Manuale d’uso / di manutenzione del prodotto EM250 del fabbricante Acer
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eMachines eM250 Series Service Guide PRINTED IN T AIW AN Service guide files and updates are availab le on the ACER/CSD web; for more information, please refer to http://csd.
II Revision History Please refer to the table below for the updates ma de to this service guide. Date Chapter Up date s.
III Copyright Copyright © 2009 by Acer Incorporated. All rights rese rved. No part of this pub lication may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into a.
IV Conventions The following conventi ons are used in this manual: SCREEN MESSAGES Denotes actual messages that appe ar on screen. NOTE Gives bits and pieces of additional information related to the current topic. W ARNING Alerts you to any damage that might result from doing or not doing specific actions.
V Preface Before using this information and the product it s upports, please read the fo llowing general info rma tion. 1. This Service Guide provides you with all techni cal information relating to the BASIC CON FIGUR A TION decided for Acer's "glo bal" product offering.
VI.
VII T able of Contents System Specifications 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .
VIII T able of Contents Removing the Mainboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Removing the RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66 Removing the Thermal Module .
IX T able of Contents External Mouse Failure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134 Other Failures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 34 Intermittent Problems .
X T able of Contents.
Chapter 1 1 System Specifications Features Below is a brief summary of the computer ’s many features: Operating System • Genuine Windows® 7 S tarter • Genuine Windows® 7 Home Basi c (China onl.
2 Chapter 1 • 1.18 kg (2.62 lbs.) for SKUs with 3-cell battery pack • 1.33 kg (2.95 lbs.) for SKUs with 6-cell battery pack Communication • Integrated webcam, supporting 0.
Chapter 1 3 System Block Diagram X2 mode Touch Pad CRT Conn LPC BUS page 20 27x27mm ) 3 6 . . 0 ( # D _ H ) 1 3 . . 3 ( # A _ H page 24 page 14 page 21 Int.KBD page 25 400/533MHz ALC272 DMI Diamondville SC FSB Transfermer Power ON/OFF & LED CONN page 25 page 13 FCBGA8 DDRII-SO-DIMM Calistoga GSE FCBGA998 SPI ROM page 4 1.
4 Chapter 1 Your eMachines Notebook tour Front View No. Icon Item Description 1 Webcam Web camera fo r video communication 2 Microphone Internal microphone for sound recording. 3 Display screen Also called Liquid-Crystal Display (LCD), displays computer output.
Chapter 1 5 Closed Front View Left View 9 Click buttons (left and right) The left and right buttons function like the left and right mouse buttons. 10 Wireless LAN/ 3G communication indicato r Indicates the status of Wireless LAN/3G communication. (only for certain models) 1 1 Power button/ indicato r T urns the computer on and off.
6 Chapter 1 Right View Rear and Base View No. Icon Item Description 1 Multi-in-1 card reader Accepts Secure Digital (SD), MultiMediaCard (MMC), Memory S tick (MS), Memory S tick PRO (MS PRO), xD-Picture Card (xD). Note: Push to remove /install the card.
Chapter 1 7 Indicators The computer has several easy-to-read status indica tors. The battery indicato r is visible even when the computer cover is closed. 2 Battery lock Locks the battery in position. 3 V en til ation slots V ents enable the computer to stay cool, even after prolonged use.
8 Chapter 1 TouchPad Basics The following items show you how to use the T ouchPa d: • Move your finger across the T ouchPad (1) to move th e cursor . • Press the left (2) and right (3) buttons located beneath the T ouchPad to perform selection and execution functions.
Chapter 1 9 Using the Keyboard Y our eMachines eM250 has a cl ose-to-full-sized keyboard and an embedded numeric keypad, separate cursor , lo ck, fu nction and special keys. Lock Keys and embedded numeric keypad The keyboard has three lock keys which yo u can to ggle on and off.
10 Chapter 1 Windows Keys The keyboard has two keys that perform Wi ndow s-specific functions. Key Description Windows key Pressed alone, this key ha s the same effect as clicking on the Windows St art button; it launches the S tart menu.
Chapter 1 11 Hot Keys The computer employs hotkeys or key combinations to access most of the computer 's controls like screen brightness and volu me output. T o activate hotkeys, press and hold the <Fn> key before pressing the other key in the hotkey combi nation.
12 Chapter 1 Special Keys Y ou can locate the Euro symbol and the US dollar si gn at the upper-center an d/or bottom-right of your keyboard. The Euro symbol 1. Open a text editor or word processor. 2. Hold <Alt Gr> and the n press the <5> key at the upper-center o f the keyboard .
Chapter 1 13 Hardware Specifications and Configurations Processor Processor Specifications CPU Fan T rue V alue T able • Throttling 50%: On = 85°C; OF F=75°C • EC shut down at 90°C; H/W shut down(PH1) at 92°C Item Specification CPU type Intel Atom N270/N280, 1.
14 Chapter 1 System Memory System Storage Hard Disk Drive Interface Item Specification Memory controller Built in Memory size 512MB or 1GB DDR2 RAM (if 2Gb die support is available) DIMM socket number.
Chapter 1 15 Hard Disk Drive Interface (cont.) BIOS LED 10.1” Item Specification V endo r & Model Name T oshiba MK1652GSX T oshiba MK1655GSX Capacity (GB) 160 160 Bytes per sector 512 Data heads.
16 Chapter 1 Audio Codec and Ampli f ie r LAN Interface Keyboard Pixel Pitch (mm) 0.2175 T ypical White Luminance (cd/m 2 ) also called Brightness 200 Contrast Ratio 500:1 Response T ime (Optical Rise T ime/Fall T ime) msec 10 T ypi ca l Power Consumption (watt) 2.
Chapter 1 17 Mini Card Camera 3G Card Wireless LAN Battery Internal & external keyboard work simultaneously Plug USB keyboard to the USB port directly: Y es Features • 2.
18 Chapter 1.
Chapter 2 19 System Utilities BIOS Setup Utility The BIOS Setup Utility is a hardware configuration prog ram built into y our computer ’s BIOS (Basic Input/ Output System). Y our computer is alre ady properly configured and optimi zed, and you do not need to run this utility .
