Manuale d’uso / di manutenzione del prodotto 945GC del fabbricante Intel
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Document Number: 307504-004 Intel ® 945G/945GZ/945GC/ 945P/945PL Express Chipset Family Thermal and Mechanical De sign Guidelines (TMDG) - For the Intel ® 82945G/82945GZ/82945GC Graphics Memory Cont.
2 Thermal and Mechanical Design Guidelines INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS . NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
Thermal and Mechanical Design Guidelines 3 Contents 1 Introduc tion ..................................................................................................... 7 1.1 Terminology ...............................................................
4 Thermal and Mechanical Design Guidelines Figures Figure 1. (G)MCH Non-Grid Array ...................................................................... 12 Figure 2. 0° Angle Attach Method ology (top view, not to scale)..............................
Thermal and Mechanical Design Guidelines 5 Revision History Revision Number Description Date -001 • Initial Rel ease May 2005 -002 • Added Intel ® 82945PL specific ations October 2005 -003 • Ad.
6 Thermal and Mechanical Design Guidelines.
Introduction Thermal and Mechanical Design Guidelines 7 1 Introduction As the complexity of computer systems increases, so do power dissi pati on requirements.
Introduction 8 Thermal and Mechanical Design Guidelines 1.1 Terminology Term Description BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted and bonded. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound.
Introduction Thermal and Mechanical Design Guidelines 9 1.2 Reference Documents Document Comments Intel ® 945G/945GZ/945P/945PL Express Chi pset Family Datasheet http://developer.intel.com/des ign/chipset s/datashts/307502. htm Intel ® I/O Controller Hub 7 (ICH7) Datasheet http://developer.
Introduction 10 Thermal and Mechanical Design Guidelines.
Product Specifications Thermal and Mechanical Design Guidelines 11 2 Product Specifications This ch apter p rovide s the pa ckage d escrip tion and loading specific ations. T he chap ter also provid es compon ent therma l specificat ions and th ermal desig n power de scriptions for the (G)MCH.
Product Specifications 12 Thermal and Mechanical Design Guidelines Figure 1. (G)MCH Non-Grid Array 2.2 Package Loading Specifications Table 1 provides static lo ad spec ifications fo r the chip set pa ckage. T his mechan ical maximum load limit sh ould not be e xceeded during heat sink assembly, s hipping conditions, or standard use conditions.
Product Specifications Thermal and Mechanical Design Guidelines 13 2.3 Thermal Specifications To ensur e proper operation a nd reliabilit y of the (G) MCH, the temp erature mu st be at or below th e maximum value sp ecified in Table 2.
Product Specifications 14 Thermal and Mechanical Design Guidelines 2.4.1 Methodology 2.4.1.1 Pre-Silicon To dete rmine TDP for pre-silic on produ cts in deve lopment, it is necessa ry to make estimates b ased on a nalytical models.
Thermal Metrology Thermal and Mechanical Design Guidelines 15 3 Thermal Metrology The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established gui del ines for proper techniques of measuring (G)MCH component case temperatures.
Thermal Metrology 16 Thermal and Mechanical Design Guidelines Figure 2. 0° Angle Attach Methodology (top view, not to scale) Figure 3. 0° Angle Attach Heatsink Modifi cations (generic heatsink side and bottom view shown, not to scale) 3.
Thermal Metrology Thermal and Mechanical Design Guidelines 17 Figure 4. Airflow Temperature Measurement Locations Airflow velocity should be me asured u sing industry standard air velocity sensors. Typical airflow sensor technol ogy may include hot wire anemometers.
Thermal Metrology 18 Thermal and Mechanical Design Guidelines.
Reference Thermal Solution Thermal and Mechanical Design Guidelines 19 4 Reference Thermal Solution The reference component thermal solution fo r the (G)MCH for ATX platforms uses two ramp retainers, a wire preload cli p, and four custom MB anchors.
Reference Thermal Solution 20 Thermal and Mechanical Design Guidelines Figure 5. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an ATX Platform Proc _HS_Orient_ATX Airflow Dir.
