , CA 95134-1709 • 408-943-2600 Document Number: 001-07161 Rev .
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 2 of 31 Logic Block Diagram (CY7C1317CV18) Logic Block Diagram (CY7C1917CV18) Writ e Reg CLK A (18:0) Gen. K K Control Logic Address Register Read Add. Decode Read Data Reg.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 3 of 31 Logic Block Diagram (CY7C1319CV18) Logic Block Diagram (CY7C1321CV18) Writ e Reg CLK A (19:0) Gen. K K Control Logic Address Register Read Add. Decode Read Data Reg.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 4 of 31 Pin Configuration The pin configuration for CY7C1317CV18, CY7C191 7CV18, CY7C1319CV18, and CY7C1321CV18 follo w .
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 5 of 31 CY7C1319CV18 (1M x 18) 123456789 10 11 A CQ NC/72M A R/W BWS 1 K NC/14 4M LD A NC/36M CQ B NC DQ9.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 6 of 31 Pin Definitions Pin Name IO Pin Descripti on DQ [x:0] Input Output- Synchronous Dat a Input Output S ignals . Inputs are sampled on the rising edge of K and K clocks during valid write operations.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 7 of 31 CQ Output Clock CQ Referenced with Respect to C . This is a free running clock and is synchronized to the input clock for output data (C) of the DDR-II.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 8 of 31 Functional Overview The CY7C1317CV18, CY7C1917CV18, CY7C1 319CV18, and CY7C1321CV18 are synchronous pi pelined Burst SRAMs equipped with a DDR interface, which operates with a read latency of one and half cycles when DOFF pin is tied HIGH.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 9 of 31 after the read(s), the st ored data from the ear lier write i s writte n into the SRAM array .
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 10 of 31 Application Example Figure 1 shows two DDR-II used in an applicatio n. Figure 1. Application Example T ruth T able The truth table for the CY7C1317CV18, CY7C1917 CV18, CY7C13 19CV18, and CY7C1321CV18 fo llows.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 1 1 of 31 Burst Address T able (CY7C1319CV18, CY7C1321CV18) First Address ( External) Second Addres s (Internal) Third Address (I nternal) Four th Address (Intern al) X.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 12 of 31 Write Cycle Descriptions The write cycle description t able for CY7C1 321CV18 follows.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 13 of 31 IEEE 1 149.1 Serial Boundary Scan (JT AG) These SRAMs incorporate a serial boundary scan T est Access Port (T AP) in the FBGA p ackage. This part is fully comp liant with IEEE S tandard #1 149.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 14 of 31 IDCODE The IDCODE instruction loads a vendor-specific, 32-bi t code into the instruction re gister .
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 15 of 31 T AP Controller St ate Diag ram The state diagram for the T AP controller follows.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 16 of 31 T AP Controller Block Diagram T AP Electrical Characteristics Over the Operating Range [10, 1 1, 12] Parameter Description T est Conditions Min Max Unit V OH1 Output HIGH V oltage I OH = − 2.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 17 of 31 T AP AC Switching Characteristics Over the Operating Range [13, 14] Parameter Description Min Ma.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 18 of 31 Identification R egi ster Definitions Instruction Field Va l u e Descriptio n CY7C1317CV18 CY7C1917CV18 CY7 C1319CV18 CY7C1321CV18 Revision Numb er (31:29) 000 000 000 000 V ersion numbe r .
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 19 of 31 Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bum p ID 0 6R 28 10G 56 6A 8.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 20 of 31 Power Up Sequence in DDR-II SRAM DDR-II SRAMs must be power ed up and initialized in a predefined manner to prevent unde fined operations. Power Up Sequence ■ Apply power and drive DO FF either HIGH or LOW (all other inputs can be HIGH or LOW).
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 21 of 31 Maximum Ratings Exceeding maximum ratin gs may impair the useful life o f the device. These user guidelines are not teste d. S torage T emperature .
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 22 of 31 I DD [19] V DD Operating Supply V DD = Max, I OUT = 0 mA, f = f MAX = 1/t CYC 200 MHz (x8) 580 m.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 23 of 31 Cap acit ance T ested initially and after any design or process change that may affect these parameters. Parameter Description T est Conditions Max Unit C IN Input Capacitance T A = 25 ° C, f = 1 MHz, V DD = 1.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 24 of 31 Switching Characteristics Over the Operating Range [20, 21] Cypress Parameter Consor tium Parame.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 25 of 31 Output T imes t CO t CHQV C/C Clock Rise (or K/K in single clock mode) to Data V alid – 0.45 – 0.45 – 0.45 – 0.45 – 0.50 ns t DOH t CHQX Data Output Hold af ter Output C/C Clock Rise (Active to Active) –0.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 26 of 31 Switching W aveforms Figure 5. Read/Write/Deselect Sequence [2 7, 28, 29 ] K 1 2 3 4 5 6 7 8 9 1.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 27 of 31 Ordering Information Not all of the speed, package and temperature ranges are ava ilable. Please contact your local sales representative or visit www .
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 28 of 31 250 CY7C1317CV18-2 50BZC 51-85180 1 65-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial CY7C1917CV18-250BZC CY7C1319CV18-250BZC CY7C1321CV18-250BZC CY7C1317CV18-250BZXC 5 1-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 29 of 31 167 CY7C1317CV18-1 67BZC 51-85180 1 65-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Commercial CY7C1917CV18-167BZC CY7C1319CV18-167BZC CY7C1321CV18-167BZC CY7C1317CV18-167BZXC 5 1-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.
CY7C1317CV18, CY7C1917CV18 CY7C1319CV18, CY7C1321CV18 Document Number: 001-07161 Rev . *D Page 30 of 31 Package Diagram Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180 A 1 PIN 1 CORNER 15.00±0.10 13.00±0.10 7.00 1.00 Ø0.50 (165X) Ø 0 . 2 5MCAB Ø0.
Document Number: 001-07161 Rev . *D Revised June 18, 2008 Page 31 of 31 QDR RAMs an d Quad Data Rate RAMs comp rise a new family of product s develope d by Cypress, IDT , NEC, Renesas, and Samsung. All pr oduct and co mpany nam es mentioned i n this documen t are the tr ad emarks of their respe ctive hold ers.
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Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Cypress Semiconductor CY7C1317CV18. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Cypress Semiconductor CY7C1317CV18 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.