20 Chapter 2 Information The Information screen displays a summary of your computer ha rdware information. NOTE: The system information is su bject to diff erent models. Parameter Description CPU T ype This field shows the CP U type and spee d of the system.
Chapter 2 21 Main The Main screen allows th e user to set the system time and date as well as enable and disable bo ot option and recovery . NOTE: The screen above is for your reference only . Actual values may differ . The table below describes the parameters in this screen.
22 Chapter 2 Security The Security screen co ntains parameters that help sa feguard and protect your co mputer from unautho ri zed use. The table below describes the parameters in this screen. Settings in boldface are the default and suggested parameter settings.
Chapter 2 23 Setting a Password Follow these steps as you set the user or the supervisor password: 1. Use the ↑ and ↓ keys to highlight the Set Supe rvisor Password parameter and press the Enter key . The Set Supervisor Password box appears: 2. T ype a password in the “Ente r New Password” field.
24 Chapter 2 Changing a Password 1. Use the ↑ and ↓ keys to highlight the Set Supe rvisor Password parameter and press the Enter key . The Set Password box appears. 2. T ype the current passw or d in the Enter Curr en t Pa ssw or d field and press Enter .
Chapter 2 25 Boot This menu allows the user to deci de the order of boot devices to l oad the operating syste m. Bootable devices includes the USB diskette drives, the onboard hard disk dr ive and the DVD drive in the module bay .
26 Chapter 2 Exit The Exit screen allows you to save or discard any changes you made an d qui t th e BIOS Utility . The table below describes the parameters in this screen. Parameter Description Exit Saving Changes Exit System Setu p and save your changes to CMOS.
Chapter 2 27 BIOS Flash Utility The BIOS flash memory upd ate is required for th e following con ditions: • New versions of system programs • New features or options • Restore a BIOS when it becomes corrupted. Use the Phlash util ity to update the system BIOS flash ROM.
28 Chapter 2 DOS Flash Utility Perform the following steps to use the DOS Flash Utility: 1. Press F2 during boot to enter the Setup Menu. 2. Select Boot Menu to modify the boot priority order , for example, if using USB HDD to Update BIOS, move USB HDD to position 1.
Chapter 2 29 NOTE: If the AC power is n ot connected, the following message displays. Plug in the AC po wer to continue. 5. Flash is complete when the message Fl ash programming complete displays.
30 Chapter 2 WinFlash Utility Perform the following steps to use the WinFlash Utility: 1. Double click the WinFlash executable. 2. Click OK to begin the update. A progress screen displays. 3. When the process is complete, close all programs and applicat ions and reboot the system.
Chapter 2 31 Remove HDD/BIOS Password Utilities This section provide s you with details abo ut removing HDD/BIOS password methods: Removing HDD Password: If you key in the wrong HDD password three times, an error is gen erated. T o reset the HDD p assword, perform the following step s: 1.
32 Chapter 2 Removing BIOS Passw or ds: T o clear the User or Supervisor passwords, open the 3G bay door and use a metal instrument to short the RTC_RST jumper as shown below . Cleaning BIOS Passwords T o clean the User or Supervisor passwords, perform the following steps: 1.
Chapter 2 33 Miscellaneous Utilities Using Boot Sequence Selector Boot Sequence Selector allows the boot order to be changes without accessing the BIOS. T o use Boot Sequence Selector , perform the following steps: 1. Enter into DOS. 2. Execute BS.exe to display the usage screen.
34 Chapter 2 Example 1: Read DMI In formation from Memory Input: dmitools /r Output: Manufacturer (T ype1, Offset04h): Acer Product Name (T ype1, Offset05h): eMachines eM250 xxxxx Serial Number (T ype.
Chapter 2 35 3. Execute MAC.BA T to write MAC informa tion to eeprom..
36 Chapter 2.
Chapter 3 37 Machine Disassembly and Replacement This chapter contains step-by-s tep procedures on how to disass emble the notebook computer for maintenance and troubleshooting .
38 Chapter 3 General Information Pre-disassembly Instructions Before proceeding with the disassembly procedure, make su re that you do the following: 1. T urn off the power to the system and all peripherals. 2. Unplug the AC adapter and all power and signal cab les from the system.
Chapter 3 39 External Module Disassembly Process NOTE: The product previews seen in the disassembly proce dures may not represent the final product color or configuration. External Modules Disassembly Flowchart NOTE: Items enclosed with broken lines (— - - —) are optional and may not be present.
40 Chapter 3 Removing the Battery Pack 1. T urn the computer over . 2. Slide the battery lock/unlock l atch to the unlock p osition. 3. Slide and hold the batte ry release latch to the rele ase posi tion (1), then slid e out the battery pack from the main unit (2).
Chapter 3 41 Removing the Lower Covers 1. See “Removing the Battery Pack” on page 40. 2. Remove the four from the HDD, Memory , and 3G Covers. 3. Lift the HDD cover up to remove.
42 Chapter 3 4. Lift the Memory cover up to remove. 5. Lift the 3G cover up to remove..
Chapter 3 43 Removing the Hard Disk Drive Module 1. See “Removing the Lower Covers” on page 41. 2. Remove the single screw securing the HDD Module in place. 3. Slide the HDD in the direction of the arrow to disconn ect the HDD from t he interface connector.
44 Chapter 3 4. Lift the hard disk dr ive module out of the bay . NOTE: T o prevent damage to device, avoid pressing down on it or placing heavy objects on top of it. 5. Remove the four screws (two each side) securing the hard disk to the carrier . 6.
Chapter 3 45 Removing the DIMM Module 1. See “Removing the Lower Covers” on page 41. 2. Push out the release latches on both sides of the DIMM socket to release th e DIMM module.
46 Chapter 3 Removing the 3G Module IMPORT ANT : 3G functionality is not supporte d by all model s. 1. See “Removing the Lower Covers” on page 41. 2. Disconnect the 3G Antenna cables from the 3G Module. IMPORT ANT : The Blue cable attaches to the MAIN terminal and the Y ellow cable attaches to the AUX terminal.
Chapter 3 47 4. Detach the 3G Module from the socket. NOTE: When reattaching the antennas, ensure th e cables are tucked into the chassis to prevent dama ge.