Reference Thermal Solution Thermal and Mechanical Design Guidelines 21 Figure 6. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform Top Vi ew Balanced Tec hnol ogy Extende d (BTX ) Th ermal Mo d ule As s e mbly Ov er Process or (G)MCH Airf low D irection Proc _HS_O ri ent 4.
Reference Thermal Solution 22 Thermal and Mechanical Design Guidelines Figure 7. ATX GMCH Heatsink Installed on Board.
Reference Thermal Solution Thermal and Mechanical Design Guidelines 23 Figure 8. Balanced Technology Extended (BTX) GMCH Heatsink Installed on Board.
Reference Thermal Solution 24 Thermal and Mechanical Design Guidelines 4.4 Environmental Reliability Requirements The envir onmental r eliability re quiremen ts for the referenc e thermal s olution are shown in Table 4. These s hould be conside red as genera l guidelin es.
Enabled Suppliers Thermal and Mechanical Design Guidelines 25 Appendix A Enabled Suppliers Current suppliers for the Intel ® 945G/945GZ/945GC/945P/945PL Express chipset (G)MCH re ference thermal solu tion are list ed in Table 5 and Table 6.
Enabled Suppliers 26 Thermal and Mechanical Design Guidelines Table 6. (G)MCH Balanced Technology Extended (BTX) Intel Reference Heatsink Enabled Suppliers Supplier Intel Part Number Vendor Part Number Contact Information CCI (Chaun Choung Technology Corp.
Mechanical Drawings Thermal and Mechanical Design Guidelines 27 Appendix B Mechanical Drawings The following table list s the mec hanical dra wings availab le in this do cument.
Mechanical Drawings s 28 Thermal and Mechanical Design Guidelines Figure 9. (G)MCH Package Drawing.
Mechanical Drawings Thermal and Mechanical Design Guidelines 29 Figure 10. (G)MCH Component Keep-Out Restrictions for ATX Platf orms 8X PLATED THR U H O LE 8X 1.42[.056] T RA CE K E E P OUT 0.97 .038 [] 4 .1575 [] 74 2.9134 [] 47 1.85 [] 60.92 2.398 [] 4X 8 .
Mechanical Drawings s 30 Thermal and Mechanical Design Guidelines Figure 11. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms 4X 8. 76 .3 4 5 [] 4X 4. 19 .1 6 5 [] 4X 1. 85 . 073 [] 4X 5. 08 .2 0 0 [] 4X 2. 1 . 08 3 [] 8X P L A T E D T HRU HO L E 0.
Mechanical Drawings Thermal and Mechanical Design Guidelines 31 Figure 12. (G)MCH Reference Heatsink for ATX Platf orms – Sheet 1 2 X 58. 6 2.307 [] 2X 80 3. 150 [] 47 1.850 [] 36 1.417 [] 8X 2 . 7 0. 15 .1 0 6 .005 [] 7X E Q U A L SP A CING T YP 6 3.
Mechanical Drawings s 32 Thermal and Mechanical Design Guidelines Figure 13. (G)MCH Reference Heatsink for ATX Platf orms – Sheet 2 2X 6 0.6 .0 2 4 [] TYP 6 2.75 0. 1 .108 . 003 [] 6 1. 5 0. 15 . 059 .00 5 [] 6 6. 72 0.15 . 265 .005 [] R0 . 5 .02 0 [] 2X 15 .
Mechanical Drawings Thermal and Mechanical Design Guidelines 33 Figure 14. (G)MCH Reference Heatsink for ATX Platf orms – A nchor 6 5. 21 0. 12 .20 5 . 004 [] 4X 6 7. 83 0.12 .30 8 . 004 [] 2X 10. 13 0. 12 .3 9 9 .004 [] 2X 6 0.77 0.1 .03 0 . 003 [] 7.