48 Chapter 3 Main Unit Disassembly Process IMPORT ANT : Cable paths and positioning may not represen t the actual model. During the removal and replacement of components, ensure all a vailable cabl e channels and clips are used and that the cables are replaced in the same position.
Chapter 3 49 Removing the Keyboard 1. See “Removing the Battery Pack” on page 40. 2. T urn the computer rightside up and open the lid to the full extent. 3. Unlock the single secu ring latch above the F8 key by pressing down with plastic tweezers.
50 Chapter 3 6. Disconnect the FFC and remove the Keyboard ..
Chapter 3 51 Removing the Upper Cover 1. See “Removing the Keyboard ” on page 49. 2. T urn the computer over . Remo ve the eleven securing screws. 3.
52 Chapter 3 Release the locking latch on A as shown. Disconnect A from the Mainboard. Release the locking latch on B as shown. Disconnect B from the Mainboard.
Chapter 3 53 4. Remove the five securing screws from the Upper Cover . CAUTION: Cables are place d inside the Hinge Cover Caps. When disassemblin g the panel or covers, take care to dislodge the cables from the base to prevent damage. 5. Remove the Hinge Covers as shown.
54 Chapter 3 7. Lift the left side of the Upper Cover away from the Lower Cover . 8. Lift the Upper Cover clear of the Lower Cover ..
Chapter 3 55 Removing the Power Board 1. See “Removing the Upper Cove r” on page 51. 2. Lift the Power Board FFC to detach the adhesive securing it in place. 3. T urn the Upper Cover over and remove the single screw securing the Power Board in place.
56 Chapter 3 4. Slide the Power Board to the right to disengag e the locating pin. 5. Lift the mylar sheet away from the Upper Cover to allow the Power Board FFC to pass through the cover .
Chapter 3 57 Removing the Bluetooth Module 1. See “Removing the Upper Cove r” on page 51. 2. Remove the Bluetooth Module cable from the cable channel. Ensure that the cable is free from all cable clips. 3. Lift the Bluetooth Module, left side first, to remove it from the Upper Cover .
58 Chapter 3 Removing the TouchPad FFC IMPORT ANT : The T ouchPad Board cann ot be remo ved individua lly . T o replace the T ouchPad Board, repla ce the entire Upper Cover . 1. See “Removing the Upper Cove r” on page 51. 2. Hold the mylar sheet in place and lift the FFC away from the Upper Cover .
Chapter 3 59 Removing the WLAN Board 1. See “Removing the Upper Cove r” on page 51. 2. Disconnect the Antenna cabl es from the WLAN Board. NOTE: Cable placement is Black to the MAIN terminal (left) and W hite to the AUX te rminal (right). 3. Remove the single screw securing the WLAN Board in place.
60 Chapter 3 4. Remove the WLAN Board from the Mainboard..
Chapter 3 61 Removing the USB Board 1. See “Removing the Upper Cove r” on page 51. 2. Remove the single screw securing the USB Board to the Lower Cover .
62 Chapter 3 4. T urn the board over to expose the cable connector . Detach the adhesive strip holding the cable in place. 5. Disconnect the cable from the USB Board.
Chapter 3 63 Removing the Mainboard 1. See “Removing the USB Board” on page 61. 2. Disconnect the L VDS, AC, and S p eaker cables from the Mainboard. 3. Disconnect the L VDS cable and remove the cable from the cable chann el. 4. Disconnect the AC cable as shown.
64 Chapter 3 5. Hold the adhesive strip in place on the Mainboard and remove the AC cable as shown . 6. Disconnect the S peaker cable as shown. 7. Remove the single screw securing the Mainboard to the Lower Cover .
Chapter 3 65 8. Lift the Mainboard right side first and remove it from the Lower Cover . 9. T urn the Mainboard CPU side up, and place it on a clea n surfa ce. Detach the adhesive strip holding the USB Board cable in place. 10. Disconnect the USB Board cable as shown.
66 Chapter 3 Removing the RTC Battery IMPORT ANT : Follow local regulations for disposal of all batteries. 1. See “Removing the Mainboard” on page 63. 2. The RTC Battery is soldered to the Mainboard. T o replace the battery , solder the new battery to the connections shown.
Chapter 3 67 Removing the Thermal Module 1. See “Removing the Mainboard” on page 63. 2. Disconnect the Fan cable from the Mainboard. 3. Remove the four securing screws from the The rmal Module in numerical order from 4 to 1.
68 Chapter 3 4. Lift the Thermal Module clear of the Mainboard..
Chapter 3 69 Removing the Speaker Module 1. See “Removing the Mainboard” on page 63. 2. Remove the two securing scr ews (one for each S peaker). 3.
70 Chapter 3 4. Remove the S peaker cable from the cable channel. Ensu re th at the cable is free from all cable clips. 5. Lift the right S peaker out of the Lower Cover , rear edge first as sho wn. 6. Lift the S peaker Module clear of the Low er Cover .
Chapter 3 71 Removing the LCD Module IMPORT ANT : Cable paths and positioning may not represen t the actual model. During the removal and replacement of the LCD Module, ensure all available cabl e cha nnels and clips are used a nd that the cables are replaced in the same position.
72 Chapter 3 4. Remove the adhesive strips securing the yellow 3G cable in place. 5. Remove the cable from the cable clips. 6. Remove the blue 3G cable from the cable clips as shown.
Chapter 3 73 7. Remove the two securing scr ews from the LCD b rackets. IMPORT ANT : Ensure all cables are clear of the lo wer cover before removing the LC D module.
74 Chapter 3 Removing the AC Power Jack 1. See “Removing the Mainboard” on page 63. 2. The AC Power ca ble runs as shown a long the Lower Cove r . 3. Remove the AC Power cable from the cable channel. Ensure tha t the cable i s free from all cable clips.
Chapter 3 75 LCD Module Disassembly Process IMPORT ANT : Cable paths and positioning may not represen t the actual model. During the removal and replacement of components, ensure all a vailable cabl e channels and clips are used and that the cables are replaced in the same position.
76 Chapter 3 Removing the LCD Bezel 1. See “Removing the LCD Module” on page 71. 2. Remove the four screw caps and screws from the LCD Bezel. NOTE: The two center screw caps at the t op of the bezel are for protection only . 3. S t arting from the inside right edge, pry the b ezel away from the panel.
Chapter 3 77 4. Work down the lef t side as shown, then pr y apart the bottom edge to remove the bezel. 5. Lift up the bezel and remove it from the LCD Module.
78 Chapter 3 Removing the Camera Board 1. See “Removing the LCD Bezel” on page 76. 2. Disconnect the cable from the Camera Board as shown. 3. Remove the Camera Board from the LCD Module.
Chapter 3 79 Removing the LCD Panel 1. See “Removing the Camera Board” on page 78. 2. Remove the two securing screws from the LCD Panel. 3. Remove the L VDS cable from the cable channel in the bracket. 4. Lift the panel as shown to expose the L VDS and Mi crophone cables.
80 Chapter 3 5. Remove the Microphone cable from the cable chann el as s hown . Ensure that the cable is free from all cable clips. 6. Lift the Microphone Module upward to detach the adhesive holding it in place. 7. Remove the LCD Panel from the LCD Module.
Chapter 3 81 Removing the LCD Brackets and FPC Cable 1. See “Removing the LCD Panel” on page 79. 2. T urn the LCD panel over on a clean surface. Carefully lift the adhesive tape securing the cable connector to the LCD Panel. 3. Hold the adhesive tape clear of the LCD Pa nel an d disconn ect the LCD cable as shown.
82 Chapter 3 5. Remove the two screws securing the Hinge Covers to the brackets. NOTE: The LCD Brackets are not identical. Ensure that the correct bracket is us ed during reassembly . 6. Remove the Hinge Covers from the left and right brackets as shown.
Chapter 3 83 Removing the Antennas IMPORT ANT : The LCD Module configuration di ffers depending on sup ported functions. Only the 3G model is disassembled in this procedure, though the metho d is the same.
84 Chapter 3 1. See “Removing the LCD Panel” on page 79. 2. Lift all the adhesive strips securing the yellow 3G Ant enna cable in place and remove the cable from th e cable channel. 3. Carefully pry up the Antenna pad, as shown, and remove the pad from the LCD Module.
Chapter 3 85 5. Carefully pry up the Antenna pad, as shown, and remove the pad from the LCD Module. IMPORT ANT : A strong adhesive is used to secure the Antenna pad in place.
86 Chapter 3 LCD Module Reassembly Procedure Replacing the Antennas 1. Remove the protective cove ring on the Antenna pads. Pl ace the WLAN Antenna pads in the LCD Module and press down to secu re the adhesive in place . 2. Run the cables along the edges of the LCD Module using all the available adh esive securing strips.
Chapter 3 87 4. Run the cables along the edges of the LCD Module using all the availab le adh esive securing strips. 5. Remove the protective cove ring on the Auxili ary 3G Antenna pad. Place the pad in the LCD Modul e and press down to secure the adhe sive in place.
88 Chapter 3 NOTE: The LCD Module appears as shown when the Anten nas are repl aced correctly . 3G and WLAN Models WLAN Only Models.
Chapter 3 89 Replacing the LCD Cable and Brackets NOTE: If the LCD Brackets were replaced, ensure that the rubber cable connectors ar e removed from the faulty bracket s and inst alled on th e re pl a c em ents . 1. Replace the Hinge Covers on the left and right LCD Brackets.
90 Chapter 3 2. Replace the two screws securing the Hinge Covers to the brackets. NOTE: The LCD Brackets are not identical. Ensure that the correct bracket is used during reassembly . 3. replace the four screws (two each side) se curing the LCD Brackets to the LCD Panel.
Chapter 3 91 IMPORT ANT : Ensure that the LCD Cable runs as shown to avoid trapping when the Bezel is replaced..
92 Chapter 3 Replacing the LCD Panel 1. Place the Microphone Module in to the LCD Module and pr ess down to secure the adhesive holdi ng it in place. 2. Run the Microphone cab le down the side of the LC D Module as shown, using all available adhesive and cable clips.
Chapter 3 93 Replacing the Camera Board 4. Ensure the cables and Antennas pass through the hi nge wells as sh own. 5. Replace the two securing screws. 1. Align the locating slots on the Camera Module wi th the locati ng pins on the L CD Module. 2. Place the Camera Module in the LCD Modul e and press down to secure it in place.
94 Chapter 3 3. Connect the Camera cable as shown..
Chapter 3 95 Replacing the LCD Bezel 1. Replace the bezel bottom edge first as shown. Ensure that the cable s are not trapped between the bezel and LCD Module and pass through the hinge wells. 2. Press down around the edges of the bezel unt il there are no gaps between the covers.
96 Chapter 3 Main Module Reassembly Procedure Replacing the AC Power Jack 1. Place the AC Power Jack in the Lower Cover as shown. Press down to secure it in place. 2. Place the cable bundle in to the Lower Cover , ensuring that the bundle is held in place unde r the securing clip.
Chapter 3 97 Replacing the LCD Module 1. Place the LCD Modul e on the Lo wer Cover a nd secure it in place wit h the four scr ews. 2. Run the blue 3G cable along the cable channel as shown using all available cable clips.
98 Chapter 3 3. Run the cable as shown in to the 3G b ay using all avail able cable clips. 4. Run the yellow 3G cable along the cable channel as shown using al l available cable clips. 5. Run the cable as shown in to the 3G b ay and secure it in place with adhesive strips.
Chapter 3 99 6. Run the WLAN Antennas o ver the yellow 3G Antenna, using the same cable channel and clips. 7. The Lower Cover appears as follows when all th e LCD cabl es and Antennas are correctly placed.
100 Chapter 3 Replacing the Speaker Module 1. Replace the right S peaker in the Lower Cover bottom edge first to engage the securing clip . 2. Run the speaker cabl e behind the screw column and al ong the front edge of the Lower Cover as shown. Ensure that the cable is secure d using all the available cable clips.