Mechanical Drawings s 34 Thermal and Mechanical Design Guidelines Figure 15. (G)MCH Reference Heatsink for ATX Platf orms – R amp Retainer Sheet 1 2X 31.1 1.225 [] 6 2 0.05 .0 7 9 .0 01 [] 6 61. 51 2.422 [] 6 70.49 2. 775 [] 2X 27.95 1.1 00 [] 3 .11 8 [] NOT ES: 1.
Mechanical Drawings Thermal and Mechanical Design Guidelines 35 Figure 16. (G)MCH Reference Heatsink for ATX Platf orms – R amp Retainer Sheet 2 B B 6 1. 75 .06 9 [] 2.7 5 .108 [] 6 0.5 .02 0 [] 4 .15 7 [] 6 5. 56 . 219 [] 2X 6 2.9 . 114 [] 6.4 . 252 [] 6 3.
Mechanical Drawings s 36 Thermal and Mechanical Design Guidelines Figure 17. (G)MCH Reference Heatsink fo r ATX Platforms – Wire Preload Clip A A A A 46. 6 0. 5 1. 8 3 5 .0 19 [] 2X 90 TYP R 1 . 8 .07 1 [] 19.3 0. 5 .76 0 .0 19 [] 27.3 0. 5 1.075 .01 9 [] 4 27.
Mechanical Drawings Thermal and Mechanical Design Guidelines 37 Figure 18. (G)MCH Reference Heatsink for Bala nced Technology Extended (BTX) Platforms A 24.2 .953 [] 47.8 8 1.885 [] 15 X EQ U AL SPAC ES () 1.94 .08 [] 2X 1.17 .046 [] 3.4 0. 2 .134 .007 [] () 15 .
Mechanical Drawings s 38 Thermal and Mechanical Design Guidelines Figure 19. (G)MCH Reference Heatsink for Balanced Technology Extended (BTX) Platforms – Clip A A A A B B 2X 90 27. 3 1. 075 [] 47. 36 1. 865 [] R TYP 1. 3 . 051 [] 8. 87 1. 25 .3 4 9 .
Mechanical Drawings Thermal and Mechanical Design Guidelines 39 Figure 20. (G)MCH Reference Heatsink for Balanced Tec hnology Extended (BTX) Platforms – Heatsink Assembly () 55.88 2.200 [] C () 33 1.299 [] B () 19 .748 [] () 19 .748 [] N O TES: 1 . THIS DRAWIN G TO BE USE D IN C O NJ UN CT IO N WITH SUP P L IED 3 D DATABASE F I L E.
Un punto importante, dopo l’acquisto del dispositivo (o anche prima di acquisto) è quello di leggere il manuale. Dobbiamo farlo per diversi motivi semplici:
Se non hai ancora comprato il Intel 945GC è un buon momento per familiarizzare con i dati di base del prodotto. Prime consultare le pagine iniziali del manuale d’uso, che si trova al di sopra. Dovresti trovare lì i dati tecnici più importanti del Intel 945GC - in questo modo è possibile verificare se l’apparecchio soddisfa le tue esigenze. Esplorando le pagine segenti del manuali d’uso Intel 945GC imparerai tutte le caratteristiche del prodotto e le informazioni sul suo funzionamento. Le informazioni sul Intel 945GC ti aiuteranno sicuramente a prendere una decisione relativa all’acquisto.
In una situazione in cui hai già il Intel 945GC, ma non hai ancora letto il manuale d’uso, dovresti farlo per le ragioni sopra descritte. Saprai quindi se hai correttamente usato le funzioni disponibili, e se hai commesso errori che possono ridurre la durata di vita del Intel 945GC.
Tuttavia, uno dei ruoli più importanti per l’utente svolti dal manuale d’uso è quello di aiutare a risolvere i problemi con il Intel 945GC. Quasi sempre, ci troverai Troubleshooting, cioè i guasti più frequenti e malfunzionamenti del dispositivo Intel 945GC insieme con le istruzioni su come risolverli. Anche se non si riesci a risolvere il problema, il manuale d’uso ti mostrerà il percorso di ulteriori procedimenti – il contatto con il centro servizio clienti o il servizio più vicino.