Chapter 3 101 Replacing the Thermal Module IMPORT ANT : Ensure all heat pads are in place before replacin g the Thermal Mo dule . The following thermal pads are approved for use: • Eapus XR-PE 4. Replace the two securing screws (one in each S peaker).
102 Chapter 3 Replacing the Mainboard 1. Connect the USB Board cable to the Mainbo ard. 2. Replace the adhesive to secure the cable in place. 3. T urn the Mainboard over and i nsert it into the Low er Cover left side first to ensure the I/O ports p ass through the casing.
Chapter 3 103 7. Run the L VDS cab le along the cable channel as shown. 8. Connect the L VDS cable to the Ma inboard..
104 Chapter 3 Replacing the USB Board 1. Connect the USB cable to the connector on th e underside of the USB Board. 2. Replace the adhesi ve securing the USB cable in place. 3. T urn the USB Board over and insert it in to the Lower Cover , right side first.
Chapter 3 105 Replacing the WLAN Board 4. Lower the USB Board in to the Lower Cover and replace the single securin g screw . 1. Insert the WLAN Board in to the Mainboard socket, 2. Replace the single securing screw . 3. Connect the WLAN Antennas to the WLAN Board terminals.
106 Chapter 3 Replacing the TouchPad FFC Replacing the Bluetooth Module 1. Insert the FFC in to the T ouchPad connector . 2. Close the locking latch to secure the FFC in place. 3. Press the FFC down on the Upper Cover to secure it in place. 1. Connect the Bluetooth cabl e to the Blueto oth Module.
Chapter 3 107 3. Press the Bluetooth Module down to secure it in place. NOTE: The Bluetooth Module is held in place by a single screw (M2*3) on some models.
108 Chapter 3 Replacing the Power Board 1. Insert the Power Board FFC under the mylar cover as shown. 2. Pull the FFC through the Upper Cover u ntil none of the FF C is visible from the underside. 3. Place the Power Board in the Up per Cover and slide it to the left to engage the securing clips.
Chapter 3 109 5. T urn the cover over and run the FFC along the Upper Cover and press down to secure the adhe sive in pla ce..
11 0 Chapter 3 Replacing the Upper Cover 1. Place the Upper Cover on the Lower Cover rear edge first as shown. 2. Press down the Upper Co ver at either side to snap it in to place. 3. Continue pressing down both sides o f the Upper Cover and along the bottom edge to snap the covers to gether .
Chapter 3 111 5. Replace the five securin g screws in the Upper Cover . 6. Reconnect the fo llowing cables to the Mainboard. Connect A to the Mainboard.
11 2 Chapter 3 Connect B to the Mainboard. Secure the locking latch on B as shown. Connect C as shown. 7. T urn the computer over and replace the eleven securi ng screws as shown. NOTE: Ensure the correct screw type is used for each hole: M2*3 (red call o ut ), M2 *4 (green callout), and M2*12 (blue callout).
Chapter 3 11 3 Replacing the Keyboard Replacing the 3G Module 1. T urn the computer over . Insert the Keyboa rd FFC in to the Mainboard connecto r . 2. Close the FFC locking latch as shown. 3. T urn the Keyboard over and slide it in the direction of the arrow .
11 4 Chapter 3 3. Connect the two Antenna cables to the 3G Module. IMPORT ANT : The Blue cable attaches to the MAIN terminal and the Y ellow cable attaches to the AUX terminal.
Chapter 3 11 5 Replacing the DIMM Module Replacing the Hard Disk Drive Module 1. Insert the DIMM Module in to the DIMM slot. 2. Press the modul e down to complete the installation. 1. Insert the HDD in to the HDD Carrier and secure t he Carrier to the HDD by replacing the fo ur screw s.
11 6 Chapter 3 4. Replace the single screw to secure the HDD in place ..
Chapter 3 11 7 Replacing the Lower Covers 1. Replace the 3G Cover and press down around th e perimeter to snap it in to place. 2. Replace the Memory Cover and press down around the perimeter to snap it in to place. 3. Replace the HDD Co ver and press down ar ound the perimeter to snap i t in to place.
11 8 Chapter 3 Replacing the Battery Pack 1. Slide and hold the battery release latch to the release position (1), then inse rt the battery pack in to the main unit (2).
Chapter 4 11 9 Troubleshooting Common Problems Use the following procedure as a gui de for computer problems. NOTE: The diagnosti c tests are intended to test only Acer products. Non-Acer products, prototype cards, or modified options can give false e rrors and invalid system responses.
120 Chapter 4 Power On Issue If the system doesn’t power on, perform the following acti ons one at a time to correct the problem. Do not replace non-defective FRUs: Computer Shuts down Intermittently If the system powers off at intervals, perform the fo llow ing actions one at a time to correct the problem.
Chapter 4 121 No Display Issue If the Displa y doesn’t work, perform the follo wing actions one at a time to correct the problem. Do not replace non-defective FRUs: No POST or Video If the POST or video doesn’t display , perform the foll owing actions one at a time to correct the problem.
122 Chapter 4 Abnormal Video Display If video displays abnormally , perform the following actions one at a time to correct the proble m. 1. Reboot the computer . 2. If permanent vertical/h orizontal lines or dark spots display in the same location, the LCD is faulty and should be replaced.
Chapter 4 123 LCD Failure If the LCD fails, perform the following actions one at a ti me to correct the problem. Do not replace non- defective FRUs: Built-In Keyboard Failure If the built-in Keyboard fails, perform the foll owing actions one at a ti me to correct the pro blem.
124 Chapter 4 TouchPad Failure If the To u c h P a d doesn’t work, perform the following actions one at a time to correct the problem. Do not replace non-defective FRUs: St ar t Check M / B T/ P FFC.
Chapter 4 125 Internal Speaker Failure If the internal Speakers fail, perform the following actions one at a time to correct the probl em. Do not replace non-defective FRUs: Sound Problems If sound problems are experienced, p erform the following actions one at a time to correct the problem.
126 Chapter 4 8. Remove and recently installed hardware or software. 9. Restore system and file settings from a k nown good date using System Restor e . If the issue is not fixed, repeat the prec eding steps and select an earl ier time and date. 10. Reinstall the Operating System.
Chapter 4 127 Internal Microphone Failure If the internal Microphone fails, perform the following actions one at a time to correct the problem. Do not replace non-defective FRUs: Microphone Problems If internal or external Mic rophones do no op erate correctl y , perform the following actions one at a time to correct the problem.
128 Chapter 4 HDD Not Operating Correctly If the HDD does not op erate correctly , perform the following ac ti ons one at a time to correct the problem. 1. Disconnect all external devices. 2. Run a complete virus scan using up-to-date software to ensure the computer is virus free.
Chapter 4 129 USB Failure (Rightside) If the rightside USB port fails, perform the following actio ns one at a time to correct the problem. Do not replace non-defective FRUs: St ar t C h e c k IO/B to.
130 Chapter 4 Wireless Function Test Failure If the wireless function test fails, perform the fo llow i ng actions one at a time to correct th e problem.
Chapter 4 131 3G Function Test Failure If the 3G function test fails, perform the following acti on s one at a time to correct the problem. Do not repl ace non-defective FRUs: St art Check 3G a n te n.
132 Chapter 4 Switch Failure If the switches fail, perfo rm the following actions one at a time to correct the problem. Do not replace no n- defective FRUs: St ar t C h e c k IO/B t o M/ B FFC Re- ass.
Chapter 4 133 Thermal Units Failure If the thermal units fail, perform the fo llowing actions one at a time to correct the problem. Do not replace non- defective FRUs: Power Button Failure If the Power Button fails, perform th e fo llowing actions one at a time to correct th e problem.
134 Chapter 4 External Mouse Failure If an external Mouse fails, perform the following actions one at a time to correc t th e problem. 1. T ry an alternative mouse. 2. If the mouse uses a wireless connection, i nsert new batteries and confirm there is a good co nnection.
Chapter 4 135 Intermittent Problems Intermittent system hang problems can be caused by a variety of reasons th at have nothin g to do with a hardware defect, such as: cosmic radiation, electros tatic discharge, or software errors. FRU replacement should be considered only when a recurring prob lem exists.
136 Chapter 4 Motherboard CMOS Discharge If any problems such as incorrect CMOS settings, the CMOS data can be cleared by short-ci rcuiting the CMOS J6 jumpers. Open the 3G bay door and short-circuit the jumpers near the 3G conne ctor , using a metal conductivity tool.
Chapter 4 137 POST Code Reference Tables These tables describe the POST codes and components of the POST process. Sec: NO_EVICTION_MODE_DEBUG EQU 1 (Comm onPlatformsecIa32SecCore.
138 Chapter 4 BDS & Specific action: 0x27 Enable DRAM Channel I/O Buffers 0x28 Enable all clocks on populated rows 0x29 Perform JEDEC memory init ialization for al l memo ry rows 0x30 Perform step.
Chapter 4 139 Each PEIM entry point used in 80_PORT Each Driver entry point used in 80_PORT Code Description 0x00 0x01 PEI_EVENT_LOG 0xA1 PEI_OEM_SER VICE 0xA2 PEI_SIO_INIT 0xA3 PEI_MONO_ST A TUS_CODE.
140 Chapter 4 0xC4 SECURITY_STUB 0xC5 DXE_CPU_IO 0xC6 CF9_RESET 0xC7 PC_RTC 0xC8 ST A TUS_CODE 0xC9 V ARIABLE EMU_V ARIABLE 0xD9 DXE_CHIPSET_INIT 0x45 DXE_ALERT_FORMA T 0xD6 PCI_HOST_BRIDGE 0xD7 PCI_E.
Chapter 4 141 0x72 MONITER_KEY 0x73 LEGACY_BIOS 0x75 LEGACY_BIOS_PLA TFORM 0x76 PCI_PLA TFORM 0x6C ISA_FLOOPY 0x6D PS2_MOUSE 0x6E USB_BOT 0x6F USB_CBI0 0x74 USB_MOUSE 0xF A SETUP_UTIL ITY 0x90 FW_BLOC.
142 Chapter 4 Each SmmDriver entry point used in 80_PORT Code Description 0xD4 SMM_ACCESS 0xDE SMM_CONTROL 0xCC SMM_BASE 0xD2 SMM_RUNTIME 0xDF SB_SMM_DISP A TCH 0xD0 SMM_THUNK 0xCA SMM_ACPI_SW_CHILD 0.
Chapter 5 143 Jumper and Connector Locations Top View Item Description Item Descrip tion JP2 T o PWR/B conn ector SW2 Left button JP12 Internal keyboard connector SW3 Right button JP20 S pe aker conne.
144 Chapter 5 Bottom View Item Description Ite m Description JDIM1 DDR2 Socket JMINI2 MINI card (3G) socket JMINI1 MINI card (wireless) socket JP13 Fan connector JCRT1 CRT connector JP5 SIM card conn .
Chapter 5 145 Power board Item Description SW1 Power button LED1 Power LED.
146 Chapter 5 Card reader board Item Description Item Description JUSB1 External USB connector JP2 T o M/B connector JUSB2 External USB connector SW1 3G/WLAN switch JREAD1 Card reader connector LED2 3.
Chapter 5 147 Clearing Password Check and BIOS Recovery This section provide you the standard operating proce dures of clearing password and BIOS recovery for eMachines eM250. eMachines eM250 p rovides one Hard ware Open Gap on main board for clearing password check, and one Hotke y for enabling BIOS Reco very .
148 Chapter 5 BIOS Recovery by Crisis Disk BIOS Recovery Boot Block: BIOS Recovery Boot Block is a spec ial block of BIOS. It is used to boot up the system with minimum BIOS initialization. Users can enable this feature to restore the BIOS firmware to a successful one once the previous BIOS flashing process failed.
Chapter 6 149 FRU (Field Replaceable Unit) List This chapter gives you the FRU (Field R eplaceable Unit) listing in global configurat ions of eMachines eM250. Refer to this chapter whenever ordering for parts to repair or for RMA (Return Merchandise Authorization).
150 Chapter 6 eMachines eM250 Exploded Diagrams Main Assembly Item Description Pa rt Number 1 Left Hinge Cover 42.S6802.002 2 Uppe r Cover 60.N9702.001 3 Mainboard MB.S7206.001 4 CPU Fan 60.S6802.006 5 The rmal Module 6 WLAN Ca rd NI.23600.048 7 Lowe r Cover 60.
Chapter 6 151 Rear Assembly Item Description Pa rt Number 1 Memory Do or 42.S6802.003 2 3G Do or 42.S6802.005 3 HDD Door 42.S6802.004 4 Lowe r Cover 60.
152 Chapter 6 Upper Cover Assembly Item Description Pa rt Number 1 T ouchPa d FFC 50.S6802.002 2 Uppe r Cover 60.N9702.001 3 Power Board 55.S6802.001 1 2 3.
Chapter 6 153 Lower Cover Assembly Item Description Part Number 1 Speaker Module 23.S6802.001 2 Lower C over 60.S6902.001 3 AC Power Jack and Cable 50.
154 Chapter 6 LCD Assembly Item Description Pa rt Number 1 LCD Bezel 60.N9702.004 2 LCD Pane l LK.10105.001 3 Camera Modu le 57.S6802.001 4 L VDS a nd Microphone Cable 50.S6702.001 5 Left LCD Bracket 60.S6802.005 6 Auxili ary 3G Antenna 50.S7202.002 7 Main 3G Anten na 50.
Chapter 6 155 eMachines eM250 FRU List CA TEGOR Y AcerPN Acer Description Adapter AP .03001.001 Adapter DEL T A 30W 19V 1.7x5.5x1 1 Black ADP-30JH BA LF AP .03003.001 Adapter LITE-ON 30W 1 9V 1.7x5.5x1 1 Black P A-1300- 04AC LF AP .0300A.001 Adap ter HIPRO 30W 19V 1.
156 Chapter 6 55.S6802.002 IO BOARD NI.23600.048 Foxconn Wireless LAN Atheros HB63 BG (HM) NI.23600.053 Foxconn Wireless LAN Broadcom 4312H BG (HM) NI.23600.047 Foxconn Wirelss LAN Atheros HB95 1x1 BG (HM) NI.23600.046 Foxconn Wireless LAN Atheros HB93 1x2 BGN (HM) Cable 50.
Chapter 6 157 42.S6802.004 HDD DOOR-BLACK 42.S6802.005 MINI CARD DOOR-BLACK 42.S6802.006 XD DUMMY CARD-BLACK HDD/Hard Disk Drive KH.16001.034 HDD SEAGA TE 2.5" 5400rpm 160GB ST9160310AS Crockett SA T A LF F/W:0303 KH.16001.042 HDD SEAGA T E 2.5" 5400rpm 160GB ST9160314AS Wyatt SA T A LF F/W:0001SDM1 KH.
158 Chapter 6 Keyboard KB.INT00.513 Keyboard 8KB-FV1 Black Macles In ternal S tandard 84KS Black US International KB.INT00.544 Keybo ard 8KB-FV1 Black Macles Intern al S t andard 84KS Black Arabic KB.INT00.543 Keybo ard 8KB-FV1 Black Macles Intern al S t andard 85KS Black Belgium KB.
Chapter 6 159 KB.INT00.516 Keybo ard 8KB-FV1 Black Macles Intern al S t andard 85KS Black T urkish KB.INT00.515 Keybo ard 8KB-FV1 Black Macles Intern al S t andard 85KS Black UK KB.INT00.514 Keybo ard 8KB-FV1 Black Macles Intern al S t andard 84KS Black US International w/ Hebrew KB.
160 Chapter 6 KN.2GB04.01 2 Memory MICRON SO-DIMM DDRII 800 2GB MT16HTF25664HY -800G1 LF 128* 8 0.065um KN.2GB09.00 5 Memory ELPIDA SO-D IMM DDRII 800 2GB EBE21UE8AFSA-8G-F LF 128*8 0.065um KN.2GB0B.01 8 Memory SAMSUNG SO-DIMM DDRII 800 2GB M470T5663EH3-CF7 LF 128* 8 0.
Chapter 6 161 Screw List Thermal Module 60.S6802.006 THERMAL MODULE S peaker R & L 23.S6802.001 SPEAKE R-R&L Miscellaneous 47.S6802.002 WLAN MYLAR 47.N9702.001 HINGE CAP MYL AR R - BLK eMachines 47.N9702.002 HINGE CAP MYL AR L - BLK eMachines 47.
Appendix A 164 Model Definition and Configuration Appendix A.
165 Appendix A eMachines eM250 Series Model eM250-01G16 RO Country Acer Part No Description Memory 1 HDD 1(GB) P A USA LU.N970 B.004 eM250-01G16i AOXPHeTUS1 UMACks 1*1G/160/ 6L2.2/5R/CBSD_bg_0.3D_GEk_FRB1LU SO1GBII6 N160GB5 .4KS P A USA LU.N970 B.003 eM250-01G16i AOXPHeTUS1 UMACks 1*1G/160/ 3L2.
Appendix A 166 AAP Philippin es LX.N970 C.009 eM250-01G16i LINPUSePH1 UMACks 1*1G/160/ BT/6L2.2/5R/CBSD_bg_0.3D_GEk_EN1 1 SO1GBII6 N 160GB5 .4KS EME A France LX.N970 B.012 eM250-01G16i AOXPHeTFR1 UMACks 1*1G/160/ 3L2.2/5R/CBSD_bg_0.3D_GEk_FR21 SO1GBII6 N160GB5 .
167 Appendix A EME A Switzerl and LX.N970 B.045 eM250-01G16i AOXPHeTCH1 UMACks 1*1G/160/ 3L2.2/5R/CBSD_bg_0.3D_GEk_IT41 SO1GBII6 N160GB5 .4KS EME A Middle East LX.N970 B.044 eM250-01G16i EM AOXPHeTME2 UMACks 1*1G/ 160/3L2.2/5R/CBSD_bg_0.3D_GEk_ES61 SO1GBII6 N160GB5 .
Appendix A 168 EME A Cyprus LX.N970 B.017 eM250-01G16i AOXPHeTCY1 UMACks 1*1G/160/ 3L2.2/5R/CBSD_bg_0.3D_GEk_ES61 SO1GBII6 N160GB5 .4KS EME A Eastern Europe LX.N970 B.015 eM250-01G16i AOXPHeTEU7 UMACks 1*1G/160/ 3L2.2/5R/CBSD_bg_0.3D_GEk_SL1 1 SO1GBII6 N160GB5 .
169 Appendix A EME A France LX.N970 D.024 eM250-01G16i SNW7ST32eTFR1 UMACks 1*1G/ 160/3L2.2/5R/CBSD_bg_0.3D_GEk_FR21 SO1GBII6 N160GB5 .4KS EME A Finland LX.N970 D.023 eM250-01G16i SNW7ST32eTFI2 UMACks 1*1G/ 160/3L2.2/5R/CBSD_bg_0.3D_GEk_FI1 1 SO1GBII6 N 160GB5 .
Appendix A 170 Model eM250-01G25i PA A C L A - Portugu ese LX.N970 B.002 eM250-01G16i EM AOXPHeTXC3 UMACks 1*1G/ 160/3L2.2/5R/CB_bg_0.3D_GEk_EN61 SO1GBII6 N160GB5 .4KS PA A C L A - Portugu ese LX.N970 C.006 eM250-01G16i LINPUSeXC2 UMACks 1*1G/160/ 3L2.
171 Appendix A Model eM250-02G16i Model eM250-02G25i RO Country Acer Part No Description Memory 1 HDD 1(GB) AAP India LX.N970 C.023 eM250-02G16i LINPUSeIN1 UMACks 1*2G/160/ 6L2.6/5R/CBSD_bg_0.3D_GEk_EN1 1 SO2GBII6 N160 GB5 .4KS AAP India LX.N970 C.022 eM250-02G16i LINPUSeIN1 UMACks 1*2G/160/ 6L2.
Appendix A 172.
Appendix B 173 Test Compatible Components This computer ’s compat ibility is tested and verified by Acer ’s internal testing department. All of it s system functions are tested under Windows ® 7 with backwards compatibility to Wind ows ® XP .
174 Appendix B Windows 7 Environment Test V endor Ty p e De scription Item No. 3G G TM380E 3G G TM380E LC.21300.004 UNDP-1 3G UNDP-1 LC.21300.005 Option G TM382E Option 3G G TM382EL LC.21300.007 G TM380E 3G G TM380E LC.21300.004 UNDP-1 3G UNDP-1 LC.21300.
Appendix B 175 SIMPLO 3CELL2.2 Battery SIMPLO UM-2008A Li-Ion 3S1P SAMSUNG 3 cell 2200mAh Main COMMON 2.2(F), black, n ew fu se BT .00307.006 SIMPLO 3CELL2.2 Battery SIMPLO UM-2008AW Li-Ion 3S1P SAMSUNG 3 cell 2200mAh Main COMMON 2.2 (F), wh ite, new fuse (NEC) BT .
176 Appendix B Camera Suyin 0.3M LDV Su yin Camera Rosa AM.21400.030 Liteon 0.3M LDV Liteon Camera Lily AM.21400.031 Card Reader 5 in 1-Build in 5 in 1-Build in MS, MS Pro, SD, SC, XD CR.21500.013 CPU INTEL A TMN270B CPU Intel Atom N270 1.6G 5 12K 533 2.
Appendix B 177 SAMSUNG SO512MBII 6 Memory SAMSUNG SO-DIMM DDRII 667 512MB M470T6464QZ 3-CE6 LF KN.5120B.026 HYNIX SO512MBII 6 Memory HYNIX SO-DIMM DDRII 667 512MB HYMP164S64CP6-Y5 LF 64*16 0.065um KN.5120G .024 NANY A SO1GBII6 Memory NANY A SO-DIMM DDRII 667 1GB NT1G T64UH8D0F N-3C LF 64 *16 0.
178 Appendix B NANY A SO1GBII6 Memory NANY A SO-DIMM DDRII 667 1GB NT1G T64UH8D0F N-3C LF 64 *16 0.07um KN.1GB03.026 MICRON SO1GBII6 Memory MICR ON SO-DIMM DDRII 667 1GB MT8HTF12864HDY -667G1 LF 64* 16 0.065um KN.1GB04.010 ELPIDA SO1GBII6 Memory ELPIDA SO-DIMM DDRII 667 1GB EBE1 1UE6AESA-6E-F LF 64*16 0.
Appendix B 179 ELPIDA SO1GBII6 Memory ELPIDA SO-DIMM DDRII 667 1GB EBE1 1UE6AESA-6E-F LF 64*16 0.065um KN.1GB09.010 SAMSUNG SO1GBII6 Memory SAM SUNG SO-DIMM DDRII 667 1GB M470T2864EH3-CE6 LF 64* 16 0.055um KN.1GB0B.027 HYNIX SO1GBII6 Memory HYNIX SO-DIMM DDRII 667 1GB HMP1 12S6EFR6C-Y5 LF 64*16 0.
180 Appendix B.
Appendix C 181 Online Support Information This section describe s online techni cal support services a vailable to help you repair your Acer Systems. If you are a distributor , dealer , ASP or TPM, please re fer your technical queries to your local Acer branch office.
182 Appendix C.
183 Numerics 3G Cover Removing 41 Replacing 117 3G Module Removing 46 Replacing 113 A AC Power Jack Removing 74 Replacing 96 Antennas Removing 83 Replacing 86 B Battery Pack Removing 40 Replacing 118 .
184 Top View 143 K Keyboard Removing 49 Replacing 113 Keyboard Failure 123 L LCD Bezel Removing 76 Replacing 95 LCD Brackets Removing 81 Replacing 89 LCD Cable Removing 81 Replacing 89 LCD Failure 123.
185 hotkey 11 T ouch Pad Failure 124 T ouchPad FFC Removing 58 Replacing 106 T roublesho oting Built-in KB Failure 123 Internal Micr ophone 127 Internal Speakers 125 LCD Failure 123 No Display 121 ODD.
186.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il Acer EM250 è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Acer EM250 - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Acer EM250 imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Acer EM250 ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Acer EM250, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Acer EM250.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Acer EM250. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Acer EM250 insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
